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cdip

在1个相关元器件中,cdip有相关的pdf资料。
器件名 厂商 描 述 功能
CDIP Amkor Ceramic Dual-Inline Package 下载
cdip的相关参数为:

器件描述

Ceramic Dual-Inline Package

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data sheet
Ceramic Dual-Inline Package
(CDIP / CerDIP)
Amkor Technology is committed to continuing to
service this long established standard industry
package. The Amkor Technology CDIP capability
provides a wide range of lead counts and body
sizes. The CDIP is a hermetic package consisting of
two pieces of dry pressed ceramic surrounding a
"DIP formed" leadframe. The ceramic / LF /
ceramic system is held together hermetically by
frit glass reflowed at temperatures between
400° - 460° Centigrade.
Applications:
Along with the other standard industry packages,
the CDIP has a proven track record and is still
being used by semiconductor technologies such as:
Digital to Analog converters, EPROMS, Air bag
sensors, Logic, Memory, Microcontrollers, and
Video controllers. Some end applications are:
Military electronics, Commercial electronics,
Automotive and Telecommunications.
Features:
CERAMIC
/
HERMETIC
CDIP / CerDIP
The CDIP offers a variety of features:
300 mil package body width with lead counts
from 8L to 28L
400 mil package body width with lead counts
of 22L & 24L
600 mil package body width with lead counts
from 24L to 40L
100 mil lead pitch
High thermal conductive ceramic
Matte Tin lead finish
JEDEC standard compliant
Wide selection of available cavity sizes to meet
most die size needs
Commercial or full Military flows
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS801
Rev Date: 08’02
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