LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Low power consumption.
* High efficiency.
* Versatile mounting on p.c. board or panel.
* I.C. compatible/low current requirement.
* T-1
3/4
type package.
Package Dimensions
Part No.
LTL2P7UBK-0G1A
Lens
Water Clear
Source Color
Blue
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
Part No. : LTL2P7UBK-0G1A
BNS-OD-C131/A4
Page :
1
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at T
A
=25℃
Parameter
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Derating Linear From 30°C
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
[1.6mm(.063") From Body]
Maximum Rating
135
70
30
0.5
5
-20°C to + 80°C
-30°C to + 100°C
260°C for 5 Seconds
Unit
mW
mA
mA
mA/°C
V
Part No. : LTL2P7UBK-0G1A
BNS-OD-C131/A4
Page :
2
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at T
A
=25℃
Parameter
Luminous Intensity
Viewing Angle
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Reverse Current
Symbol
I
V
2θ
1/2
λ
P
λ
d
∆λ
V
F
I
R
Min.
34
Typ.
80
30
Max.
Unit
mcd
deg
nm
nm
nm
4.5
100
V
µA
I
F
= 20mA
V
R
= 5V
Test Condition
I
F
= 20mA
Note 1,5
Note 2 (Fig.6)
Measurement
@Peak (Fig.1)
Note 3
428
466
65
3.8
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2.
θ
1/2
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength,
λd
is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. Iv classification code is marked on each packing bag.
5. The Iv guarantee should be added ±15
﹪
tolerance.
6. Precautions in handling:
•
When soldering, leave 2mm of minimum clearance from the resin to the soldering point.
•
Dipping the resin to solder must be avoided.
•
Correcting the soldered position after soldering must be avoided.
•
In soldering, do not apply any stress to the lead frame particularly when heated.
•
When forming a lead, make sure not to apply any stress inside the resin.
•
Lead forming must be done before soldering.
•
It is necessary to cut the lead frame at normal temperature.
7. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.
Part No. : LTL2P7UBK-0G1A
BNS-OD-C131/A4
Page :
3
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical Electrical / Optical Characteristics Curves
(25
℃
Ambient Temperature Unless Otherwise Noted)
Part No. : LTL2P7UBK-0G1A
BNS-OD-C131/A4
Page :
4
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Compatible with radial lead automatic insertion equipment.
* Most radial lead plastic lead lamps available packaged in tape and folding.
* 5mm (0.197") formed lead spacing available.
* Folding packaging simplifies handling and testing.
Reel packaging is available by removing suffix “A” on option.
Package Dimensions
Specification
Item
Tape Feed Hole Diameter
Component Lead Pitch
Front to Rear Deflection
Height of Seating Plane
Feed Hole to Bottom of Component
Seating Plane to Top of Component
Lead Length After Component Height
Feed Hole Pitch
Lead Location
Center of Component Location
Total Tape Thickness
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
Part No. : LTL2P7UBK-0G1A
BNS-OD-C131/A4
Symbol
D
F
△H
H
H1
H3
L
P
P1
P2
T
W0
W1
W2
W3
Minimum
mm
3.8
4.8
--
15.5
20.0
13.2
W0
12.4
3.15
5.05
--
8.5
14.5
0
17.5
0.488
0.124
0.198
--
0.334
0.571
0
0.689
Page :
5
inch
0.149
0.188
--
0.610
0.787
0.519
Maximum
mm
4.2
5.8
2.0
16.5
22.0
14.2
11.0
13.0
4.55
7.65
0.90
9.75
15.5
3.0
19.0
of
inch
0.165
0.228
0.078
0.649
0.866
0.559
0.433
0.511
0.179
0.301
0.035
0.384
0.610
0.118
0.748
11
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
