器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
GS8162Z18DD-333 | GSI Technology | SRAM 2.5 or 3.3V 1M x 18 18M | 下载 |
GS8162Z18DD-333I | GSI Technology | SRAM 2.5 or 3.3V 1M x 18 18M | 下载 |
GS8162Z18DD-333IT | GSI Technology | ZBT SRAM, 1MX18, 4.5ns, CMOS, PBGA165, FPBGA-165 | 下载 |
GS8162Z18DD-333IV | GSI Technology | SRAM 1.8/2.5V 1M x 18 18M | 下载 |
GS8162Z18DD-333IVT | GSI Technology | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, FPBGA-165 | 下载 |
GS8162Z18DD-333T | GSI Technology | ZBT SRAM, 1MX18, 4.5ns, CMOS, PBGA165, FPBGA-165 | 下载 |
GS8162Z18DD-333V | GSI Technology | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, FPBGA-165 | 下载 |
GS8162Z18DD-333VT | GSI Technology | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, FPBGA-165 | 下载 |
对应元器件 | pdf文档资料下载 |
---|---|
GS8162Z18DD-333IVT 、 GS8162Z18DD-333V 、 GS8162Z18DD-333VT | 下载文档 |
GS8162Z18DD-333IT 、 GS8162Z18DD-333T | 下载文档 |
GS8162Z18DD-333 、 GS8162Z18DD-333I | 下载文档 |
GS8162Z18DD-333IV | 下载文档 |
型号 | GS8162Z18DD-333VT | GS8162Z18DD-333IVT | GS8162Z18DD-333V |
---|---|---|---|
描述 | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, FPBGA-165 | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, FPBGA-165 | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, FPBGA-165 |
厂商名称 | GSI Technology | GSI Technology | GSI Technology |
零件包装代码 | BGA | BGA | BGA |
包装说明 | LBGA, | LBGA, | LBGA, |
针数 | 165 | 165 | 165 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
最长访问时间 | 5 ns | 5 ns | 5 ns |
其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY |
JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
长度 | 15 mm | 15 mm | 15 mm |
内存密度 | 18874368 bit | 18874368 bit | 18874368 bit |
内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM |
内存宽度 | 18 | 18 | 18 |
功能数量 | 1 | 1 | 1 |
端子数量 | 165 | 165 | 165 |
字数 | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C |
组织 | 1MX18 | 1MX18 | 1MX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LBGA | LBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm |
最大供电电压 (Vsup) | 2 V | 2 V | 2 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM |
宽度 | 13 mm | 13 mm | 13 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved