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A1415A-3PQ100M

器件型号:A1415A-3PQ100M
器件类别:可编程逻辑器件    可编程逻辑   
厂商名称:Microsemi
厂商官网:https://www.microsemi.com
下载文档

器件描述

Field Programmable Gate Array, 200 CLBs, 1500 Gates, 250MHz, CMOS, PQFP100, PLASTIC, QFP-100

参数
参数名称属性值
厂商名称Microsemi
包装说明PLASTIC, QFP-100
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最大时钟频率250 MHz
CLB-Max的组合延迟2 ns
JESD-30 代码R-PQFP-G100
长度20 mm
可配置逻辑块数量200
等效关口数量1500
端子数量100
最高工作温度125 °C
最低工作温度-55 °C
组织200 CLBS, 1500 GATES
封装主体材料PLASTIC/EPOXY
封装代码QFP
封装形状RECTANGULAR
封装形式FLATPACK
可编程逻辑类型FIELD PROGRAMMABLE GATE ARRAY
座面最大高度3.4 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
宽度14 mm

文档预览

Revision 3
Accelerator Series FPGAs – ACT 3 Family
Features
• Up to 10,000 Gate Array Equivalent Gates (up to 25,000
equivalent PLD Gates)
• Highly Predictable Performance with 100% Automatic Place-
and-Route
• As Low as 9.0 ns Clock-to-Output Times (–1 Speed Grade)
• Up to 186 MHz On-Chip Performance (–1 Speed Grade)
• Up to 228 User-Programmable I/O Pins
• Four Fast, Low-Skew Clock Networks
Table 1 • ACT 3 Family Product Information
Device
Capacity
Gate Array Equivalent Gates
PLD Equivalent Gates
TTL Equivalent Package (40 gates)
20-Pin PAL Equivalent Packages (100 gates)
Logic Modules
S-Module
C-Module
Dedicated Flip-Flops
1
User I/Os (maximum)
Chip-to-Chip
3
(MHz)
Accumulators (16-bit, MHz)
Loadable Counter (16-bit, MHz)
Prescaled Loadable Counters (16-bit, MHz)
Datapath, Shift Registers (MHz)
Clock-to-Output (pad-to-pad, ns)
Packages
4
(by pin count)
CPGA
PLCC
PQFP
RQFP
VQFP
TQFP
BGA
CQFP
PG100
5
PL84
PQ100
VQ100
PG133
5
PL84
PQ100, PQ160
VQ100
CQ132
PG175
5
PL84
PQ160
VQ100
TQ176
PG207
PQ160, PQ208
TQ176
BG225
5
CQ196
PG257
RQ208
BG313
CQ256
1,500
3,750
40
15
200
104
96
264
80
80
47
82
186
186
9.0
2,500
6,250
60
25
310
160
150
360
100
80
47
82
186
186
9.0
4,000
10,000
100
40
564
288
276
568
140
80
47
82
186
186
9.5
6,000
15,000
150
60
848
432
416
768
168
78
47
82
150
150
10.0
10,000
25,000
250
100
1,377
697
680
1,153
228
76
47
78
150
150
10.5
A1415
A1425
A1440
A1460
A14100
More than 500 Macro Functions
Replaces up to Twenty 32 Macro-Cell CPLDs
Replaces up to One Hundred 20-Pin PAL
®
Packages
Up to 1,153 Dedicated Flip-Flops
VQFP, TQFP, BGA, and PQFP Packages
Nonvolatile, User Programmable
Fully Tested Prior to Shipment
5.0 V and 3.3 V Versions
Optimized for Logic Synthesis Methodologies
Low Power CMOS Technology
Maximum Performance
2
(worst-case commercial, –1 speed grade)
Notes:
1. One flip-flop per S0Module, two flip-flops per I/O Module.
2. Based on A1415A-1, A1425A-1, A1440A-1, A1460A-1, and A14100A-1.
3. Clock-to-Output (pad-to-pad) + assumed trace delay + setup time. Refer to the
"System Performance Model" on page 1-1
and
Table 1-1 on page 1-2.
4. See the
"Product Plan" table on page III
for package availability.
5. Discontinued device and package combination.
6. –2 and –3 speed grades have been discontinued. For more information about discontinued devices, refer to the Product
Discontinuation Notices (PDNs) listed below, available on the Microsemi SoC Products Group website:
PDN March 2001, PDN 0104, PDN 0203, PDN 0604, PDN 1004
January 2012
© 2012 Microsemi Corporation
I
Accelerator Series FPGAs – ACT 3 Family
Ordering Information
A14100
A
_
1
RQ
G
208
C
Application (Temperature Range)
C = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
PG = Ceramic Pin Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flatpack
RQ = Plastic Power Quad Flatpack
VQ = Very Thin (1.0 mm) Quad Flatpack
TQ = Thin (1.4 mm) Quad Flatpack
CQ = Ceramic Quad Flatpack
BG = Plastic Ball Grid Array
Speed Grade
Std = Standard Speed
–1 = Approximately 15% faster than Standard
–2 = Approximately 25% faster than Standard
–3 = Approximately 35% faster than Standard
Die Revision
A = 1.0 mm CMOS Process
Part Number
A1415A = 1,500 Gates
A14V15A = 1,500 Gates (3.3 V)
A1425A = 2,500 Gates
A14V25A = 2,500 Gates (3.3 V)
A1440A = 4,000 Gates
A14V40A = 4,000 Gates (3.3 V)
A1460A = 6,000 Gates
A14V60A = 6,000 Gates (3.3 V)
A14100A = 10,000 Gates
A14V100A = 10,000 Gates (3.3 V)
Notes:
1. The –2 and –3 speed grades have been discontinued.
2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed
grades, and temperature grades.
3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed
grades, and all temperature grades.
4. Military Grade devices are no longer available for the A1440A device.
5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on
the Microsemi SoC Products Group website:
PDN March 2001
PDN 0104
PDN 0203
PDN 0604
PDN 1004
II
R ev i si o n 3
Accelerator Series FPGAs – ACT 3 Family
Product Plan
Speed Grade
1
Device/Package
A1415A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flatpack (PQFP)
100-Pin Very Thin Quad Flatpack (VQFP)
100-Pin Ceramic Pin Grid Array (CPGA)
A14V15A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
A1425A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flatpack (PQFP)
100-Pin Very Thin Quad Flatpack (VQFP)
132-Pin Ceramic Quad Flatpack (CQFP)
133-Pin Ceramic Pin Grid Array (CPGA)
160-Pin Plastic Quad Flatpack (PQFP)
A14V25A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
160-Pin Plastic Quad Flatpack (PQFP)
A1440A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
160-Pin Plastic Quad Flatpack (PQFP)
175-Pin Ceramic Pin Grid Array (CPGA)
176-Pin Thin Quad Flatpack (TQFP)
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Std.
–1
–2
–3
C
Application
1
I
M
B
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Availability:
= Available
P = Planned
– = Not planned
D = Discontinued
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
R e visi on 3
III
Accelerator Series FPGAs – ACT 3 Family
Speed Grade
1
Device/Package
A14V40A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Quad Flatpack (VQFP)
160-Pin Plastic Quad Flatpack (PQFP)
176-Pin Thin Quad Flatpack (TQFP)
A1460A Device
160-Pin Plastic Quad Flatpack (PQFP)
176-Pin Thin Quad Flatpack (TQFP)
196-Pin Ceramic Quad Flatpack (CQFP)
207-Pin Ceramic Pin Grid Array (CPGA)
208-Pin Plastic Quad Flatpack (PQFP)
225-Pin Plastic Ball Grid Array (BGA)
A14V60A Device
160-Pin Plastic Quad Flatpack (PQFP)
176-Pin Thin Quad Flatpack (TQFP)
208-Pin Plastic Quad Flatpack (PQFP)
A14100A Device
208-Pin Power Quad Flatpack (RQFP)
257-Pin Ceramic Pin Grid Array (CPGA)
313-Pin Plastic Ball Grid Array (BGA)
256-Pin Ceramic Quad Flatpack (CQFP)
A14V100A Device
208-Pin Power Quad Flatpack (RQFP)
313-Pin Plastic Ball Grid Array (BGA)
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Std.
–1
–2
–3
C
Application
1
I
M
B
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Availability:
= Available
P = Planned
– = Not planned
D = Discontinued
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
IV
R ev i si o n 3
Accelerator Series FPGAs – ACT 3 Family
Plastic Device Resources
Device
Series
A1415
A1425
A1440
A1460
A14100
Logic
Modules
200
310
564
848
1377
User I/Os
Gates
1500
2500
4000
6000
10000
PL84
70
70
70
PQ100
80
80
PQ160
100
131
131
PQ/RQ208
167
175
VQ100
80
83
83
TQ176
140
151
BG225*
168
BG313
228
Note:
*Discontinued
Hermetic Device Resources
Device
Series
A1415
A1425
A1440
A1460
A14100
Logic
Modules
200
310
564
848
1377
User I/Os
Gates
1500
2500
4000
6000
10000
PG100*
80
PG133*
100
PG175*
140
PG207
168
PG257
228
CQ132
100
CQ196
168
CQ256
228
Note:
*Discontinued
Contact your local Microsemi SoC Products Group (formerly Actel) representative for device availability:
http://www.microsemi.com/soc/contact/default.aspx.
R e visi on 3
V

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