器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
24LC16B-S15K | Microchip(微芯科技) | EEPROM 16K, 2K X 8 2.5V SERIAL EE DIE in WAFFLE PK | 下载 |
24LC16B/S15K | Microchip(微芯科技) | IC EEPROM 16K I2C 400KHZ WAFER | 下载 |
对应元器件 | pdf文档资料下载 |
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24LC16B-ET/MC 、 24LC16B-ET/MS 、 24LC16B-ET/OT 、 24LC16B-ET/SN 、 24LC16B-ET/ST 、 24LC16B-IT/MC 、 24LC16B-IT/MS 、 24LC16B-IT/OT 、 24LC16B-IT/SN 、 24LC16B-IT/ST | 下载文档 |
24LC16B-I/SLA22 、 24LC16B/PROC 、 24LC16B/PRVC 、 24LC16B/PRVD 、 24LC16B/SNA38 、 24LC16B/SNRVC 、 24LC16B/SNRVD | 下载文档 |
24LC16B-E-P 、 24LC16B-E-ST 、 24LC16B-I-MS 、 24LC16B-I-P 、 24LC16B-I-SN 、 24LC16B-I-ST 、 24LC16B-I-STG | 下载文档 |
24LC16B-E/MCG 、 24LC16B-I-S15K 、 24LC16B-I/MCG 、 24LC16B-I/W15K 、 24LC16B-S15K 、 24LC16B-W15K | 下载文档 |
24LC16B-E-MS 、 24LC16B-E-SN 、 24LC16B-I/SNG 、 24LC16B-P 、 24LC16B-SN | 下载文档 |
24LC16B-IP 、 24LC16B-ISL 、 24LC16B-ISN 、 24LC16B-SL | 下载文档 |
24LC16B-I/STG 、 24LC16B/P 、 24LC16B/SN | 下载文档 |
24LC16B-E/SN 、 24LC16B-I/SNG 、 24LC16B/SN | 下载文档 |
24LC16B-E-SNG 、 24LC16B-E/PG 、 24LC16B-E/STG | 下载文档 |
24LC16B-E-MC 、 24LC16B-I-MC | 下载文档 |
型号 | 24LC16B-ET/MC | 24LC16B-ET/MS | 24LC16B-ET/OT | 24LC16B-ET/SN | 24LC16B-ET/ST | 24LC16B-IT/MC | 24LC16B-IT/MS | 24LC16B-IT/OT | 24LC16B-IT/SN | 24LC16B-IT/ST |
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描述 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | DFN | MSOP | SOT-23 | SOIC | SOIC | DFN | MSOP | SOT-23 | SOIC | SOIC |
包装说明 | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | ROHS COMPLIANT, PLASTIC, MSOP-8 | LSSOP, | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 | ROHS COMPLIANT, PLASTIC, MSOP-8 | LSSOP, | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 |
针数 | 8 | 8 | 5 | 8 | 8 | 8 | 8 | 5 | 8 | 8 |
Reach Compliance Code | compliant | compli | compliant | compli | compli | compli | compli | compli | compliant | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | S-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 3 mm | 3 mm | 2.95 mm | 4.9 mm | 4.4 mm | 3 mm | 3 mm | 2.95 mm | 4.9 mm | 4.4 mm |
内存密度 | 16384 bit | 16384 bi | 16384 bit | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bit | 16384 bi |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 5 | 8 | 8 | 8 | 8 | 5 | 8 | 8 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | TSSOP | LSSOP | SOP | TSSOP | HVSON | TSSOP | LSSOP | SOP | TSSOP |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1.1 mm | 1.45 mm | 1.75 mm | 1.1 mm | 1 mm | 1.1 mm | 1.45 mm | 1.75 mm | 1.1 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.65 mm | 0.95 mm | 1.27 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.95 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | 2 mm | 3 mm | 1.63 mm | 3.9 mm | 3 mm | 2 mm | 3 mm | 1.63 mm | 3.9 mm | 3 mm |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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