型号 |
R8C26_10 |
R8C26 |
描述 |
16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32 |
16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32 |
外部数据总线宽度 |
0.0 |
0.0 |
输入输出总线数量 |
28 |
28 |
端子数量 |
32 |
32 |
最小工作温度 |
-20 Cel |
-20 Cel |
最大工作温度 |
85 Cel |
85 Cel |
线速度 |
20 MHz |
20 MHz |
加工封装描述 |
7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32 |
7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32 |
each_compli |
Yes |
Yes |
欧盟RoHS规范 |
Yes |
Yes |
状态 |
Active |
Active |
microprocessor_microcontroller_peripheral_ic_type |
MICROCONTROLLER |
MICROCONTROLLER |
ADC通道 |
YES |
YES |
地址总线宽度 |
0.0 |
0.0 |
位数 |
16 |
16 |
clock_frequency_max |
20 MHz |
20 MHz |
DAC通道 |
NO |
NO |
DMA通道 |
NO |
NO |
jesd_30_code |
S-PQFP-G32 |
S-PQFP-G32 |
jesd_609_code |
e6 |
e6 |
moisture_sensitivity_level |
3 |
3 |
包装材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
ckage_code |
LQFP |
LQFP |
ckage_equivalence_code |
QFP32,.35SQ,32 |
QFP32,.35SQ,32 |
包装形状 |
SQUARE |
SQUARE |
包装尺寸 |
FLATPACK, LOW PROFILE |
FLATPACK, LOW PROFILE |
eak_reflow_temperature__cel_ |
260 |
260 |
wer_supplies |
2.2/5.5 |
2.2/5.5 |
PWM通道 |
YES |
YES |
qualification_status |
COMMERCIAL |
COMMERCIAL |
m__bytes_ |
1536 |
1536 |
ROM编程 |
FLASH |
FLASH |
m__words_ |
32768 |
32768 |
seated_height_max |
1.7 mm |
1.7 mm |
sub_category |
Microcontrollers |
Microcontrollers |
额定供电电压 |
5 V |
5 V |
最小供电电压 |
3 V |
3 V |
表面贴装 |
YES |
YES |
工艺 |
CMOS |
CMOS |
温度等级 |
OTHER |
OTHER |
端子涂层 |
TIN BISMUTH |
TIN BISMUTH |
端子形式 |
GULL WING |
GULL WING |
端子间距 |
0.8000 mm |
0.8000 mm |
端子位置 |
QUAD |
QUAD |
ime_peak_reflow_temperature_max__s_ |
NOT SPECIFIED |
NOT SPECIFIED |
length |
7 mm |
7 mm |
width |
7 mm |
7 mm |
dditional_feature |
ALSO OPERATES AT 2.2V MINIMUM SUPPLY |
ALSO OPERATES AT 2.2V MINIMUM SUPPLY |
最大供电电压 |
5.5 V |
5.5 V |