Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT PACKAGE-6
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Central Semiconductor |
包装说明 | SMALL OUTLINE, R-PDSO-F6 |
针数 | 6 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
配置 | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
最小漏源击穿电压 | 50 V |
最大漏极电流 (ID) | 0.28 A |
最大漏源导通电阻 | 2.3 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
最大反馈电容 (Crss) | 5 pF |
JESD-30 代码 | R-PDSO-F6 |
JESD-609代码 | e3 |
湿度敏感等级 | 1 |
元件数量 | 2 |
端子数量 | 6 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 150 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
极性/信道类型 | N-CHANNEL |
认证状态 | Not Qualified |
表面贴装 | YES |
端子面层 | MATTE TIN (315) |
端子形式 | FLAT |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 10 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
型号 | CMLDM7003T | CMLDM7003TGTR | CMLDM7003TBK | CMLDM7003TGBK | CMLDM7003TTR |
---|---|---|---|---|---|
描述 | Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT PACKAGE-6 | Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PICOMINI-6 | Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PACKAGE-6 | Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PICOMINI-6 | Small Signal Field-Effect Transistor, 0.28A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PACKAGE-6 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor |
包装说明 | SMALL OUTLINE, R-PDSO-F6 | SMALL OUTLINE, R-PDSO-F6 | PACKAGE-6 | SMALL OUTLINE, R-PDSO-F6 | SMALL OUTLINE, R-PDSO-F6 |
针数 | 6 | 6 | 6 | 6 | 6 |
Reach Compliance Code | compliant | not_compliant | unknown | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
配置 | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
最小漏源击穿电压 | 50 V | 50 V | 50 V | 50 V | 50 V |
最大漏极电流 (ID) | 0.28 A | 0.28 A | 0.28 A | 0.28 A | 0.28 A |
最大漏源导通电阻 | 2.3 Ω | 2.3 Ω | 2.3 Ω | 2.3 Ω | 2.3 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
最大反馈电容 (Crss) | 5 pF | 5 pF | 5 pF | 5 pF | 5 pF |
JESD-30 代码 | R-PDSO-F6 | R-PDSO-F6 | R-PDSO-F6 | R-PDSO-F6 | R-PDSO-F6 |
元件数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 6 | 6 | 6 | 6 | 6 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 10 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
晶体管应用 | SWITCHING | AMPLIFIER | SWITCHING | AMPLIFIER | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
JESD-609代码 | e3 | e0 | - | e0 | e0 |
端子面层 | MATTE TIN (315) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
最大漏极电流 (Abs) (ID) | - | 0.28 A | 0.28 A | 0.28 A | 0.28 A |
最大功率耗散 (Abs) | - | 0.35 W | 0.35 W | 0.35 W | 0.35 W |
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