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ZG2101M

器件型号:ZG2101M
器件类别:通信   
厂商名称:Microchip
厂商官网:https://www.microchip.com
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器件描述

SPECIALTY TELECOM CIRCUIT, DMA

专业电信电路, 直接存储器存取

参数

ZG2101M功能数量 1
ZG2101M最大工作温度 70 Cel
ZG2101M最小工作温度 0.0 Cel
ZG2101M额定供电电压 3.3 V
ZG2101M无铅 Yes
ZG2101M欧盟RoHS规范 Yes
ZG2101M中国RoHS规范 Yes
ZG2101M状态 ACTIVE
ZG2101M包装形状 RECTANGULAR
ZG2101M包装尺寸 MICROELECTRONIC ASSEMBLY
ZG2101M端子形式 NO LEAD
ZG2101M端子涂层 MATTE TIN
ZG2101M端子位置 DUAL
ZG2101M包装材料 UNSPECIFIED
ZG2101M温度等级 COMMERCIAL
ZG2101M通信类型 TELECOM CIRCUIT

ZG2101M器件文档内容

                                 M

                              ZG2100M/ZG2101M
                                      Wi-Fi Module
                                           Data Sheet

                             2.4 GHz 802.11b Low Power
                                        Transceiver Module

2010 Microchip Technology  DS70624A page 1
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
      intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
      knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
      Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
      mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device             Trademarks
applications and the like is provided only for your convenience and
may be superseded by updates. It is your responsibility to ensure      The Microchip name and logo, the Microchip logo, dsPIC,
that your application meets with your specifications. MICROCHIP        KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32
MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY                          logo, rfPIC and UNI/O are registered trademarks of Microchip
KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL,                      Technology Incorporated in the U.S.A. and other countries.
STATUTORY OR OTHERWISE, RELATED TO THE
INFORMATION, INCLUDING BUT NOT LIMITED TO ITS                          FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY                       MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions
OR FITNESS FOR PURPOSE. -Microchip disclaims all liability             Company are registered trademarks of Microchip Technology
arising from this information and its use. Use of Microchip devices    Incorporated in the U.S.A.
in life support and/or safety applications is entirely at the buyer's
risk, and the buyer agrees to defend, indemnify and hold harmless      Analog-for-the-Digital Age, Application Maestro, CodeGuard,
Microchip from any and all damages, claims, suits, or expenses         dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
resulting from such use. No licenses are conveyed, implicitly or       ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
otherwise, under any Microchip -intellectual property rights.          Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo,
                                                                        MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
DS70624A page 2                                                       Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
                                                                        PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
                                                                        TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of
                                                                        Microchip Technology Incorporated in the U.S.A. and other
                                                                        countries.

                                                                        SQTP is a service mark of Microchip Technology Incorporated in
                                                                        the U.S.A.

                                                                        All other trademarks mentioned herein are property of their
                                                                        respective companies.

                                                                         2010, Microchip Technology Incorporated, Printed in the
                                                                        U.S.A., All Rights Reserved.

                                                                            Printed on recycled paper.

                                                                        ISBN: 978-1-60932-064-5

                                                                        Microchip received ISO/TS-16949:2002 certification for its worldwide
                                                                        headquarters, design and wafer fabrication facilities in Chandler and
                                                                        Tempe, Arizona; Gresham, Oregon and design centers in California and
                                                                        India. The Company's quality system processes and procedures are for its
                                                                        PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial
                                                                        EEPROMs, microperipherals, nonvolatile memory and analog products. In
                                                                        addition, Microchip's quality system for the design and manufacture of
                                                                        development systems is ISO 9001:2000 certified.

                                                                                                                         2010 Microchip Technology
                                                   ZG2100M/ZG2101M

2.4 GHz 802.11b Low Power Transceiver Module

    Utility and                 Consumer           Industrial
Smart Energy                   Electronics         Controls

- Thermostats                - Remote Control  - Chemical Sensors
- Smart Meters               - Internet Radio  - HVAC
- White Goods                - Home Security   - Security Systems
- HVAC                       - Toys            - M2M

                                                    Communication

Remote Device                       Retail          Medical,
  Management                                     Fitness, and
                             - POS Terminals      Healthcare
- Location and Asset
     Tracking                - Wireless Price  - Glucose Meters
                                  Tags         - Fitness Equipment
- Automotive                                   - Patient Asset
- Code Update                - Digital Remote
                                  Signage           Tracking

Features

    Single-chip 802.11b including MAC, baseband, RF and power amplifier
    Data Rate: 1 & 2 Mbps
    802.11b/g/n compatible
    Low power operation
    API for embedded markets, no OS required
    PCB or external antenna options
    Hardware support for AES and RC4 based ciphers (WEP, WPA, WPA2 security)
    SPI slave interface with interrupt
    Single 3.3V supply, operates from 2.7V to 3.6V (see section 5)
    21mm x 31mm 36-pin Dual Flat pack PCB SM Package
    Wi-Fi Certified, RoHS and CE compliant
    FCC Certified (USA, FCC ID: W7O-ZG2100-ZG2101)
    IC Certified (IC: 8248A-G21ZEROG)
    Fully compliant with EU & meets the R&TTE Directive for Radio Spectrum
    Radio Type Approval Certified (Japan, ZG2100M based solution ID: AC164136-2

         005WWCA0311 005GZCA0149)

2010 Microchip Technology                                         DS70624A page 3
ZG2100M/ZG2101M

          Description

               The ZG2100M & ZG2101M modules are low-power 802.11b implementations. All RF
               components, the baseband and the entirety of the 802.11 MAC reside on-module, creating a
               simple and cost-effective means to add Wi-Fi connectivity for embedded devices. The
               module(s) implement a high-level API, simplifying design implementation and allowing the
               ZG2100M or ZG2101M to be integrated with 8- and 16-bit host microcontrollers. Hardware
               accelerators support the latest Wi-Fi security standards.

Figure 1: ZG2100M/ZG2101M Module: Functional Block Diagram

DS70624A page 4                                           2010 Microchip Technology
                                                ZG2100M/ZG2101M

                             Table of Contents

1.  1. Key Features .............................................................................................................................................6

2.  Detailed Description ......................................................................................................................................7

    2.1 ....... Overview...........................................................................................................................................7

    2.2 ....... Supply Blocks and Boot-Up Sequence for Single 3.3V Supply........................................................7

    2.3 ....... ZG2100 Power States ......................................................................................................................9

    2.4 ....... Electrostatic discharge (ESD).........................................................................................................10

    2.5 ....... JTAG Interface................................................................................................................................10

    2.6 ....... Serial Interface for Trace ................................................................................................................10

    2.7 ....... SPI Interface ...................................................................................................................................10

    2.7.1 SPI Slave Interface with Interrupt for Host Operation .......................................................10

    2.7.2 Host-Control SPI Interface.................................................................................................10

    2.7.3 SPI Timing Characteristics ................................................................................................11

    2.7.4 SPI Timing .........................................................................................................................12

    2.7.5 SPI Register Access..........................................................................................................13

    2.8 ....... FIFO Interface.................................................................................................................................14

    2.8.1 FIFO Read .........................................................................................................................14

    2.8.2 FIFO Write .........................................................................................................................15

    2.9 ....... Fully-Integrated Radio ....................................................................................................................15

    2.10 ..... Internal ROM/RAM/NVM ................................................................................................................15

    2.11 ..... Hardware Support for AES and TKIP .............................................................................................15

3.  ZG2100M/ZG2101M Pin-Out and Function ................................................................................................16

4.  Package Information....................................................................................................................................18

    4.1. ...... Module Drawing..............................................................................................................................18

    4.2 ....... Module Layout Guidelines ..............................................................................................................20

    4.3 ....... Module Use Schematic...................................................................................................................21

5.  Electrical Characteristics .............................................................................................................................23

    5.1 ....... Power Consumption .......................................................................................................................23

6.  Radio Characteristics ..................................................................................................................................25

    6.1 ....... Transmitter 2.4GHz Band...............................................................................................................25

    6.2 ....... Receiver 2.4GHz Band...................................................................................................................25

7.  Digital Electrical Characteristics ..................................................................................................................26

8.  Module Reflow Profile..................................................................................................................................27

9.  Ordering Information....................................................................................................................................28

10. Regulatory Notes .........................................................................................................................................29

11. Revision History...........................................................................................................................................31

2010 Microchip Technology                     DS70624A page 5
ZG2100M/ZG2101M

1 Key Features

          Ease of Software Development

               Simple API suited for embedded market
               Targeted for low resource host processors
               Entire MAC integrated on-chip
               Serialized MAC address, each device comes with an unique MAC address in range

                   001EC0xxxxxx
               Simple usage model, no requirement for OS

          Low Power Operation

               Low power, 250uA sleep mode with fast wake up, 0.1uA hibernate,
               Sleep power state managed by ZG2100, enabling low average power while

                   maintaining AP association without host control
               Battery operable from 2.7v to 3.6v (see power specs for limitations)

          RF

               Integrated PA
               Support for external PA for high RF output power applications
               Power output +10dBm typical at antenna
               Power output programmable from +0dBm to meet varying application needs
               Min RX sens.of-91dBm @ 1MB/Sec. at antenna
               Integrated PCB antenna (ZG2100M)
               Support for external antenna available (ZG2101M)

          Low External Component Count

               Fully integrated RF frequency synthesizer, reference clock, and Integrated PA
               Single 3.3V supply

          Wi-Fi & Regulatory

               Supports 1Mbps & 2Mbps and module-based solutions are "Wi-Fi certified" for
                   802.11b

               Hardware support for AES, and RC4 based ciphers (WEP, WPA, WPA2 security)
               FCC Certified (USA, FCC ID: W7O-ZG2100-ZG2101), IC Certified (IC: 8248A-

                   G21ZEROG), Radio Type Approval Certified (Japan, ZG2100M based solution ID:
                   AC164136-2 005WWCA0311 005GZCA0149, Wi-Fi Certified, RoHS and CE
                   compliant, and fully compliant with European Market and meet the R&TTE Directive
                   for Radio Spectrum

DS70624A page 6   2010 Microchip Technology
                             ZG2100M/ZG2101M

2. Detailed Description

2.1  Overview
2.2
     The ZG2100 single-chip 802.11b transceiver includes MAC, baseband, RF and power
     amplifier, and built in hardware support for AES, and TKIP (WEP, WPA, WPA2 security).
     The device has an API targeted for embedded markets so an operating system is not
     required for operation. There is a fully integrated radio ideal for 1 & 2Mbps operation with
     optional support for external PA and antenna switch operation.
     The ZG2100M modules incorporate the ZeroG ZG2100 single chip 802.11b transceiver with
     all associated RF components, crystal oscillator, and bypass and bias passives along with a
     printed antenna to provide a fully integrated Wi-Fi I/O solution controllable from an 8 or 16-
     bit processor. The ZG2101M module is similar but bypasses the on-board PCB antenna
     and uses a U.FL connector for connection to an external antenna.
     Interface is via SPI slave interface with interrupt for HOST operation. The modules support
     RS232 serial interfaces (requires level shifter) for debug and JTAG boundary scan.
     Operation is via a single 3.3V supply, supporting various power states, such as hibernate
     and SLEEP, for end applications long battery life. ZG2100M contains a built in PCB antenna
     for ease of system integration and significant BOM reduction.
     The module is manufactured on an FR4 PCB substrate, with components on the top surface
     only. Connection is made as a surface mount component via flat pack (no pin) connections
     on two sides.

     Supply Blocks and Boot-Up Sequence for Single 3.3V Supply

     The internal regulators for the digital and analog core power supplies are enabled by
     keeping the chip enable pin (CE_N) low. The waveforms for the core supplies, illustrated on
     the following page, as shown when powering up the ZG2100M/ZG2101M with a nominal
     3.3V applied to VDD_3.3. There is an internal power-on-reset detect which starts the boot
     sequence from the internal ROM when the core supply (VDD_1.8) is up. After
     approximately 50 ms from when VDD_3.3 supply is within specification, the
     ZG2100M/ZG2101M is ready for operation.

2010 Microchip Technology  DS70624A page 7
ZG2100M/ZG2101M

Figure 2: ZG2100M/ZG2101M Boot Sequence Timing.
Refer to Section 4.1 Electrical Characteristics, Note 1.

DS70624A page 8                                          2010 Microchip Technology
                                                              ZG2100M/ZG2101M

2.3 ZG2100 Power States

The power state definitions are as follows:

           VDD_3.3  CE_N Circuitry
           0V
OFF        3.3V     0V   Power disconnected to ZG2100
HIBERNATE  3.3V
SLEEP      3.3V     3.3V All internal circuitries are OFF
RX ON      3.3V
TX ON               0V   Reference clock and internal bias circuitry are ON
STANDBY
                    0V   Receive circuits are ON

                    0V   Transmit circuits are ON

                         Transition State Only

               Figure 3: ZG2100M/ZG2101M Power State Diagram  DS70624A page 9

2010 Microchip Technology
ZG2100M/ZG2101M

2.4 Electrostatic discharge (ESD)

       The ZG2100 IC, integrated within the ZG2100M/ZG2101M, has passed ESD HBM JEDEC
       Standard No. 22-A114 / 2000 Volts and ESD CDM JEDEC Standard No. 22-C101 / 500V all
       pins. Users must exercise ESD handling precautions when working with the product either
       in component form, or exposed PCBs.

2.5 JTAG Interface

       Joint Test Action Group (JTAG) is the common name used for the IEEE 1149.1 standard
       entitled Standard Test Access Port and Boundary-Scan Architecture for test access ports
       used for testing printed circuit boards using boundary scan. ZG2100M/ZG2101M supports
       JTAG boundary scan. JTAG_EN and JTAG_RST_N need to be driven HIGH to enable
       JTAG mode.

2.6 Serial Interface for Trace

       ZG2100M/ZG2101M incorporates Transmitted Data pin (UART0_TX) and Received Data
       pin (UART0_RX) for serial testing purposes. These pins can be connected to commercially
       available RS-232 line drivers/ receivers with appropriate external level shifters. The
       ZG2100 serial interface is fully tested at 115200 bits/seconds baud rate with RS232/UART
       interface applications.

2.7 SPI Interface

2.7.1  SPI Slave Interface with Interrupt for Host Operation
2.7.2
       The slave Serial Peripheral Interface Bus (SPI) is used to interface with the HOST. The
       slave SPI interface works with ZG2100M/ZG2101M Interrupt line (INT_NX). When data is
       available for the HOST during operation, the INT_NX line is asserted low by ZG2100. The
       INT_NX line is de-asserted high, by ZG2100M/ZG2101M, after the data is transferred to the
       HOST SPI buffer. The SPI CLK Speed can be up to 25MHz.

       Host-Control SPI Interface

       The slave SPI interface implements the [CPOL=0; CPHA=0] and [CPOL=0; CPHA=1]
       modes (0 and 3) of operation. That is, data is clocked in on the first rising edge of the clock
       after Chip Select goes valid.

       Data on the bus is required to be big endian, with most significant bit on the bus first and
       least significant bit going last. There are two decode regions. One for register access and
       one for a FIFO interface. Operation for both regions is shown below. The INT_NX signal
       allows interrupts to be signaled to the host device.

DS70624A page 10                  2010 Microchip Technology
                                                      ZG2100M/ZG2101M

As an example of any 32-bit register access, suppose a write to register 0xF0_0F18 is
desired:

Write to host register 0x38 with addr[31:16] (0x00f0). 24 bit transaction.
Write to host register 0x39 with addr[15:0] (0x0F18). 24 bit transaction.
Write to host register 0x3a with data[31:16]. 24 bit transaction.
Write to host register 0x3b with data[15:0]. 24 bit transaction.
Write to host register 0x37 with a byte that has the following pattern: 8 bit transaction
[7:4] byte enables (active high for the valid bytes that you want to write in steps 3 and 4).
[3:0] - 4'b0001 -> activate write to register

For a read of 0xF0_0D00:
Write to host register 0x38 with addr[31:16] (0x00F0). 24 bit transaction.
Write to host register 0x39 with addr[15:0] (0x0F18). 24 bit transaction.
Write to host register 0x37 with a byte that has the following pattern: 8 bit transaction
[7:4] byte enables (active high for the valid bytes that you want to read in steps 1 and 2).
[3:0] - 4'b0011 -> active read of register
Read host register 0x3a to get data [31:24] 24 bit transaction
Read host register 0x3b to get data [15:0] 24 bit transaction
Each of the steps above is a single SPI transaction; the chip select (CE_N) is active low
during each step.

2.7.3 SPI Timing Characteristics

Characteristic                                        Min   Max
SPI, Data setup to falling clock
SPI, Data hold from falling clock                     1 ns
SPI SLAVE CLK
SPI MASTER CLK                                        1 ns

                                                            25 MHz

                                                            25 MHz

Figure 4: ZG2100M/ZG2101M SPI Timing Characteristics

2010 Microchip Technology                                 DS70624A page 11
ZG2100M/ZG2101M

2.74 SPI Timing

Figure 5: ZG2100M/ZG2101M SPI Timing Waveform

                    Symbol  Parameter          Min    Typ  Max

                     Tsck    SCK Clock Period  40 ns       15 ns
                      Tcs   SCS_N High Time    50 ns       15 ns
                     Tcss   SCS_N Setup Time   50 ns
                     Tcsh   SCS_N Hold Time    50 ns
                    Tsetup                     10 ns
                    Thold     SDI Setup Time   10 ns
                    Tvalid     SDI Hold Time
                      Tho       Output Valid     0
                             Output Hold Time

Figure 6: ZG2100M/ZG2101M SPI Timing Data

DS70624A page 12                                     2010 Microchip Technology
                             ZG2100M/ZG2101M

2.7.5 SPI Register Access

Figure 7: ZG2100M/ZG2101M SPI Register Access

F is a select between FIFO space and register space. If this bit is a 1, the data FIFO space
is selected. If this bit is a 0, the register address space is selected.

R is the Read/Write bit. If this bit is a 1, the operation is a read. If this bit is a 0, the
operation is a write

ADDR0 is the starting address for the transaction. This value is only used for register
accesses and is ignored during FIFO accesses.

WDATAn is the write data byte. This is only used from write operations and is ignored during
read operations.

RDATAn is the read data byte. This is always valid for both, read and write operations. If
contains the current value of any register location.

HOST_INTR is the 8-bit interrupt register.

2010 Microchip Technology  DS70624A page 13
ZG2100M/ZG2101M

2.8 FIFO Interface

                HOST FIFO Basic Commands
                FCMD[2:0]

                    0x0 RFIFO_CMD
                    0x1 WCONT (Continue Previous Packet)
                    0x2 WSTART0 (Start Packet, head/continue)
                    0x3 WSTART1 (Start Packet, head0/continue)
                    0x4 WEND CMD
                    0x5 REND CMD

2.8.1 FIFO Read

                Figure 8: ZG2100M/ZG2101M FIFO Read Timing

DS70624A page 14                                                 2010 Microchip Technology
                             ZG2100M/ZG2101M

2.8.2 FIFO Write

               Figure 9: ZG2100M/ZG2101M FIFO Write Timing

2.9 Fully-Integrated Radio

               ZG2100M/ZG2101M incorporates a fully integrated radio Ideal for 1 & 2 Mbps operation with
               optional support for external PA operation. The direct conversion TX design incorporates an
               integrated PA, with up to +10dBm typical at antenna, and fully integrated internal power
               control loop. The direct conversion RX chain utilizes Automatic Gain Control that allows
               ZG2100M/ZG2101M to receive with a minimum input Level sensitivity (1Mbps @ <8% PER)
               of -91 dBm typical at the antenna. The ZG2100M/ZG2101M only needs an external crystal
               for a reference clock.

2.10 Internal ROM/RAM/NVM

               ZG2100M/ZG2101M incorporates internal ROM, RAM, and NVM. The internal ROM and
               RAM are reserved only for ZG2100M/ZG2101M operations. The NVM holds information
               such as the MAC address, TX manufacturing calibration values, and frequency calibration
               values.

2.11 Hardware Support for AES and TKIP

               ZG2100M/ZG2101M supports Wi-Fi encryption methodology (AES and RC4 based ciphers).

2010 Microchip Technology  DS70624A page 15
ZG2100M/ZG2101M

3. ZG2100M/ZG2101M Pin-Out and Function

Pins Name           Internal     Required     Description
                      Bias    Bias Resistor
  1 GND                H      Constant drive  Ground
  2 VDD_1.8            H      Constant drive  See below
  3 JTAG_TDO           H      Constant drive  JTAG data out
  4 JTAG_TCK                                  JTAG Clock in
  5 JTAG_TMS            L        Pull-down    JTAG Mode in
  6 JTAG_TDI           H                      JTAG data in
  7 RST_N                     Constant drive  Chip reset in
  8 DNC                                       Do Not Connect
                                   Pull-up    JTAG Reset in, pulling this pin low will
  9 JTAG_RST_N                Constant drive  keep JTAG idle (reset)
                              Constant drive  Ground
10 GND                                       See below
11 VDD_1.8                                   Do Not Connect
12 DNC                                       Do Not Connect
13 DNC                                       Do Not Connect
14 DNC                                       Do Not Connect
15 DNC                                       FLASH Write Protect. See below.
16 RES                                       3.3V Power
17 VDD_3.3                                   Ground
18 GND                                       Ground
19 GND                                       Chip enable in
20 CE_N                                      JTAG Enable in, this pin needs to be high
                                              for Boundary Scan use
21 JTAG_EN                                   Do Not Connect
                                              Serial chip select from host (input)
22 DNC                                       See below
23 SCS_N                                     Ground
24 VDD_1.8                                   Debug Serial in
25 GND                                       Debug Serial out
26 UART_RX                                   Ground
27 UART_TX                                   3.3V Power
28 GND                                       Ground
29 VDD_3.3                                   See below
30 GND                                       Serial data out to host
31 VDD_1.8                                   Interrupt to host (output)
32 SDO                                       Serial clock in from host
33 INT_NX                                    Serial data in from host
34 SCK                                       Ground
35 SDI
36 GND

DS70624A page 16                            2010 Microchip Technology
                                               ZG2100M/ZG2101M

Notes:

1. VDD_1.8 is an internally used supply rail. DO NOT USE these pins to drive other
components.
2. Signals that note "Constant drive" must either be constantly driven by the host, or have a
pullup or pulldown in case the host is likely to tri-state the signal during power down modes.
The constant drive is used to ensure defined operation of the part and to minimize leakage
current during low power modes.
3. RES is used as write-protect for the internal module SPI Flash. For production use, this
pin should be pulled low. Host control will enable in-field FLASH updates.

2010 Microchip Technology  DS70624A page 17
ZG2100M/ZG2101M

4. Package Information

4.1 Module Drawing

               Figure 10: ZG2100M Module Physical Dimensions

                All measurements are in millimeters. Tolerances for measures 0-10 mm is +/- 0.05 mm.
                Tolerances for measures 10-50 mm is +/- 0.1 mm

Figure 11: ZG2101M Module Physical Dimensions

All measurements are in millimeters. Tolerances for measures 0-10 mm is +/- 0.05 mm.
Tolerances for measures 10-50 mm is +/- 0.1 mm

DS70624A page 18   2010 Microchip Technology
                                               ZG2100M/ZG2101M

Figure 12: ZG2100M/ZG2101M Module Layout Pad Dimensions

2010 Microchip Technology  DS70624A page 19
ZG2100M/ZG2101M

4.2 Module Layout Guidelines

Figure 13: ZG2100M "Keep Out" Areas.

In addition to the guidelines in Figure 13, note the following suggestions:
ZG2100M and ZG2101M
Bypass capacitors for VDD_3.3 should be as close as possible.
Do not route any nets to VDD_1.8
Do not use VDD_1.8 to source any external nets.
Never place the antenna very close to metallic objects.
The external antennas need a reasonable ground plane area for antenna efficiency.
ZG2100M onboard PCB antenna specific
Do not use a metallic or metalized plastic for the end product enclosure.
Keep Plastic enclosure 1cm min height above the ZG2100M PCB antenna while

    maintaining the keep-out area, as shown in Figure 13.

DS70624A page 20             2010 Microchip Technology
                                                  ZG2100M/ZG2101M

4.3 Module Use Schematic

Figure 14: ZG2100M/ZG2101M Module Use Schematic.

2010 Microchip Technology                       DS70624A page 21
ZG2100M/ZG2101M

               Figure 15: ZG2101M Antenna Connector/RF port diagram
               Other Notes:
              1. If RST_N is always driven by the HOST, the RC circuit is not needed on this pin.
              2. RES is used as write-protect for the internal module SPI Flash. For production use, this

                     pin should be pulled low. Host control will enable in-field FLASH updates.
              3. It's recommended to connect UART_RX/TX (pins 26 and 27) to surface mount test

                     points or header points, on the board, for optional connection to Hyperterminal for
                     debugging purposes. Otherwise, they can be left as No Connects.
              4. Ensure the HOST always drives the SPI port, even when not in use; otherwise, put 4.7K
                     pull ups, to VDD_3.3, on SDI, SCK, and SCS_N.

DS70624A page 22   2010 Microchip Technology
                                                             ZG2100M/ZG2101M

5. Electrical Characteristics                                 Min               Max
                                                             -40C
               Absolute Maximum Ratings:                       0V             +125C
                                                                               4.2V
                Rating                                       -0.3 V          0.5mSec
                Storage Temperature                                            5.5 V
                3V supply (VDD_3.3)
                VDD_3.3                                       Min       Typ   Max
                SDI, SCS_N, and SCK pins                       0C            +70C
                                                             2.70V     3.3V  3.63V
               Recommended Operating Conditions:             2.80V   3.3V    3.63V
                Operating Condition                          2.97V   3.3V    3.63V
                Ambient Temperature Range, commercial parts
                3V supply (VDD_3.3) with FCC and IC cert
                3V supply (VDD_3.3) for ETSI cert
                3V supply (VDD_3.3) for Japan cert

5.1  Power Consumption

     Nominal conditions: 25C, VDD_3.3=3.3V                          Min Typ Max Unit

      Power Conservation Modes                                       0.1     uA
      Hibernate, CE_N=3.3v
      Sleep                                                          250     uA
      Standby (transitional power state)
      Core Supply                                                    10      mA
      Rx On, Receive Irx @ -83dBm with 2Mb/Sec. modulated signal
      input power at antenna port                                   Min Typ Max Unit
      Tx On, Transmit Itx, +0dBm
      Tx On, Transmit Itx, +10dBm                                    85      mA

                                                                     115     mA

                                                                     154     mA

     Electrical Characteristics Notes:
     1. If VDD_3.3V supply takes longer than Maximum ramp up time, then CE_N or RST_N

         (held in active states; CE_N=3.3V or RST_N=0V) must be used to delay module boot up
         until VDD_3.3 is within operating conditions range.

     2. For Rx On, RX chain is fully ON.

2010 Microchip Technology                                          DS70624A page 23
ZG2100M/ZG2101M

              3. For Tx On, Pout= 0dBm (measured at antenna); 2Mb/Sec. modulated signal

              4. For Tx On, Pout= +10dBm (measured at antenna); 2Mb/Sec. modulated signal

              5. 3.3V Current Consumption values represent Typical Peak currents, and the measured
                   currents conditions were done with 85% duty cycle modulated signal. WiFi applications
                   typically operate in less than 85% TX duty cycle. Tx is dependent on such criteria as
                   transmit power setting, and transmit data rate and bandwidth being used. Rx is affected
                   by connectivity distance.

              6. All characteristics in this specification are for commercial temperature rated parts only.

              7. Operation in EU and/or Japan over extended voltage range of 2.7V to 3.6V will require
                   additional certification testing by customer. The module is capable of this operation.

              8. While 3.63V is the maximum operating voltage, the module will detect an overvoltage
                   condition at 4.2V and disable the RF Transmit function. This is an RF Certification
                   behavior pertaining to disabling transmission in unforeseen overvoltage conditions.

              9. Listed Absolute Maximum Ratings are not meant for functional operation. Operation at
                   these levels is not guaranteed, and may reduce the operating life of the component.

DS70624A page 24   2010 Microchip Technology
                                                      ZG2100M/ZG2101M

6. Radio Characteristics

Nominal conditions: 25C, VDD_3.3=3.3V  Min            Max            Unit
Frequency range                       2412           2484           MHz
F_LO

6.1 Transmitter 2.4 GHz Band

Nominal conditions: 25C, VDD_3.3 =3.3V, Flo=2437MHz; 2Mb/Sec. modulated signal duty
cycled at 95% measured at recommended single ended balun output (see Figure 8).

TX                                                    Min Typ Max Unit
Average Pout (Transmit spectrum mask Compliant)
Average Pout gain step resolution from +5 to +10 dBm        +10               dBm
Average Pout gain step resolution from -5 to +5 dBm
Average Pout settled variation                                  0.5           dB

                                                                1.0           dB

                                                      -0.5           0.5 dB

6.2 Receiver 2.4 GHz Band

Nominal conditions: 25C, VDD_3.3 =3.3V, Flo=2437MHz; measured at recommended
single ended balun input (see Figure 8).

RX                                                    Min Typ Max Unit
RX Min Input Level Sensitivity, 1Mbps, 8% PER
RX Min Input Level Sensitivity, 2Mbps, 8% PER               -91               dBm
RX Max Input Level (Power), 1Mbps, 8% PER
RX Max Input Level (Power), 2Mbps,8% PER                    -88               dBm

                                                            -4                dBm

                                                            -4                dBm

2010 Microchip Technology                                          DS70624A page 25
ZG2100M/ZG2101M

7. Digital Electrical Characteristics

Nominal conditions: 25C, VDD_3.3=3.3V       Min Typ Max Unit

Characteristic                             -0.3        0.8  V
VIL (Input Low Voltage)
VIH (Input High Voltage)                   2           5.5  V
VOL (Output Low Voltage)
VOH (Output High Voltage)                              0.4  V
IOL (Low Level Output Current @ VOL Max)
IOH (High Level Output Current @ VOH Min)  2.4              V

                                                  8.5        mA

                                                  15.4       mA

DS70624A page 26                                 2010 Microchip Technology
                                                                   ZG2100M/ZG2101M

8. Module Reflow Profile

               Figure 16: ZG2100M/ZG2101M Module Reflow Setpoints  DS70624A page 27

2010 Microchip Technology
ZG2100M/ZG2101M

9. Ordering Information

Device              Comment                            Ordering Number
Description
Module              Commercial grade with PCB antenna  ZG2100MC

Module              Commercial grade for use with an external antenna ZG2101MC

DS70624A page 28                                     2010 Microchip Technology
                             ZG2100M/ZG2101M

10. Regulatory Notes

Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is
    connected.

- Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: To assure continued compliance, (example use only shielded interface cables when
connecting to computer or peripheral devices). Any changes or modifications not expressly approved
by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

IMPORTANT NOTE:
FCC & IC Radiation Exposure Statement:
This equipment complies with FCC & IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter. This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed (for example, digital device emissions, PC peripheral requirements,
etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC & IC authorizations are no longer
considered valid and the FCC & IC IDs cannot be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining separate FCC & IC authorizations.

2010 Microchip Technology  DS70624A page 29
ZG2100M/ZG2101M

End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users (for example access points, routers,
wireless ADSL modems, and similar equipment). The final end product must be labeled in a visible area
with the following: "Contains FCCID: W7OZG2100-ZG2101 & IC: 8248A-G21ZEROG".

IC Certification -- Canada
The labeling requirements for Industry Canada are similar to those of the FCC. A visible label on the
outside of the final product must display the IC labeling. The user is responsible for the end product to
comply with IC ICES-003 (Unintentional radiators)

Manual Information That Must be Included
The user's manual for end users must include the following in-formation in a prominent location.
IMPORTANT NOTE: To comply with FCC & IC RF exposure compliance requirements, the antenna
used for this transmitter must be installed to provide a separation distance of at least 20 cm from all
persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

Other notes:
ZeroG modules have been built or under development for near body exposure applications. The 20cm
statement is a standard note because absorption rate testing (commonly known as SAR or Specific
absorption rate) is not modularly transferable for FCC/IC. Thus, if a radio is being used against the
body, the end user is still responsible to test for regulatory near body exposure testing (for USA, please
refer to the following):
FCC Part 1.1037
FCC Part 2.1091 Mobile Devices
FCC Part 2.1093 Portable Devices
FCC Part 15.247 (b) (4)

DS70624A page 30   2010 Microchip Technology
                                                         ZG2100M/ZG2101M

11. Revision History

               Revision A (March 2010)
               Revision A includes document updates from version 1.0 to 2.4.

2010 Microchip Technology  DS70624A page 31
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DS70624A page 32                                                         2010 Microchip Technology
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