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CLP-148-02-L-D-BE-A

器件型号:CLP-148-02-L-D-BE-A
器件类别:连接器    连接器   
文件大小:822KB,共1页
厂商名称:SAMTEC
厂商官网:http://www.samtec.com/
标准:
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器件描述

.050" X .050

参数
参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
Factory Lead Time2 weeks
其他特性BOTTOM ENTRY, LOW PROFILE
板上安装选件PEG
主体宽度0.12 inch
主体深度0.09 inch
主体长度2.417 inch
连接器类型BOARD CONNECTOR
联系完成配合GOLD (10) OVER NICKEL (50)
联系完成终止Tin (Sn) - with Nickel (Ni) barrier
触点性别FEMALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点样式SQ PIN-SKT
DIN 符合性NO
滤波功能NO
IEC 符合性NO
绝缘体颜色BLACK
JESD-609代码e3
MIL 符合性NO
插接触点节距0.05 inch
匹配触点行间距0.05 inch
混合触点NO
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距3.2258 mm
电镀厚度10u inch
额定电流(信号)3.4 A
可靠性COMMERCIAL
端子节距1.27 mm
端接类型SURFACE MOUNT
触点总数96
UL 易燃性代码94V-0

文档预览

F-218 (Rev 14DEC17)
CLP–115–02–L–D
CLP–107–02–F–D–P
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
CLP–130–02–L–D
CLP–116–02–F–DH
(1.27 mm) .050"
CLP SERIES
LOW-PROFILE DUAL WIPE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLP
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (CLP/FTSH):
3.4 A per pin
(2 pins powered)
Voltage Rating:
280 VAC/395 VDC
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
Top Entry = (1.40 mm) .055"
minimum, Bottom Entry =
(2.41 mm) .095" minimum
plus board thickness
DH Entry = (2.31 mm) .091"
to (2.67 mm) .105"
Normal Force:
60 grams (0.59 N) average
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Yes
Mates with:
FTSH, FTS, FW
High-reliability
Tiger Claw
contacts
(1.27 mm x 1.27 mm)
.050" x .050"
micro pitch
APPLICATIONS
CLP
FTSH
Low-profile
(2.21 mm)
.087"
HORIZONTAL
Surface
mount
PASS-THRU
Suitable for pass-through
applications
CLP
1
NO. PINS
PER ROW
02
PLATING
OPTION
ROW
OPTION
OTHER
OPTION
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-35)
(0.15 mm) .006" max (36-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
02 thru 50
= Gold flash on
contact, Matte
Tin on tail
–F
–L
= Double
Row
–D
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
No. of Positions
x (1.27) .050 + (0.43) .017
100
(1.27)
.050
(0.41)
.016
= 10 µ" (0.25 µm)
Gold
(–D only)
(4.32)
.170
–G
= Double
Horizontal
(Requires
FTSH–01
and
FTSH–04
lead styles)
– DH
= Bottom Entry
(Required for bottom entry
applications)
–BE
–A
= Alignment Pin
(Not available with –PA option)
(05, 06, 07, 08, 10, 12, 15,
20, 25, 30, 40 positions only)
(–DH option and other sizes.
Contact Samtec.)
02
(4.57) (3.05)
.180 .120
ALSO AVAILABLE
(MOQ Required)
• Single row
• Other platings
Contact Samtec.
(3.43)
.135
99
01
(6.35)
.250
x
(3.18)
.125
(2.54)
.100
= (4.00 mm) .157" DIA
Polyimide film Pick & Place Pad
(5 positions min.)
–K
–P
(1.27)
.050
(2.29)
.090
–P OPTION
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary
for auto placement.
See Flex Processing.)
–DH
–D
(1.40)
.055
(8.25)
.325
(3.07)
.121
(0.89)
.035 DIA
(7.00)
.275
–PA OPTION
A
PIN/ROW
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
04-15
16-50
A
(3.56) .140
(7.11) .280
If odd pins/row, alignment
pins are on middle position
on centerline of the part.
If even pins/row, then
alignment pins are between
middle two positions.
= Pick & Place Pad
with Alignment Pin
(–D only)
(Not Available with –A option)
–PA
= Tape & Reel
– TR
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

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