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M9346-TDS3T

器件型号:M9346-TDS3T
器件类别:存储   
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
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器件描述

64 X 16 MICROWIRE BUS SERIAL EEPROM, DSO8

64 × 16 总线串行电可擦除只读存储器, DSO8

参数
功能数量1
端子数量8
最大工作温度85 Cel
最小工作温度-40 Cel
最大供电/工作电压5.5 V
最小供电/工作电压4.5 V
额定供电电压5 V
最大时钟频率2 MHz
加工封装描述2 X 3 MM, ROHS COMPLIANT, MLP-8
无铅Yes
欧盟RoHS规范Yes
状态ACTIVE
工艺CMOS
包装形状RECTANGULAR
包装尺寸SMALL OUTLINE, VERY THIN PROFILE
表面贴装Yes
端子形式NO LEAD
端子间距0.5000 mm
端子涂层NOT SPECIFIED
端子位置DUAL
包装材料UNSPECIFIED
温度等级INDUSTRIAL
内存宽度16
组织64 X 16
存储密度1024 deg
操作模式SYNCHRONOUS
位数64 words
位数64
备用存储器宽度8
内存IC类型MICROWIRE BUS SERIAL EEPROM
串行并行SERIAL
写周期最大TWC5 ms

文档预览

M93C86, M93C76, M93C66
M93C56, M93C46
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide)
MICROWIRE® Serial Access EEPROM
FEATURES SUMMARY
s
s
s
s
s
s
s
s
s
s
s
Industry Standard MICROWIRE Bus
Single Supply Voltage:
– 4.5 to 5.5V for M93Cx6
– 2.5 to 5.5V for M93Cx6-W
– 1.8 to 5.5V for M93Cx6-R
Dual Organization: by Word (x16) or Byte (x8)
Programming Instructions that work on: Byte,
Word or Entire Memory
Self-timed Programming Cycle with Auto-
Erase
Ready/Busy Signal During Programming
Speed:
– 1MHz Clock Rate, 10ms Write Time
(Current product, identified by process
identification letter F or M)
– 2MHz Clock Rate, 5ms Write Time (New
Product, identified by process
identification letter W or G or S)
Sequential Read Operation
Enhanced ESD/Latch-Up Behaviour
More than 1 Million Erase/Write Cycles
More than 40 Year Data Retention
Figure 1. Packages
8
1
PDIP8 (BN)
8
1
SO8 (MN)
150 mil width
Table 1. Product List
Reference
Part
Number
M93C86
M93C86
M93C86-W
M93C86-R
M93C76
M93C76
M93C76-W
M93C76-R
M93C66
M93C66
M93C66-W
M93C66-R
UFDFPN8 (MB)
2x3mm² (MLP)
M93C46
M93C56
Reference
Part
Number
M93C56
M93C56-W
M93C56-R
M93C46
M93C46-W
M93C46-R
TSSOP8 (DS)
3x3mm² body size (MSOP)
TSSOP8 (DW)
169 mil width
August 2004
1/31
M93C86, M93C76, M93C66, M93C56, M93C46
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 1.
Figure 1.
Figure 2.
Table 2.
Table 3.
Table 4.
Figure 3.
Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Memory Size versus Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Instruction Set for the M93Cx6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
DIP, SO, TSSOP and MLP Connections (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
POWER-ON DATA PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 5. Instruction Set for the M93C46 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 6. Instruction Set for the M93C56 and M93C66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 7. Instruction Set for the M93C76 and M93C86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Erase/Write Enable and Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. READ, WRITE, EWEN, EWDS Sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. ERASE, ERAL Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Erase All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. WRAL Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
READY/BUSY STATUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
COMMON I/O OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
CLOCK PULSE COUNTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Write Sequence with One Clock Glitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Operating Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 10. Operating Conditions (M93Cx6-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Operating Conditions (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 12. AC Measurement Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. AC Testing Input Output Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 14. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 15. DC Characteristics (M93Cx6, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 16. DC Characteristics (M93Cx6, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 17. DC Characteristics (M93Cx6-W, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 18. DC Characteristics (M93Cx6-W, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 19. DC Characteristics (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 20. AC Characteristics (M93Cx6, Device Grade 6, 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 21. AC Characteristics (M93Cx6-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 22. AC Characteristics (M93Cx6-W, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 23. AC Characteristics (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 9. Synchronous Timing (Start and Op-Code Input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 10.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 11.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 12.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 23
Table 24. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 23
Figure 13.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 24
Table 25. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
24
Figure 14.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
25
Table 26. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data .
25
Figure 15.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline
26
Table 27. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data
26
Figure 16.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 27
Table 28. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 27
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 29. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 30. How to Identify Current and New Products by the Process Identification Letter . . . . . . . 29
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 31. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3/31
M93C86, M93C76, M93C66, M93C56, M93C46
SUMMARY DESCRIPTION
These electrically erasable programmable memo-
ry (EEPROM) devices are accessed through a Se-
rial Data Input (D) and Serial Data Output (Q)
using the MICROWIRE bus protocol.
Figure 2. Logic Diagram
Table 3. Memory Size versus Organization
Device
Number
of Bits
16384
8192
4096
2048
1024
Number
of 8-bit
Bytes
2048
1024
512
256
128
Number
of 16-bit
Words
1024
512
256
128
64
M93C86
M93C76
M93C66
M93C56
VCC
M93C46
D
C
M93Cx6
S
ORG
Q
The M93Cx6 is accessed by a set of instructions,
as summarized in
Table 4.,
and in more detail in
Table 5.
to
Table 7.).
Table 4. Instruction Set for the M93Cx6
Instruction
READ
WRITE
Description
Read Data from Memory
Write Data to Memory
Erase/Write Enable
Erase/Write Disable
Erase Byte or Word
Erase All Memory
Write All Memory
with same Data
Byte or Word
Data
Byte or Word
Byte or Word
VSS
AI01928
EWEN
EWDS
ERASE
ERAL
WRAL
Table 2. Signal Names
S
D
Q
C
ORG
V
CC
V
SS
Chip Select Input
Serial Data Input
Serial Data Output
Serial Clock
Organisation Select
Supply Voltage
Ground
The memory array organization may be divided
into either bytes (x8) or words (x16) which may be
selected by a signal applied on Organization Se-
lect (ORG). The bit, byte and word sizes of the
memories are as shown in
Table 3..
A Read Data from Memory (READ) instruction
loads the address of the first byte or word to be
read in an internal address register. The data at
this address is then clocked out serially. The ad-
dress register is automatically incremented after
the data is output and, if Chip Select Input (S) is
held High, the M93Cx6 can output a sequential
stream of data bytes or words. In this way, the
memory can be read as a data stream from eight
to 16384 bits long (in the case of the M93C86), or
continuously (the address counter automatically
rolls over to 00h when the highest address is
reached).
Programming is internally self-timed (the external
clock signal on Serial Clock (C) may be stopped or
left running after the start of a Write cycle) and
does not require an Erase cycle prior to the Write
instruction. The Write instruction writes 8 or 16 bits
at a time into one of the byte or word locations of
the M93Cx6. After the start of the programming cy-
cle, a Busy/Ready signal is available on Serial
Data Output (Q) when Chip Select Input (S) is driv-
en High.
4/31
M93C86, M93C76, M93C66, M93C56, M93C46
An internal Power-on Data Protection mechanism
in the M93Cx6 inhibits the device when the supply
is too low.
Figure 3. DIP, SO, TSSOP and MLP
Connections (Top View)
MEMORY ORGANIZATION
The M93Cx6 memory is organized either as bytes
(x8) or as words (x16). If Organization Select
(ORG) is left unconnected (or connected to V
CC
)
the x16 organization is selected; when Organiza-
tion Select (ORG) is connected to Ground (V
SS
)
the x8 organization is selected. When the M93Cx6
is in stand-by mode, Organization Select (ORG)
should be set either to V
SS
or V
CC
for minimum
power consumption. Any voltage between V
SS
and V
CC
applied to Organization Select (ORG)
may increase the stand-by current.
M93Cx6
S
C
D
Q
1
2
3
4
8
7
6
5
AI01929B
VCC
DU
ORG
VSS
POWER-ON DATA PROTECTION
To prevent data corruption and inadvertent write
operations during power-up, a Power-On Reset
(POR) circuit resets all internal programming cir-
cuitry, and sets the device in the Write Disable
mode.
– At Power-up and Power-down, the device
must
not
be selected (that is, Chip Select Input
(S) must be driven Low) until the supply
voltage reaches the operating value V
CC
specified in
Table 9.
to
Table 11..
– When V
CC
reaches its valid level, the device is
properly reset (in the Write Disable mode) and
is ready to decode and execute incoming
instructions.
For the M93Cx6 devices (5V range) the POR
threshold voltage is around 3V. For the M93Cx6-
W (3V range) and M93Cx6-R (2V range) the POR
threshold voltage is around 1.5V.
Note: 1. See
PACKAGE MECHANICAL
section for package di-
mensions, and how to identify pin-1.
2. DU = Don’t Use.
The DU (Don’t Use) pin does not contribute to the
normal operation of the device. It is reserved for
use by STMicroelectronics during test sequences.
The pin may be left unconnected or may be con-
nected to V
CC
or V
SS
. Direct connection of DU to
V
SS
is recommended for the lowest stand-by pow-
er consumption.
5/31
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jiangshuai2003 嵌入式系统
新能源汽车的辅助电源变压器,功率2.4-6.6kw,体积能做到多小?
新能源汽车的辅助电源变压器,功率2.4-6.6kw,体积能做到多小? 首先我们思考一个问题。在我们的认知里一个汽车辅助电源的平板变压器需要多大?是如汽车发动机般大小,还是如传统工业电源变压器一样,需要占用到两平米左右的地方。其实,它的体积也可以做到一个巴掌般大小。像这样一个小体积的变压器,你绝对想不到它居然可以做到2.4-6.6kw的大功率。而且高表面积体积比和很短的热通道,也使得它具备极好的热耗散特性,其次磁芯结构特有的几何外形能够最大程度的减小磁芯损耗,并且小体积,大功率。高频...
金昊德 开关电源学习小组

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