AUGAT* HOLTITE* Sockets
11Mar11 Rev B
This specification covers performance, tests and quality requirements for the TE Connectivity (TE)
AUGAT* HOLTITE* Sockets. These sockets are designed to be press-fit into a plated through hole of a
printed circuit board. This unique design allows the plated through hole to become a component socket.
The sockets are designed to accept a .016 to .021 inch round lead (5P), .011 X .018 inch rectangular
lead (5P), .020 to .030 inch round lead (6P), .025 to .035 inch round lead (8P) and .035 to .045 inch
round lead (12P).
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
Qualification Test Results
Successful qualification testing on the subject product line has been completed. The Qualification Test
Report number for this testing is 501-500. This documentation is on file at and available from
Engineering Practices and Standards (EPS).
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
109-197: TE Test Specifications vs EIA and IEC Test Methods
501-500: Qualification Test Report
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
Materials used in the construction of this product shall be as specified on the applicable product
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
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Current: 5 amperes using an .062 inch thick glass epoxy, Type FR4, with 2 ounce copper, plated,
with electroplated (.001 inch minimum) copper and electroplated tin/lead (.0003 inch minimum)
plated through holes.
Gold contacts: -55 to 125°
Tin/lead contacts: -55 to 105°
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per EIA-364.
Test Requirements and Procedures Summary
Meets visual requirements.
Examination of product.
Low level contact resistance.
10 milliohms maximum initial for
11 milliohms maximum initial for
15 milliohms maximum final.
1,000 megohms minimum.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
See Figure 3.
Test between adjacent contacts on
.100 inch centerlines.
Temperature rise vs current.
30EC maximum temperature rise at EIA-364-70,
Stabilize at a single current level
until 3 readings at 5 minute
intervals are within 1EC.
No discontinuities of 1 microsecond EIA-364-28,
or longer duration.
Test Condition IV.
Subject mated specimens to 10-
2000-10 Hz traversed in 20 minutes
with 1.5 mm [.06 in] maximum total
excursion or 20 G’s, whichever is
less. 4 hours in each of 3 mutually
Insert and withdraw a .020 inch
diameter polished steel test pin 50
times at a maximum rate of 500
cycles per hour.
Figure 1 (continued)
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330 grams maximum.
Measure the force necessary to
insert a .020 inch diameter polished
steel test pin at a maximum rate of
12.7 mm [.5 in] per minute.
Measure force necessary to
withdraw a .016 inch diameter
polished steel test pin at a
maximum rate of 12.7 mm [.5 in]
Measure force necessary to push a
contact out of an .039 inch diameter
plated through hole.
16 grams minimum.
2,267 grams minimum.
EIA-364-32, Test Condition IV.
Subject specimens to 5 cycles
between -65 and 150°
EIA-364-31, Method III.
Subject specimens to 10 cycles (10
days) between 25 and 65° at 80 to
EIA-364-26, Test Condition B.
Subject specimens to a 5% salt fog
mist for 48 hours.
EIA-364-32, Test Condition VII.
Except: Subject specimens to 100
cycles between -40 and 120°
dwell time and transition time shall
be 30 minutes (120 minute cycle).
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
Figure 1 (end)
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Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
Test Sequence (b)
Examination of product
Low level contact resistance
Temperature rise vs current
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
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QUALITY ASSURANCE PROVISIONS
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. All test groups shall each consist of a minimum of 32
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Low level Contact Resistance Measurement Points
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