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ECM2A5F2A08-24.000M

器件型号:ECM2A5F2A08-24.000M
器件类别:无源元件    晶体/谐振器   
厂商名称:ECLIPTEK
厂商官网:http://www.ecliptek.com
标准:  
下载文档

器件描述

QUARTZ CRYSTAL RESONATOR, 24 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

参数
参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
其他特性AT-CUT CRYSTAL
老化3 PPM/YEAR
晶体/谐振器类型PARALLEL - FUNDAMENTAL
驱动电平100 µW
频率稳定性0.001%
频率容差10 ppm
JESD-609代码e4
负载电容8 pF
制造商序列号ECM2A
安装特点SURFACE MOUNT
标称工作频率24 MHz
最高工作温度70 °C
最低工作温度-20 °C
物理尺寸L2.5XB2.0XH0.55 (mm)/L0.098XB0.079XH0.022 (inch)
串联电阻80 Ω
表面贴装YES
端子面层Nickel/Gold (Ni/Au)
Base Number Matches1

文档预览

ECM2A5F2A08-24.000M
Series
RoHS Compliant (Pb-free) 2.0mm x 2.5mm 4 Pad
Ceramic SMD Crystal
Frequency Tolerance
±10ppm Maximum
Frequency Stability
±10ppm Maximum
Operating Temperature Range
-20°C to +70°C
RoHS
Pb
Nominal Frequency
24.000MHz
ECM2A 5 F 2 A 08 -24.000M
Load Capacitance
08pF Parallel Resonant
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance
Frequency Stability
Aging at 25°C
Operating Temperature Range
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Spurious Response
Storage Temperature Range
Insulation Resistance
24.000MHz
±10ppm Maximum
±10ppm Maximum
±3ppm/year Maximum
-20°C to +70°C
08pF Parallel Resonant
5pF Maximum
80 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
-3dB Minimum; Fo to Fo +5000ppm
-40°C to +90°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 1 of 4
ECM2A5F2A08-24.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2.00
±0.10
MARKING
ORIENTATION
0.65 ±0.10
4
1
0.95
±0.10
3
2
0.675 ±0.100
(X4)
2
0.775
±0.100
(X4)
3
4
LINE MARKING
1
2
24.0
YZZ
Y=Last Digit of Year
ZZ=Week of the Year
2.50
±0.10
0.55 MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.0 (X4)
1.2 (X4)
0.5
Solder Land
(X4)
0.3
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 2 of 4
ECM2A5F2A08-24.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 3 of 4
ECM2A5F2A08-24.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 4 of 4

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