器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
CDR33BP332AJUS | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, BP, 30ppm/Cel TC, 0.0033uF, Surface Mount, 1210, CHIP | 下载 |
CDR33BP332AJUS | AVX | Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, BP, 30ppm/Cel TC, 0.0033uF, Surface Mount, 1210, CHIP | 下载 |
CDR33BP332AJUS | Presidio Components Inc | Ceramic Capacitor, Ceramic, 50V, 5% +Tol, 5% -Tol, BP, -/+30ppm/Cel TC, 0.0033uF, Surface Mount, 1210, | 下载 |
CDR33BP332AJUS\6 | AVX | Multilayer Ceramic Capacitors MLCC - SMD/SMT SMP MLC HI-REL | 下载 |
CDR33BP332AJUSAB | Vishay(威世) | CAP CER 3300PF 50V BP 1210 | 下载 |
CDR33BP332AJUSAC | Vishay(威世) | CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0033 uF, SURFACE MOUNT, 1210, CHIP | 下载 |
CDR33BP332AJUSAJ | Vishay(威世) | CAP CER 3300PF 50V BP 1210 | 下载 |
CDR33BP332AJUSAP | Vishay(威世) | CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0033 uF, SURFACE MOUNT, 1210, CHIP | 下载 |
CDR33BP332AJUSAR | Vishay(威世) | CAP CER 3300PF 50V BP 1210 | 下载 |
CDR33BP332AJUSAT | Vishay(威世) | CAP CER 3300PF 50V BP 1210 | 下载 |
CDR33BP332AJUS\M2K | AVX | —— | 下载 |
对应元器件 | pdf文档资料下载 |
---|---|
CDR33BP332AJUSAB 、 CDR33BP332AJUSAJ 、 CDR33BP332AJUSAR | 下载文档 |
CDR33BP332AJUSAC 、 CDR33BP332AJUSAP | 下载文档 |
CDR33BP332AJUSAT | 下载文档 |
CDR33BP332AJUS\M2K | 下载文档 |
CDR33BP332AJUS\6 | 下载文档 |
CDR33BP332AJUS | 下载文档 |
CDR33BP332AJUS | 下载文档 |
CDR33BP332AJUS | 下载文档 |
型号 | CDR33BP332AJUSAB | CDR33BP332AJUSAJ | CDR33BP332AJUSAR |
---|---|---|---|
描述 | CAP CER 3300PF 50V BP 1210 | CAP CER 3300PF 50V BP 1210 | CAP CER 3300PF 50V BP 1210 |
是否无铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
包装说明 | , 1210 | , 1210 | , 1210 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
电容 | 0.0033 µF | 0.0033 µF | 0.0033 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC | CERAMIC |
高度 | 1.5 mm | 1.5 mm | 1.5 mm |
JESD-609代码 | e0 | e0 | e0 |
长度 | 3.2 mm | 3.2 mm | 3.2 mm |
安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
多层 | Yes | Yes | Yes |
负容差 | 5% | 5% | 5% |
端子数量 | 2 | 2 | 2 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
封装形式 | SMT | SMT | SMT |
包装方法 | BULK | TR, EMBOSSED PLASTIC, 7 INCH | TR, EMBOSSED PLASTIC, 11.25/13 INCH |
正容差 | 5% | 5% | 5% |
额定(直流)电压(URdc) | 50 V | 50 V | 50 V |
参考标准 | MIL-PRF-55681/9 | MIL-PRF-55681/9 | MIL-PRF-55681/9 |
尺寸代码 | 1210 | 1210 | 1210 |
表面贴装 | YES | YES | YES |
温度特性代码 | BP | BP | BP |
温度系数 | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND |
宽度 | 2.5 mm | 2.5 mm | 2.5 mm |
Base Number Matches | 1 | 1 | 1 |
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