Latches Obsolete; Replace with MIC5842YWM (RoHS)
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP18,.4 |
| 针数 | 18 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 内置保护 | TRANSIENT |
| 驱动器位数 | 8 |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G18 |
| JESD-609代码 | e0 |
| 长度 | 11.55 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SINK |
| 最大输出电流 | 0.35 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP18,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5/12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 | 12 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| MIC5842BWM | MIC5841BWM-TR | MIC5842YV | MIC5841BWM | MIC5841YN | MIC5841YWM | MIC5842BV | MIC5841YV-TR | MIC5842YN | MIC5842YWM-TR | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Latches Obsolete; Replace with MIC5842YWM (RoHS) | Latches 8-Bit Serial-in Latched Driver, Diodes | High Speed Operational Amplifiers Prec High-Speed Difet Oper Amp | Latches 8-Bit Serial-in Latched Driver, Diodes | Latches 8-Bit Serial-in Latched Driver, Diodes | Latches Obsolete; Replace with MIC5842YV (RoHS) | Latches | USB Interface IC USB to Serial UART IC LQFP-32 | RF Adapters - Between Series ADAPTER,BNC FEMALE TO DOUBLE BAN PLUG | |
| 是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 符合 | 符合 | 不符合 | - | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | - | Microchip(微芯科技) |
| 包装说明 | SOP, SOP18,.4 | - | QCCJ, | SOP, SOP18,.4 | DIP, | SOP, | QCCJ, | - | DIP, | SOP, |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant | compliant | - | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 内置保护 | TRANSIENT | - | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT | - | TRANSIENT | TRANSIENT |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER | - | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | - | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G18 | - | S-PQCC-J20 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 | S-PQCC-J20 | - | R-PDIP-T18 | R-PDSO-G18 |
| JESD-609代码 | e0 | - | e3 | e0 | e3 | e3 | e0 | - | e3 | e3 |
| 长度 | 11.55 mm | - | 8.94 mm | 11.55 mm | - | 11.55 mm | 8.94 mm | - | - | 11.55 mm |
| 湿度敏感等级 | 1 | - | 2 | 1 | - | 2 | 1 | - | - | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 18 | - | 20 | 18 | 18 | 18 | 20 | - | 18 | 18 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出电流流向 | SINK | - | SINK | SINK | SINK | SINK | SINK | - | SINK | SINK |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | QCCJ | SOP | DIP | SOP | QCCJ | - | DIP | SOP |
| 封装形状 | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | - | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 | - | 260 | 240 | 260 | 260 | 240 | - | 260 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | - | 4.57 mm | 2.65 mm | 3.937 mm | 2.65 mm | 4.57 mm | - | 3.937 mm | 2.65 mm |
| 最大供电电压 | 12 V | - | 12 V | 12 V | 12 V | 12 V | 12 V | - | 12 V | 12 V |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | - | YES | YES | NO | YES | YES | - | NO | YES |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | TIN LEAD | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | - | J BEND | GULL WING | THROUGH-HOLE | GULL WING | J BEND | - | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | QUAD | DUAL | DUAL | DUAL | QUAD | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 40 | 30 | 40 | 40 | 30 | - | 40 | 40 |
| 宽度 | 7.5 mm | - | 8.94 mm | 7.5 mm | 7.62 mm | 7.5 mm | 8.94 mm | - | 7.62 mm | 7.5 mm |
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