型号 |
PIC18LF24J11-I/SS |
PIC18LF24J11-I/ML |
PIC18LF24J11-I/SO |
PIC18LF24J11-I/SP |
描述 |
8-bit Microcontrollers - MCU 16KB Flash 4KBRAM 12MIPS nanoWatt |
8位微控制器 -MCU 16KB Flash 4KBRAM 12MIPS nanoWatt |
8位微控制器 -MCU 16KB Flash 4KBRAM 12MIPS nanoWatt |
8位微控制器 -MCU 16KB Flash 4KBRAM 12MIPS nanoWatt |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Microchip(微芯科技) |
Microchip(微芯科技) |
Microchip(微芯科技) |
Microchip(微芯科技) |
零件包装代码 |
SSOP |
QFN |
SOIC |
DIP |
包装说明 |
SSOP, SSOP28,.3 |
6 X 6 MM, 0.55 MM, LEAD FREE, PLASTIC, QFN-28 |
7.5 MM HEIGHT, LEAD FREE, PLASTIC, SOIC-28 |
0.300 INCH, LEAD FREE, PLASTIC, DIP-28 |
针数 |
28 |
28 |
28 |
28 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
8 weeks |
13 weeks |
22 weeks |
4 weeks |
具有ADC |
YES |
YES |
YES |
YES |
其他特性 |
ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ |
ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ |
ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ |
ALSO OPERATES AT 2 V MINIMUM SUPPLY AT 8 MHZ |
位大小 |
8 |
8 |
8 |
8 |
CPU系列 |
PIC |
PIC |
PIC |
PIC |
最大时钟频率 |
48 MHz |
48 MHz |
48 MHz |
48 MHz |
DAC 通道 |
NO |
NO |
NO |
NO |
DMA 通道 |
YES |
YES |
YES |
YES |
JESD-30 代码 |
R-PDSO-G28 |
S-PQCC-N28 |
R-PDSO-G28 |
R-PDIP-T28 |
JESD-609代码 |
e3 |
e3 |
e3 |
e3 |
长度 |
10.2 mm |
6 mm |
17.9 mm |
34.671 mm |
I/O 线路数量 |
23 |
23 |
23 |
23 |
端子数量 |
28 |
28 |
28 |
28 |
片上程序ROM宽度 |
16 |
16 |
16 |
16 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM 通道 |
YES |
YES |
YES |
YES |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SSOP |
HVQCCN |
SOP |
DIP |
封装等效代码 |
SSOP28,.3 |
LCC28,.24SQ,25 |
SOP28,.4 |
DIP28,.3 |
封装形状 |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
IN-LINE |
峰值回流温度(摄氏度) |
260 |
260 |
250 |
NOT APPLICABLE |
电源 |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM(字节) |
3776 |
3776 |
3776 |
3776 |
ROM(单词) |
8192 |
8192 |
8192 |
8192 |
ROM可编程性 |
FLASH |
FLASH |
FLASH |
FLASH |
座面最大高度 |
2 mm |
1 mm |
2.65 mm |
5.08 mm |
速度 |
48 MHz |
48 MHz |
48 MHz |
48 MHz |
最大压摆率 |
15.2 mA |
15.2 mA |
15.2 mA |
15.2 mA |
最大供电电压 |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
最小供电电压 |
2 V |
2 V |
2 V |
2 V |
标称供电电压 |
3 V |
3 V |
3 V |
3 V |
表面贴装 |
YES |
YES |
YES |
NO |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
MATTE TIN |
端子形式 |
GULL WING |
NO LEAD |
GULL WING |
THROUGH-HOLE |
端子节距 |
0.65 mm |
0.65 mm |
1.27 mm |
2.54 mm |
端子位置 |
DUAL |
QUAD |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
40 |
40 |
40 |
NOT APPLICABLE |
宽度 |
5.3 mm |
6 mm |
7.5 mm |
7.62 mm |
uPs/uCs/外围集成电路类型 |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |
湿度敏感等级 |
1 |
1 |
1 |
- |