器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
C1206C226M8PAC | KEMET(基美) | Capacitor, Ceramic, Chip, General Purpose, 22uF, 6.3V, ±20%, X5R, 1206 (3216 mm), Sn/NiBar, -55º ~ +85ºC, 7" Reel/Unmarked | 下载 |
C1206C226M8PAC3810 | KEMET(基美) | Multilayer Ceramic Capacitors MLCC - SMD/SMT 22.0UF 10.0V | 下载 |
C1206C226M8PAC7210 | KEMET(基美) | Capacitor, Ceramic, Chip, General Purpose, 22uF, 6.3V, ±20%, X5R, 1206 (3216 mm), Sn/NiBar, -55º ~ +85ºC, 13\" Reel/Unmarked | 下载 |
C1206C226M8PAC7215 | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, -/+15ppm/Cel TC, 22uF, 1206, | 下载 |
C1206C226M8PAC7533 | KEMET(基美) | Multilayer Ceramic Capacitors MLCC - SMD/SMT 22.0UF 10.0V | 下载 |
C1206C226M8PAC7800 | KEMET(基美) | Capacitor, Ceramic, Chip, General Purpose, 22uF, 6.3V, ±20%, X5R, 1206 (3216 mm), Sn/NiBar, -55º ~ +85ºC, 7\" Reel/Unmarked | 下载 |
C1206C226M8PACTM | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT | 下载 |
C1206C226M8PACTU | KEMET(基美) | Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3volts 47uF 20% X5R | 下载 |
对应元器件 | pdf文档资料下载 |
---|---|
C1206C226M8PAC 、 C1206C226M8PACTU | 下载文档 |
C1206C226M8PACTM | 下载文档 |
C1206C226M8PAC7800 | 下载文档 |
C1206C226M8PAC7210 | 下载文档 |
C1206C226M8PAC3810 | 下载文档 |
C1206C226M8PAC7533 | 下载文档 |
型号 | C1206C226M8PACTU | C1206C226M8PAC |
---|---|---|
描述 | Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3volts 47uF 20% X5R | Capacitor, Ceramic, Chip, General Purpose, 22uF, 6.3V, ±20%, X5R, 1206 (3216 mm), Sn/NiBar, -55º ~ +85ºC, 7" Reel/Unmarked |
是否无铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 |
零件包装代码 | 1206 | 1206 |
包装说明 | , 1206 | , 1206 |
Reach Compliance Code | compliant | compliant |
ECCN代码 | EAR99 | EAR99 |
Factory Lead Time | 8 weeks | 79 weeks 2 days |
电容 | 22 µF | 22 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC |
高度 | 1.6 mm | 1.6 mm |
JESD-609代码 | e3 | e3 |
长度 | 3.2 mm | 3.2 mm |
安装特点 | SURFACE MOUNT | SURFACE MOUNT |
多层 | Yes | Yes |
负容差 | 20% | 20% |
端子数量 | 2 | 2 |
最高工作温度 | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
封装形式 | SMT | SMT |
包装方法 | TR, Embossed Plastic, 7 Inch | TR, EMBOSSED PLASTIC, 7 INCH |
正容差 | 20% | 20% |
额定(直流)电压(URdc) | 10 V | 10 V |
尺寸代码 | 1206 | 1206 |
表面贴装 | YES | YES |
温度特性代码 | X5R | X5R |
温度系数 | 15% ppm/°C | 15% ppm/°C |
端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier |
端子形状 | WRAPAROUND | WRAPAROUND |
宽度 | 1.6 mm | 1.6 mm |
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