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L1QK402105MS12

器件型号:L1QK402105MS12
器件类别:无源元件    电容器   
厂商名称:KEMET(基美)
厂商官网:http://www.kemet.com
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器件描述

Ceramic Capacitor, Ceramic,

参数
参数名称属性值
厂商名称KEMET(基美)
包装说明,
Reach Compliance Codecompli
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
端子数量2

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Surface Mount and Through-Hole Multilayer Ceramic Chip Stacked Capacitors
KPS MIL Series, SMPS Stacked Capacitors,
MIL–PRF–49470, DSCC 87106, 25 – 1,000 VDC
(Commerical, Military and Space Grades)
Overview
KEMET Power Solutions (KPS) MIL Series ceramic
stacked capacitors are available in commercial, military
and space grades and are well suited for standard and
high reliability switch mode power supply (SMPS) and
pulse energy applications. Qualified under performance
specification MIL–PRF–49470, our military and space
grade products meet or exceed the requirements outlined
by DSCC (Defense Supply Center, Columbus) and are
available in both B (standard reliability) & T (high reliability)
product levels. MIL–PRF–49470 was developed as part
of a cooperative effort between the U.S. Military, NASA
and SMPS suppliers to produce a robust replacement to
cancelled DSCC Drawing 87106.
The KPS MIL Series is constructed using large chip
multilayer ceramic capacitors (MLCCs), horizontally
stacked and secured to a lead-frame termination system
using a high melting point (HMP) solder alloy. The lead frame
isolates the MLCCs from the printed circuit board (PCB) while
establishing a parallel circuit configuration. Mechanically
isolating the capacitors from the PCB improves mechanical
and thermal stress performance, while the parallel circuit
configuration allows for bulk capacitance in the same or
smaller design footprint.
Available in BX, BR, BQ, and X7R dielectrics, these devices
are available in encapsulated and unencapsulated styles in
both surface mountable and through-hole configurations.
Their low Equivalent Series Resistance (ESR) and Equivalent
Series Inductance (ESL) make them ideally suited for input
and output filtering of power supply as well as snubber
applications. The encapsulated styles are primarily used
where increased mechanical and environmental protection is
required, such as in avionics systems.
Benefits
• −55°C to +125°C operating temperature range
• High frequency performance
• Bulk capacitance in a reduced footprint
• MIL–PRF–49470 QPL
• Military Case Codes 3, 4 and 5
• Space Grade available (“T” Level)
• DSCC approved (87106)
• Commercial/Industrial Grade available
• Customer specific requirements available
• Low ESR and ESL
• High thermal stability
• High ripple current capability
• Higher reliability than aluminum electrolytic or tantalum
• Available encapsulated or unencapsulated
Applications
• Military
• Space
• Industrial
• Input and output filtering on power supplies – often found
on “capacitor banks“
• Snubber circuits
• Radar filtering (28 V/microwave burst)
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1031_KPS_SMPS_49470_STACKS • 3/6/2017
1
Surface Mount and Through-Hole Multilayer Ceramic Chip Stacked Capacitors – KPS MIL Series, SMPS Stacked Capacitors
MIL–PRF–49470 Ordering Information
M49470
Performance Specification
Indicating MIL–PRF–49470
1
M49470 = B level
T49470 = T level
A “T” prefix is used in
place of the “M” for T level
product.
1
R
01
474
K
C
Rated
Voltage
(VDC)
A = 50
B = 100
C = 200
E = 500
N
Lead
Configuration
4
N = Straight Pin
L = Formed "L"
M = Formed "L"
J = Formed "J"
K = Formed "J"
Dielectric
Performance Specification Sheet Number Capacitance Capacitance
Classification/
Code (pF)
Tolerance
(Indicating MIL–PRF–49470/1)
3
Characteristic
2
Q = BQ
R = BR
X = BX
01 = Unencapsulated
02 = Encapsulated
Two
significant
digits and
number of
zeros
J = ±5%
K = ±10%
M = ±20%
Indicates performance and reliability requirements. "B" level represents standard reliability."T" level represents high reliability.
1
Please refer to performance specification sheet MIL–PRF–49470 for details regarding test levels. The latest revision of the specification sheet is
available through DSCC.
1, 3
Test level option "T" is not available on encapsulated stacked devices (i.e. MIL–PRF–49470/2).
2
Dielectric classification and characteristic details are outlined in the "Electrical Parameters" section of this document.
4
Lead configuration and dimension details are outlined in the "Dimensions" section of this document.
KPS MIL Series, SMPS Stacks Ordering Information
(Do not use this ordering code if a QPL MIL–SPEC part type is required. Please order using MIL–SPEC ordering code.
Details regarding MIL–PRF–49470 QPL ordering information is outlined above.)
L1
Product Family
1
L1=Unencapsulated
L2=Encapsulated
R
N
30
C
106
K
S
Testing Option
4
B = M49470 "B" Level
T = M49470 "T" Level
C = DSCC87106
S = Commercial
X = Non-Standard
(Customer Specific
Requirements)
12
Maximum Height
Dimension (in.)
5
Unencapsulated
12 = 0.12"
24 = 0.24"
36 = 0.36"
48 = 0.48"
65 = 0.65"
Encapsulated
27 = 0.27"
39 = 0.39"
53 = 0.53"
66 = 0.66"
80 = 0.80"
Dielectric
Case Size/ Rated
Lead
Capacitance Capacitance
Classification/
Case Code Voltage
Configuration
3
Code (pF)
Tolerance
Characteristic
2
(CC)
(VDC)
Q = BQ
R = BR
X = BX
W = X7R
N = Straight
30 = CC 3
L = Formed "L" 40 = CC 4
M = Formed "L" 50 = CC 5
J = Formed "J"
K = Formed "J"
3 = 25
Two
5 = 50
significant
1 = 100
digits and
2 = 200
number of
C = 500
zeros
B = 630
D = 1,000
J = ±5%
K = ±10%
M = ±20%
Test level option "T" is not available on encapsulated stacked devices, i.e., MIL–PRF–49470/2. If a QPL MIL–Spec part type is required, please order
using the MIL–Spec ordering code.
2
Dielectric classification and characteristic details are outlined in the "Electrical Parameters" section of this document.
3
Lead configuration and dimension details are outlined in the "Dimensions" section of this document. Additional lead configurations may be available.
Contact KEMET for details.
4
Indicates performance and reliability requirements. Testing option details are outlined in the "Performance & Reliability" section of this document.
4
Please refer to performance specification sheet MIL–PRF–49470 for additional details regarding test levels. The latest revision of the specification
sheet is available through DSCC.
4
DSCC Drawing 87106 was cancelled on 01/03/2005. MIL–PRF–49470 capacitors are preferred over DSCC Drawing 87106 capacitors.
5
Maximum height dimensions are provided in product tables 1A, 1B, and 1C of this document
1, 4
Ordering Information Requirements per DSCC Drawing 87106
DSCC Drawing 87106 was cancelled on 01/03/2005. Customers can continue to order per 87106 requirements using the original DSCC ordering code,i.e.,
87106–001.
When available, MIL–PRF–49470 devices are preferred over DSCC Drawing 87106. The MIL–PRF–49470 military specification product provides
additional quality assurance provisions that are not required by the DSCC drawing. These extra provisions create a more robust replacement.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1031_KPS_SMPS_49470_STACKS • 3/6/2017
2
Surface Mount and Through-Hole Multilayer Ceramic Chip Stacked Capacitors – KPS MIL Series, SMPS Stacked Capacitors
Unencapsulated (M49470/1 & L1) Product Dimensions – Inches (Millimeters)
Case
Code
3
4
5
1
C
E
D
D
Lead Spacing Length ±0.010
Width
Width
±0.025 (0.635)
(0.250)
Minimum Maximum
0.450 (11.43)
0.400 (10.16)
0.250 (6.35)
0.500 (12.70)
0.440 (11.18)
0.300 (7.62)
0.950 (24.13) 1.075 (27.30)
A
Seating Plane
1
Height
±0.010 (0.250)
Maximum
0.055 (1.40)
Number of
Leads per
Side
10
4
3
Mounting
Technique
Solder reflow
only
Refer to
tables 1A & 1C
0.350 (8.89) 0.425 (10.80) for specific
maximum A
0.224 (5.69) 0.275 (6.98)
dimension
Only applies to lead style "N" (straight).
3
3
5
1. Unless otherwise specified, tolerances are ±0.010" (0.25 mm).
2. Metric equivalents for C, D and E dimensions are provided for general information only.
3. For maximum B dimension, add 0.065" (1.65 mm) to the appropriate A dimension. For all lead styles, the number of chips is determined by the
capacitance and voltage rating.
4. For case code 5, dimensions shall be 0.100" (2.54 mm) maximum and 0.012” (0.30 mm) minimum.
5. Lead alignment within pin rows shall be within ±0.005" (0.13 mm).
Unencapsulated & Encapsulated Lead Configurations – Inches (Millimeters)
Lead Style
Symbol
N
L
M
J
K
(J) Formed
Lead Style
(N) Straight
(L) Formed
L
Lead Length
0.250 Minimum (6.35)
0.070±0.010 (1.78±0.25)
0.045±0.010 (1.14±0.25)
0.070±0.010 (1.78±0.25)
0.045±0.010 (1.14±0.25)
Additional lead configurations may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1031_KPS_SMPS_49470_STACKS • 3/6/2017
3
Surface Mount and Through-Hole Multilayer Ceramic Chip Stacked Capacitors – KPS MIL Series, SMPS Stacked Capacitors
Encapsulated (M49470/2 & L2) Product Dimensions – Inches (Millimeters)
Case Code
3
4
5
C
Lead Spacing
±0.025 (0.635)
0.450 (11.43)
0.400 (10.16)
0.250 (6.35)
E
Length
Maximum
0.580 (14.73)
0.485 (12.32)
0.355 (9.02)
D
Width ±0.635
(±0.025)
1.155 (29.34)
0.485 (12.32)
0.355 (9.02)
A
Height
Refer to table 1B for
specific maximum A
dimension
Number of
Leads per Side
10
4
3
Mounting
Technique
Solder reflow only
SEE NOTE 4
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Unless otherwise specified, tolerances are ±0.010” (0.25 mm).
4. Lead alignment within pin rows shall be within ±0.005” (0.13 mm).
Unencapsulated & Encapsulated Lead Configurations – Inches (Millimeters)
Lead Style
Symbol
N
L
M
J
K
(J) Formed
Lead Style
(N) Straight
(L) Formed
L
Lead Length
0.250 Minimum (6.35)
0.070±0.010 (1.78±0.25)
0.045±0.010 (1.14±0.25)
0.070±0.010 (1.78±0.25)
0.045±0.010 (1.14±0.25)
Additional lead configurations may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1031_KPS_SMPS_49470_STACKS • 3/6/2017
4
Surface Mount and Through-Hole Multilayer Ceramic Chip Stacked Capacitors – KPS MIL Series, SMPS Stacked Capacitors
Qualification Inspection Per MIL–PRF–49470
Inspection
Group I
Thermal shock and voltage
conditioning
Visual and mechanical
Inspection
Low temperature storage
Barometric pressure
Terminal strength
Voltage-temperature limits
Vibration, high frequency
Immersion
Shock, specified pulse
Resistance to soldering heat
Moisture resistance
DPA (T level only)
4.8.5
Test Method Paragraph
Group II
4.8.4
Group III
4.8.23
4.8.9
4.8.10
4.8.13.1
4.8.14
4.8.15
4.8.16
4.8.17
4.8.18
4.8.19
Group IV
Group V
Group VI
Group VII
Humidity, steady state, low voltage
4.8.21
(T level only)
Group VIII
Life
4.8.22
Environmental Compliance
These devices do not meet RoHS criteria
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1031_KPS_SMPS_49470_STACKS • 3/6/2017
5

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