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TAJR474M025B

器件型号:TAJR474M025B
器件类别:无源元件    电容器   
文件大小:2MB,共136页
厂商名称:AVX
标准:
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器件描述

CAPACITOR, TANTALUM, SOLID, POLARIZED, 25V, 0.47uF, SURFACE MOUNT, 0805, CHIP

参数
参数名称属性值
是否Rohs认证符合
Objectid2055183072
包装说明, 0805
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.47 µF
电容器类型TANTALUM CAPACITOR
介电材料TANTALUM (DRY/SOLID)
JESD-609代码e4
漏电流0.0005 mA
制造商序列号TAJ
安装特点SURFACE MOUNT
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 13 INCH
极性POLARIZED
正容差20%
额定(直流)电压(URdc)25 V
尺寸代码0805
表面贴装YES
Delta切线0.04
端子面层Gold (Au)
端子形状J BEND

文档预览

A KYOCERA GROUP COMPANY
AVX
Tantalum and
Niobium Oxide Capacitors
Contents
SECTION 1:
General
Low Profile
Low ESR
SURFACE MOUNT COMMERCIAL TANTALUM
Introduction
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4
TAJ Series
- Standard Tantalum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5-8
TAC Series
- Standard TACmicrochip™. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9-11
TLC Series
- Tantalum Solid Electrolytic Chip Caps Consumer Series . . . . . . . . . . . . . .
12-13
TAJ Series
- Low Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14-17
TAC Series
- Low Profile TACmicrochip™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18-19
TAK Series
- Low Profile Performance TACmicrochip™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
TPS Series
- Low ESR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21-30
TPS Series III
- New Generation Low ESR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31-34
TPM Series
- Multianode, Tantalum Ultra Low ESR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35-37
TPC Series
- Low ESR TACmicrochip™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
38-39
TCJ Series
- Tantalum Solid Electrolytic Chip Caps w/Conductive Polymer Electrode . .
40-41
TLJ Series
- Tantalum Solid Electrolytic Chip Caps Consumer Series . . . . . . . . . . . . . . .
41-43
TRJ Series
- Professional Tantalum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
44-46
THJ Series
- High Temperature (up to 150°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
47-49
TAZ Series
- CWR09, CWR19, CWR29 and COTS-Plus . . . . . . . . . . . . . . . . . . . . . . . . . .
52-65
TBJ Series
- CWR11 and COTS-Plus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
66-72
TBC Series
- CWR15 Fixed Chip Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
73
Performance
High Reliability
TMC Series
- Established Reliability TACmicrochip
TM
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
50-51
SECTION 2:
NIOBIUM OXIDE - OxiCap™
Niobium Oxide Roadmap
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
74
NOJ Series
- Standard OxiCap™. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75-77
NOJ Series -
Low Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
78-79
NOS Series
- Low ESR OxiCap™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
80-83
NOM Series
- Low ESR Multianodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
84-85
SECTION 3:
LEADED TANTALUM
Introduction
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
86
Dipped Radial Capacitors.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
86
Dipped Radial
- TAP Series Wire Form Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
87
TAP Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
88-90
TAP Series Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
91-92
Molded Axial Capacitors
- TAR Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
93-95
Hermetic Axial Capacitors
- TAA Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
96-98
Axial Capacitors
- TAR & TAA Series Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
99
SECTION 4:
TECHNICAL SUMMARY AND APPLICATION GUIDELINES
Introduction
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
98-99
Section 1:
Electrical Characteristics and Explanation of Terms . . . . . . . . . . . . . . . . . .
100-103
Section 2:
A.C. Operation, Ripple Voltage and Ripple Current. . . . . . . . . . . . . . . . . . .
104-106
Section 3:
Reliability and Calculation of Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . .
107-109
Section 4:
Application Guidelines for Tantalum and OxiCap
TM
Capacitors . . . . . . . . . .
110-111
Section 5:
Mechanical and Thermal Properties of Capacitors . . . . . . . . . . . . . . . . . . . . . . .
112
Product Safety and Environmental Information Data
. . . . . . . . . . . . . . . . . . . . . . . .
113-115
TAJ, TPS, TRJ, THJ, TPM, TAC, TPC, TLJ, TCJ, TMC Series
- Tape & Reel Packaging . .
116-117
TAZ, CWR09, CWR11, CWR19 Series
- Tape & Reel Packaging. . . . . . . . . . . . . . . . . . . . .
118
TAJ, TRJ, THJ, TPS, TPM, NOJ, NOS, NOM, TAC, TPC, TMC, TCJ, TLJ
- Marking. . . . . . .
119
TAP TECHNICAL SUMMARY AND APPLICATION GUIDELINES
Section 1:
Section 2:
Section 3:
Section 4:
Questions
Electrical Characteristics and Explanation of Terms . . . . . . . . . . . . . . . . . .
122-125
A.C. Operation, Ripple Voltage and Ripple Current . . . . . . . . . . . . . . . . . . . . . .
126
Reliability and Calculation of Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . .
127-129
Application Guidelines for Tantalum Capacitors . . . . . . . . . . . . . . . . . . . . . . . . .
130
and Answers
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
131-133
1
Section 1: Introduction
AVX Tantalum
APPLICATIONS
2-16 Volt
Low ESR
Low Profile Case
0603 available
Low Failure Rate
High Volumetric
Efficiency
Temperature Stability
Stable over Time
50 Volt @ 85°C
33 Volt @ 125°C
Automotive Range
High Reliability
Temperature Stability
QS9000 Approved
TS 16949 Plant Approved
Up to 150°C
AEC Q200 Approval
2 - 16 Volts
Low ESR
World’s Smallest
Tantalum
0402 Available
High Volumetric
Efficiency
Low Profile Versions
QUALITY STATEMENTS
AVX’s focus is CUSTOMER satisfaction - customer satisfac-
tion in the broadest sense: product quality, technical support,
product availability - all at a competitive price.
In pursuance of the established goals of our corporate wide
QV2000 program, it is the stated objective of AVX Tantalum
to supply our customers with a world class service in the
manufacture and supply of electronic components, while
maintaining a positive return on investment.
This world class service shall be defined as consistently
supplying product and services of the highest quality and
reliability encompassing all aspects of the customer supply
chain.
In addition, any new or changed products, processes or
services will be qualified to established standards of quality
and reliability.
The objectives and guidelines listed above shall be achieved
by the following codes of practice:
1.
Continual objective evaluation of customer needs and
expectations for the future and the leverage of all AVX
resources to meet this challenge.
2.
Continually fostering and promoting a culture of continuous
improvement through ongoing training and empowered
participation of employees at all levels of the company.
3.
Continuous Process Improvement using sound engineer-
ing principles to enhance existing equipment, material
and processes. This includes the application of the
science of S.P.C. focused on improving the Process
Capability Index, Cpk.
The Tantalum division has plants approved to ISO9001:2000
and TS16949:2002 (Automotive Quality System
Requirements) with the intention that all facilities world-wide
will adopt this as the quality standard.
Dedicated series of tantalum and niobium oxide capacitors
meets requirements of AEC-Q200.
The Tantalum division has plants approved to ISO14001 with
the intention that all facilities world-wide will adopt this as the
quality standard.
2
Introduction
AVX Tantalum
AVX Paignton UK is the Divisional Headquarters for the
Tantalum division which has manufacturing locations in
Paignton in the UK, Biddeford in Maine, USA, Juarez in
Mexico, Lanskroun in the Czech Republic, San Salvador, in
El Salvador and Tianjin in P.R. China.
This division manufactures tantalum and niobium oxide
capacitors. Tantalum is an element extracted from ores
found alongside tin and niobium deposits; the major sources
of supply are Canada, Brazil and Australasia.
Niobium oxide is a ceramic material that can be processed
to the same powder form as traditional tantalum capacitors
and manufactured in an identical process.
So for high volume tantalum and niobium oxide capacitors
with leading edge technology call us first -
AVX your glob-
al partner.
Niobium oxide capacitors have been assigned the OxiCap
TM
trademark.
TECHNOLOGY TRENDS
The amount of capacitance possible in a tantalum
capacitor is directly related to the type of tantalum powder
used to manufacture the anode.
The graph following shows how the (capacitance) x
(voltage) per gram (CV/g) has steadily increased over
time, thus allowing the production of larger and larger
capacitances with the same physical volume. CV/g is
the measure used to define the volumetric efficiency of a
powder, a high CV/g means a higher capacitance from
the same volume.
These powder improvements have been achieved
through close development with the material suppliers.
AVX Tantalum is committed to driving the available
technology forward as is clearly demonstrated by
extended ratings continually being developed, and
new technologies such as TACmicrochip™ and
OxiCap™ technology.
If you have any specific requirements, please contact
your local AVX sales office for details on how AVX
Tantalum can assist you in addressing your future
requirements.
Tantalum Powder CV/gm
130
120
110
100
90
80
70
60
50
40
30
20
10
0
1975
CV/g ('000s)
1980
1985
1990
Year
1995
2000
2005
WORKING WITH THE CUSTOMER
- ONE STOP SHOPPING
In line with our desire to become the number one supplier in
the world for passive and interconnection components, AVX
is constantly looking forward and innovating.
It is not good enough to market the best products; the
customer must have access to a service system which suits
their needs and benefits their business.
The AVX ‘one stop shopping’ concept is already beneficial
in meeting the needs of major OEMs while worldwide
partnerships with only the premier division of distributors aids
the smaller user.
Helping to market and support our customers across the
breadth and depth of our electronic component line card are
a dedicated team of sales engineers, applications engineers
and product marketing managers. Their qualifications are
hopefully always appropriate to your commercial needs, but
as higher levels of technical expertise are required, access
directly to the appropriate department is seamless and
transparent.
Total quality starts and finishes with our commitment to cus-
tomer service. Where cost and quality are perceived as given
quantities AVX’s first in class service invariably places us in
the top rank of any preferred supplier list.
Facilities are equipped with instant worldwide DP and
telecommunication links connected to every sales and
production site worldwide. That ensures our customers’
delivery requirements are consistently met wherever in the
world they may be.
*Niobium Oxide Capacitors are manufactured and sold under patent license from Cabot Corporation, Boyertown, Pennsylvania U.S.A.
3
Tantalum Series Guide
TRJ
Professional
Pages 44-46
TLJ
Consumer
Pages 42-43
TCJ
Low ESR Polymer
Pages 40-41
TPS
THJ
High Reliability
High Temperature
Pages 47-49
TAJ
Generic Purpose and
High CV Capacitors
Pages 5-8
Low ESR
Pages 21-30
TPS III
Ultra Low ESR
Pages 31-33
TAJ Low Profile
TAP
Leaded
Capacitors
Pages 87-92
1.2, 1.5, 2.0 mm Height
Pages 14-16
TPM
Ultra Low ESR
Pages 35-37
TACmicrochip™
Military
TAZ
CWR09
World Smallest Tantalum
in 0402, 0603, 0805
and 1206 Cases
Pages 9-11
TAK
High Cap
Low Profile
Page 20
TBJ
CWR11
TPC
Low ESR
Pages 38-39
TMC
TACmicrochip™
CWR15 Fixed
CWR15
Pages 50-73
TAC Low Profile
& Custom
Pages 18-19
TMC
Established
Reliability
Pages 50-51
4
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