BK90 SERIES
DATA SHEET
R-LINE DEVICES – BK90 SERIES
FEATURE
Radial leaded devices.
Typical application in electronic ballast
Available in lead-free version.
No epoxy coating.
PACKAGE DIMENSIONS
D
E
F
DI
Part Number
BK90-150
BK90-200
BK90-250
BK90-350
BK90-550
BK90-750
BK90-900
A
Max.
4.8
5.4
6.2
7.8
9.7
11.2
12.8
B
Max.
12.7
13.0
13.7
14.5
15.8
18.0
19.6
C
±0.6
D
Max.
3.0
3.0
3.0
3.0
3.0
3.0
3.0
E
Typ.
0.6
0.6
0.6
0.6
0.6
0.6
0.6
F
Min.
7.6
7.6
7.6
7.6
7.6
7.6
7.6
5.1
5.1
5.1
5.1
5.1
5.1
5.1
Revision:17-May-12
www.brightking.com
BK90 SERIES
ELECTRICAL CHARACTERISTICS
I
H
(A)
0.15
0.20
0.25
0.35
0.55
0.75
0.90
Part Number
BK90-150
BK90-200
BK90-250
BK90-350
BK90-550
BK90-750
BK90-900
V
MAX
(V)
90
90
90
90
90
90
90
I
MAX
(A)
20
20
20
20
20
20
20
R
MAX
( )
3.00
2.50
2.00
1.20
0.90
0.60
0.50
R
MIN
( )
1.50
1.00
0.80
0.60
0.35
0.20
0.10
Pd
typ.
(W)
1.65
1.70
1.75
1.80
2.00
2.50
3.00
I
H
=Hold current: maximum current at which the device will not trip at 25 still air.
V
MAX
=Maximum voltage device can withstand without damage at rated current.
I
MAX
=Maximum fault current device can withstand without damage at rated voltage.
R
MAX
=Maximum device resistance at 25 prior to tripping.
R
MIN
=Minimum device resistance at 25 prior to tripping.
Pd
typ
=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
THERMAL DERATING CHART - I
H
(A)
Maximum Ambient Operating Temperatures (
-20
0.204
0.272
0.340
0.476
0.748
1.020
1.244
0
0.179
0.238
0.298
0.417
0.655
0.893
1.071
25
0.150
0.200
0.250
0.350
0.550
0.750
0.900
30
0.138
0.184
0.230
0.322
0.506
0.690
0.828
40
0.122
0.162
0.203
0.284
0.446
0.608
0.729
50
0.108
0.144
0.180
0.252
0.396
0.540
0.648
60
0.095
0.126
0.158
0.221
0.347
0.473
0.567
Part Number
BK90-150
BK90-200
BK90-250
BK90-350
BK90-550
BK90-750
BK90-900
)
70
0.081
0.108
0.135
0.189
0.297
0.405
0.486
85
0.060
0.080
0.100
0.140
0.220
0.300
0.360
Revision:17-May-12
www.brightking.com
BK90 SERIES
TEST PROCEDURES AND REQUIREMENT
Test
Resistance
Time to Trip
Hold Current
Trip Cycle Life
Trip Endurance
Test Conditions
In still air @25
Specified current,V
max
,25
60 min, at I
H
V
max
, I
max
,100 cycles
V
max
,24hours
Accept/Reject Criteria
R
min
T
R
R
max
max. Time to trip(T
tirp
)
No trip
No arcing or burning
No arcing or burning
TYPICAL TIME-TO-TRIP CHARTS @ 25
1000
A BC
D E
F
100
Time-to-trip (s)
10
Time-to-trip (S)
1
A = BK90-200
B = BK90-250
C = BK90-350
D = BK90-550
E = BK90-750
F = BK90-900
0.1
0.01
F
E
D
C
B
A
1E-3
0.1
1
Fault Current (A)
10
100
Fault current (A)
STORAGE RECOMMENDATIONS
1. Storage Temperature : -10
°C
~+40
°C
2. Relative Humidity :
80%RH
3. Keep away from corrosive atmosphere and sunlight.
4. Period of Storage: 1 year.
Revision:17-May-12
www.brightking.com
BK90 SERIES
WAVE
SOLDERING RECOMMENDATION PARAMETERS
300
3-5S
Soldering
250
Temperature (°C)
200
150
245°C 260°C
Pre-heating
100
°C
130
°C
100
50
0
0
50
100
Time(s)
150
200
250
Cooling
Items
Pre-Heating Zone
Soldering Zone
Cooling Zone
Conditions
Refer to the condition recommended by the flux manufacturer. Maximum
ramping rate should not exceed 4 /sec.
Maximum solder temperature should not exceed 260
Forced cooling
MANUAL SOLDERING RECOMMENDATION PARAMETERS
Items
Soldering condition
Conditions
The most highest power of the manual soldering electric iron should be 30W or
lower than that, soldering temperature should not be higher than 280 .
The soldering time should be within 3 seconds, or it may lead to the envelope
layer cracking, resistance getting bigger.
The soldering position should be controlled distance sea1de feet 4mm above.
The iron soldering head can’t touch the body of the product except the lead wire.
In the conditions of meeting soldering effect of the product, the soldering lower
temperature, nearest distance from the soldering position to chip and less
soldering time will make the soldering better.
Soldering time
Soldering position
Other
Notes: 1. Before using the device must be stored in the original bags, if the storage conditions do not
guarantee, the device may not be able to meet the given value.
2. The devices can't used for reflow soldering.
Revision:17-May-12
www.brightking.com