UART Interface IC I2C/SPI-UARTBRIDGE W/IRDA AND GPIO
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | TSSOP |
包装说明 | TSSOP, TSSOP24,.25 |
针数 | 24 |
Reach Compliance Code | compliant |
其他特性 | CAN ALSO OPERATES AT 2.5 V SUPPLY |
地址总线宽度 | 2 |
边界扫描 | NO |
最大时钟频率 | 80 MHz |
通信协议 | ASYNC, BIT |
数据编码/解码方法 | NRZ |
最大数据传输速率 | 0.625 MBps |
外部数据总线宽度 | |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 7.8 mm |
低功率模式 | YES |
湿度敏感等级 | 1 |
串行 I/O 数 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP24,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 4.4 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches | 1 |
SC16IS750IPW | SC16IS750IBS | SC16IS760IBS | SC16IS750IBS-S | SC16IS760IPW-F | SC16IS740IPW-F | SC16IS760IBS-F | |
---|---|---|---|---|---|---|---|
描述 | UART Interface IC I2C/SPI-UARTBRIDGE W/IRDA AND GPIO | UART Interface IC I2C/SPI-UARTBRIDGE W/IRDA AND GPIO | UART Interface IC I2C/SPI-UARTBRIDGE W/IRDA AND GPIO | UART Interface IC UART I2C/SPI | UART Interface IC I2C/SPI-UARTBRIDGE W/IRDA AND GPIO | UART Interface IC I2C/SPI-SLAVEBRIDGE W/IRDA | UART Interface IC I2C/SPI-UARTBRIDGE W/IRDA AND GPIO |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | unknown | unknown |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | - |
包装说明 | TSSOP, TSSOP24,.25 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN-24 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN-24 | - | - | - | QCCN, LCC24,.16SQ,20 |
JESD-30 代码 | R-PDSO-G24 | S-PQCC-N24 | S-PQCC-N24 | - | - | - | S-PQCC-N24 |
端子数量 | 24 | 24 | 24 | - | - | - | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | - | - | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY |
封装代码 | TSSOP | HVQCCN | HVQCCN | - | - | - | QCCN |
封装等效代码 | TSSOP24,.25 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | - | - | - | LCC24,.16SQ,20 |
封装形状 | RECTANGULAR | SQUARE | SQUARE | - | - | - | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | - | CHIP CARRIER |
电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - | - | - | 2.5/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified |
表面贴装 | YES | YES | YES | - | - | - | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | - | INDUSTRIAL |
端子形式 | GULL WING | NO LEAD | NO LEAD | - | - | - | NO LEAD |
端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | - | - | - | 0.5 mm |
端子位置 | DUAL | QUAD | QUAD | - | - | - | QUAD |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | - | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | 1 |
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