NAND Gate, LS Series, 4-Func, 2-Input, TTL, CQCC20
参数名称 | 属性值 |
包装说明 | , |
Reach Compliance Code | unknown |
系列 | LS |
JESD-30 代码 | S-CQCC-N20 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NAND GATE |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
最大电源电流(ICC) | 4.4 mA |
传播延迟(tpd) | 26 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子位置 | QUAD |
Base Number Matches | 1 |
54LS00/B2A | 54LS00/BCA | 54LS00/BDA | 54S00/BDA | 5400/BDA | 54S00/BCA | 54S00/B2A | 5400/BCA | |
---|---|---|---|---|---|---|---|---|
描述 | NAND Gate, LS Series, 4-Func, 2-Input, TTL, CQCC20 | NAND Gate, LS Series, 4-Func, 2-Input, TTL, CDIP14 | NAND Gate, LS Series, 4-Func, 2-Input, TTL, CDFP14 | NAND Gate, S Series, 4-Func, 2-Input, TTL, CDFP14 | NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDFP14 | NAND Gate, S Series, 4-Func, 2-Input, TTL, CDIP14 | NAND Gate, S Series, 4-Func, 2-Input, TTL, CQCC20 | NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDIP14 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
系列 | LS | LS | LS | S | TTL/H/L | S | S | TTL/H/L |
JESD-30 代码 | S-CQCC-N20 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | R-CDFP-F14 | R-CDIP-T14 | S-CQCC-N20 | R-CDIP-T14 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 14 | 14 | 14 | 14 | 14 | 20 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE |
最大电源电流(ICC) | 4.4 mA | 4.4 mA | 4.4 mA | 36 mA | 22 mA | 36 mA | 36 mA | 22 mA |
传播延迟(tpd) | 26 ns | 26 ns | 26 ns | 9 ns | 25 ns | 9 ns | 9 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | NO | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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