OTP ROM, 2KX8, 20ns, MOS, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 20 ns |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5062 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 2KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | MOS |
| 温度等级 | MILITARY |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5062 mm |
| 型号 | 53RA1681ANL | 53RA1681AL | 53RA1681ANS | 63RA1681L | 53RA1681NS | 53RA1681NL |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 2KX8, 20ns, MOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 2KX8, 20ns, MOS, CQCC28, LCC-28 | OTP ROM, 2KX8, 20ns, MOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | OTP ROM, 2KX8, 20ns, MOS, CQCC28, LCC-28 | OTP ROM, 2KX8, 25ns, MOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | OTP ROM, 2KX8, 25ns, MOS, PQCC28, PLASTIC, LCC-28 |
| 包装说明 | QCCJ, | QCCN, | DIP, | QCCN, | DIP, | QCCJ, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 20 ns | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns |
| JESD-30 代码 | S-PQCC-J28 | S-CQCC-N28 | R-PDIP-T24 | S-CQCC-N28 | R-PDIP-T24 | S-PQCC-J28 |
| 长度 | 11.5062 mm | 11.43 mm | 31.242 mm | 11.43 mm | 31.242 mm | 11.5062 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 24 | 28 | 24 | 28 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 75 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCN | DIP | QCCN | DIP | QCCJ |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 2.54 mm | 5.715 mm | 2.54 mm | 5.715 mm | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | YES |
| 技术 | MOS | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL EXTENDED | MILITARY | MILITARY |
| 端子形式 | J BEND | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 11.5062 mm | 11.43 mm | 7.62 mm | 11.43 mm | 7.62 mm | 11.5062 mm |
| 厂商名称 | AMD(超微) | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | QLCC | - | DIP | - | DIP | QLCC |
| 针数 | 28 | - | 24 | - | 24 | 28 |
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