Quartz Crystal Resonator HC49/US Short Thru-Hole 2.5mm Height Metal Resistance Weld Seal 15.360MHz ±30ppm at 25°C ±50ppm over -20°C to +70°C 12pF Parallel Resonant
参数
参数名称
属性值
Brand Name
Ecliptek
是否无铅
不含铅
是否Rohs认证
符合
零件包装代码
HC-49/US Short
针数
2
制造商包装代码
HC-49/US Short
Reach Compliance Code
163
老化
5 PPM/YEAR
Base Number Matches
1
文档预览
E1UEA12-15.360M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Sep 8, 2020)
191 SVHC
ITEM DESCRIPTION
Quartz Crystal Resonator HC49/US Short Thru-Hole 2.5mm Height Metal Resistance Weld Seal 15.360MHz ±30ppm at 25°C,
±50ppm over -20°C to +70°C 12pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance
Equivalent Series Resistance
Mode of Operation
Drive Level
Storage Temperature Range
Insulation Resistance
15.360MHz
±30ppm at 25°C, ±50ppm over -20°C to +70°C
±5ppm/year Maximum
12pF Parallel Resonant
7pF Maximum
60 Ohms Maximum
AT-Cut Fundamental
1mWatt Maximum
-55°C to +125°C
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Lead Integrity
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
MIL-STD-202, Method 213, Condition C
MIL-STD-883, Method 1004
J-STD-020, MSL1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 1 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
E1UEA12-15.360M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
E15.360M
E=Ecliptek Designator
6.35
MIN
DIA 0.457
±0.051(X2)
11.18
MAX
4.88 ±0.20
2.50 MAX
4.70
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 2 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
E1UEA12-15.360M
Recommended Solder Reflow Methods
High Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads only.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 3 of 4
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
E1UEA12-15.360M
Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times
5°C/Second Maximum
N/A
Level 1
Temperatures shown are applied to back of PCB board and device leads only.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to back of PCB board and
device leads only.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to back of PCB board and device
leads only.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 11/09/2015 | Page 4 of 4
Quartz Crystal Resonator HC49/US Short Thru-Hole 2.5mm Height Metal Resistance Weld Seal 15.360MHz ±30ppm at 25°C ±50ppm over -20°C to +70°C 12pF Parallel Resonant
Quartz Crystal Resonator HC49/US Short Thru-Hole 2.5mm Height Metal Resistance Weld Seal 15.360MHz ±30ppm at 25°C ±50ppm over -20°C to +70°C 12pF Parallel Resonant
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