型号 |
EPM240F100I5N |
EPM240F100I5 |
EPM240F100I5N |
描述 |
CPLD - Complex Programmable Logic Devices CPLD - MAX II 192 Macro 80 IOs |
cpld - complex programmable logic devices cpld - max II 192 macro 80 ios |
cpld - complex programmable logic devices cpld - max II 192 macro 80 ios |
是否Rohs认证 |
符合 |
- |
符合 |
厂商名称 |
Intel(英特尔) |
- |
Altera (Intel) |
包装说明 |
11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100 |
- |
11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100 |
Reach Compliance Code |
compliant |
- |
unknow |
ECCN代码 |
EAR99 |
- |
EAR99 |
其他特性 |
IT CAN ALSO OPERATE AT 3.3V |
- |
IT CAN ALSO OPERATE AT 3.3V |
系统内可编程 |
YES |
- |
YES |
JESD-30 代码 |
S-PBGA-B100 |
- |
S-PBGA-B100 |
JESD-609代码 |
e1 |
- |
e1 |
JTAG BST |
YES |
- |
YES |
长度 |
11 mm |
- |
11 mm |
湿度敏感等级 |
3 |
- |
3 |
I/O 线路数量 |
80 |
- |
80 |
宏单元数 |
192 |
- |
192 |
端子数量 |
100 |
- |
100 |
组织 |
0 DEDICATED INPUTS, 80 I/O |
- |
0 DEDICATED INPUTS, 80 I/O |
输出函数 |
MACROCELL |
- |
MACROCELL |
封装主体材料 |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
封装代码 |
LBGA |
- |
LBGA |
封装等效代码 |
BGA100,10X10,40 |
- |
BGA100,10X10,40 |
封装形状 |
SQUARE |
- |
SQUARE |
封装形式 |
GRID ARRAY, LOW PROFILE |
- |
GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) |
260 |
- |
260 |
电源 |
1.5/3.3,2.5/3.3 V |
- |
1.5/3.3,2.5/3.3 V |
可编程逻辑类型 |
FLASH PLD |
- |
FLASH PLD |
传播延迟 |
7.5 ns |
- |
7.5 ns |
认证状态 |
Not Qualified |
- |
Not Qualified |
座面最大高度 |
1.7 mm |
- |
1.7 mm |
最大供电电压 |
2.625 V |
- |
2.625 V |
最小供电电压 |
2.375 V |
- |
2.375 V |
标称供电电压 |
2.5 V |
- |
2.5 V |
表面贴装 |
YES |
- |
YES |
技术 |
CMOS |
- |
CMOS |
端子面层 |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 |
BALL |
- |
BALL |
端子节距 |
1 mm |
- |
1 mm |
端子位置 |
BOTTOM |
- |
BOTTOM |
处于峰值回流温度下的最长时间 |
40 |
- |
40 |
宽度 |
11 mm |
- |
11 mm |