HS2AA thru HS2MA
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Fast switching for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- AEC-Q101 qualified (Green compound not involved)
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
High Efficient Surface Mount Rectifiers
MECHANICAL DATA
Case：DO-214AC(SMA)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free, RoHS compliant
Terminal：Matte
tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Polarity：Indicated
by cathode band
Weight：0.06
gram (approximately)
DO-214AC(SMA)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@ 1.5 A
Maximum reverse current @ rated VR
T
J
=25
℃
T
J
=125
℃
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
Trr
Cj
R
θJA
T
J
T
STG
50
50
80
- 55 to + 150
- 55 to + 150
1.0
5
100
75
30
O
HS
2AA
50
35
50
HS
2BA
100
70
100
HS
2DA
200
140
200
HS
2FA
300
210
300
1.5
50
HS
2GA
400
280
400
HS
2JA
600
420
600
HS
2KA
800
560
800
HS
2MA
1000
700
1000
UNIT
V
V
V
A
A
1.3
1.7
V
uA
nS
pF
C/W
O
O
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1：Pulse test with PW=300u sec, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
C
C
Document Number：DS_D1310030
Version:H13
HS2AA thru HS2MA
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PACKING
CODE
R3
R2
HS2xA
(Note 1)
M2
F3
F2
F4
Note 1: "x" defines voltage from 50V (HS2AA) to 1000V (HS2MA)
Suffix "G"
GREEN COMPOUND
CODE
SMA
SMA
SMA
Folded SMA
Folded SMA
Folded SMA
1800 / 7" Plastic reel
7500 / 13" Paper reel
7500 / 13" Plastic reel
1800 / 7" Plastic reel
7500 / 13" Paper reel
7500 / 13" Plastic reel
PACKAGE
PACKING
EXAMPLE
PREFERRED P/N PART NO.
HS2MA R3
HS2MA R3G
HS2MA
HS2MA
PACKING CODE
R3
R3
G
Green compound
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
FIG.1 FORWARD CURRENT DERATING CURVE
2
1000
INSTANTANEOUS REVERSE CURRENT
(uA)
100
TJ=125℃
10
AVERAGE FORWARD
CURRENT (A)
1.5
1
RESISTIVE OR
INDUCTIVE LOAD
0.5
1
TJ=25℃
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
0
0
20
40
60
80
100
120
140
160
LEAD TEMPERATURE (
o
C)
PEAK FORWARD SURGE URRENT (A)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
60
50
40
30
20
10
0
1
10
100
8.3mS Single Half Sine Wave
JEDEC Method
INSTANTANEOUS FORWARD CURRENT (A)
70
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
10
HS2AA-HS2DA
1
HS2GA
NUMBER OF CYCLES AT 60 Hz
HS2JA-HS2MA
0.1
0.4
0.6
0.8
1
1.2
FORWARD VOLTAGE (V)
1.4
1.6
Document Number：DS_D1310030
Version:H13
HS2AA thru HS2MA
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
175
150
CAPACITANCE (pF)
125
100
75
50
25
0
0.1
1
10
REVERSE VOLTAGE (V)
100
1000
HS2JA-HS2MA
HS2AA-HS2GA
f=1.0MHz
Vslg=50mVp-p
PACKAGE OUTLINE DIMENSIONS
Unit(mm)
Min
1.27
4.06
2.29
1.99
0.90
4.95
0.10
0.15
Max
1.58
4.60
2.83
2.50
1.41
5.33
0.20
0.31
Unit(inch)
Min
0.050
0.160
0.090
0.078
0.035
0.195
0.004
0.006
Max
0.062
0.181
0.111
0.098
0.056
0.210
0.008
0.012
DIM.
A
B
C
D
E
F
G
H
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
MARKING DIAGRAM
P/N =
G=
YW =
F=
Specific Device Code
Green Compound
Date Code
Factory Code
Unit(mm)
1.68
1.52
3.93
2.41
5.45
Document Number：DS_D1310030
Version:H13
WindowsCE
京公网安备 11010802033920号
Copyright © 2005-2023 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
