型号 |
OMAP3525DZCBC |
OMAP3525DZCBCA |
OMAP3525EZCBC |
OMAP3525EZCBCA |
OMAP3530DZCBB |
OMAP3530DZCBBA |
OMAP3530EZCBB |
OMAP3530EZCBBA |
描述 |
Processors - Application Specialized Applications Proc |
Processors - Application Specialized HiRel and OMAP3525 |
OMAP3525-HiRel Applications Processor 515-POP-FCBGA -40 to 90 |
OMAP3525-HiRel Applications Processor 515-POP-FCBGA -40 to 105 |
Processors - Application Specialized OMAP3530-HiRel OMAP 3525-HiRel App Proc |
Processors - Application Specialized HiRel and OMAP3525 |
OMAP3530-HiRel Applications Processor 515-POP-FCBGA 0 to 90 |
OMAP3530-HiRel Applications Processor 515-POP-FCBGA -40 to 105 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
包装说明 |
0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-515 |
VFBGA, BGA515,26X26,20 |
VFBGA, BGA515,26X26,20 |
VFBGA, BGA515,26X26,20 |
0.40 MM PITCH, GREEN, PLASTIC, BGA-515 |
0.40 MM PITCH, GREEN, PLASTIC, BGA-515 |
VFBGA, BGA515,28X28,16 |
VFBGA, BGA515,28X28,16 |
针数 |
515 |
515 |
515 |
515 |
515 |
515 |
515 |
515 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
ECCN代码 |
3A001.A.3 |
3A001.A.3 |
3A991.A.2 |
3A991.A.2 |
3A001.A.3 |
3A001.A.3 |
3A991.A.2 |
3A991.A.2 |
地址总线宽度 |
26 |
26 |
26 |
26 |
26 |
26 |
26 |
26 |
边界扫描 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
最大时钟频率 |
59 MHz |
59 MHz |
38.4 MHz |
38.4 MHz |
59 MHz |
59 MHz |
38.4 MHz |
38.4 MHz |
外部数据总线宽度 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
格式 |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
集成缓存 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
JESD-30 代码 |
S-PBGA-B515 |
S-PBGA-B515 |
S-PBGA-B515 |
S-PBGA-B515 |
S-PBGA-B515 |
S-PBGA-B515 |
S-PBGA-B515 |
S-PBGA-B515 |
JESD-609代码 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
长度 |
14 mm |
14 mm |
14 mm |
14 mm |
12 mm |
12 mm |
12 mm |
12 mm |
低功率模式 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
湿度敏感等级 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
端子数量 |
515 |
515 |
515 |
515 |
515 |
515 |
515 |
515 |
最高工作温度 |
90 °C |
105 °C |
90 °C |
105 °C |
90 °C |
105 °C |
90 °C |
105 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
- |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
封装等效代码 |
BGA515,26X26,20 |
BGA515,26X26,20 |
BGA515,26X26,20 |
BGA515,26X26,20 |
BGA515,28X28,16 |
BGA515,28X28,16 |
BGA515,28X28,16 |
BGA515,28X28,16 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
电源 |
1.1,1.8,3.3 V |
1.1,1.8,3.3 V |
1.1,1.2,1.8,1.8/3 V |
1.1,1.2,1.8,1.8/3 V |
1.1,1.8,3.3 V |
1.1,1.8,3.3 V |
1.1,1.2,1.8,1.8/3 V |
1.1,1.2,1.8,1.8/3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1 mm |
1 mm |
0.95 mm |
0.95 mm |
0.9 mm |
0.9 mm |
0.9 mm |
0.9 mm |
速度 |
600 MHz |
600 MHz |
600 MHz |
600 MHz |
600 MHz |
600 MHz |
600 MHz |
600 MHz |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
OTHER |
INDUSTRIAL |
OTHER |
INDUSTRIAL |
端子面层 |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
TIN SILVER COPPER |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
TIN SILVER COPPER |
端子形式 |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.4 mm |
0.4 mm |
0.4 mm |
0.4 mm |
端子位置 |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
14 mm |
14 mm |
14 mm |
14 mm |
12 mm |
12 mm |
12 mm |
12 mm |
uPs/uCs/外围集成电路类型 |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
最大供电电压 |
1.91 V |
- |
1.35 V |
1.35 V |
1.91 V |
- |
1.35 V |
1.35 V |
最小供电电压 |
1.71 V |
- |
0.985 V |
0.985 V |
1.71 V |
- |
0.985 V |
0.985 V |
标称供电电压 |
1.8 V |
- |
1 V |
1 V |
1.8 V |
- |
1 V |
1 V |