SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
Dimensions X1-DFN1006-2 / MiniMELF MELF Y G SOD523 SMA SMB SMC
X2-DFN1006-2 Z
6.3 SOD123 2.3 6.5 6.8 9.4
Z 1.1 4.7 3.3 4.9 SOD323 1.1 1.5 1.8 4.4
2.7 2.5 3.75 0.8 1.7 2.3 3.3
G 0.3 2.1 1.5 0.7 1.05 0.6 2.5 2.5 2.5
4.8 1.2 0.65 1.7 4.0 4.3 6.8
X 0.7 1.7 3.7 1.35
2.40
Y 0.4 1.3
C 0.7 3.5
X3-DFN0603-2 X1-DFN1006-3 / X2-DFN1006-3
Z C
X1
C X G2 Dimensions Value (in mm)
Dimensions Value (in mm) G1 Z 1.1
Y
C 0.355 G1 0.3
Z
X 0.230 G2 0.2
Y (2x) Y 0.300 X 0.7
Z 0.610 X1 0.25
Y 0.4
C 0.7
X (2x)
X1-DFN1212-3
X
Y Dimensions Value (in mm)
C 0.80
Y2 X1 X 0.42
X1 0.32
(2x) Y 0.50
Y1 0.50
Y1 Y2 1.50
(2x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 1 of 14 Suggested Pad Layout
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X1-DFN1212-3
Type B
Y3 Y2 X Dimensions Value (in mm)
C 0.80
Y X 0.42
X2 X1 0.32
X2 0.90
X1(2x) Y 0.50
Y1 Y1 0.50
(2x) Y2 0.20
Y3 1.50
C
X1-DFN1411-3
C Dimensions Value (in mm)
Z 1.38
X1 X2 G1 0.15
G2 X G2 0.15
X 0.95
Y G1 X1 0.75
X2 0.40
Y 0.75
C 0.76
Z
X1-DFN1612-6 / X2-DFN1310-6
G2 X2 Dimensions X1-DFN1612-6 X2- DFN1310-6
Y2 G1 0.15 0.16
G1 G2 0.175 0.17
b
G3 0.15 0.15
Y1
X1 0.60 0.52
X2 0.25 0.20
Y1 0.65 0.52
Y2 0.45 0.375
a 0.10 0.09
a X1 b 0.15 0.06
G3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 2 of 14 Suggested Pad Layout
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U-DFN1616-6 U-DFN1616-8
Y X2 a Dimensions Value (in mm)
C Y2 G2
Dimensions Value (in mm) G1 0.15
X2 Y1 G1
G Z 1.3 X1 C G2 0.20
Z
G 0.175 X1 0.65
X1 X1 0.50 X2 0.25
X2 0.525 Y1 1.25
Y 0.30 Y2 0.50
C 0.50 C 0.40
a 0.10
U-DFN2018-6
X C
Y
Dimensions Value (in mm)
C 0.50
G 0.20
Y1 X 0.25
X1 1.60
Y 0.35
G Y1 1.20
X1
U-DFN2020-3
X Value Value
(in mm) (in mm)
X2 Dimensions Dimensions
0.60
X4 X3 Y1 0.45
Y2 0.45
Y3 R2 C 1.00 Y3 0.698
Y4 0.313
Y4 G 0.15 Y5 0.225
R1 0.05
Y2 Y X 1.40 R2 0.20
R3
R3 Y5 R1 X1 0.35
G X2 0.45
Y1 X3 0.322
X4 0.60
X1 Y 1.10
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 3 of 14 Suggested Pad Layout
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U-DFN2020-3 U-DFN2020-6
Type B
X Y C
Y1 Dimensions Value X2 G Dimensions Value
(in mm) (in mm)
Z
C 1.30 G 1.67
X1 0.15
Y G 0.24 X1 X2 0.90
Y 0.45
X 0.35 C 0.37
0.65
X1 1.52
G Y 1.09 G
X1
Y2 Y1 0.47 Y
C Z
Y2 0.50
U-DFN2020-6 U-DFN2020-6
Type B Type E
Y C Value
(in mm)
Dimensions Dimensions Value
(in mm)
X2 G Z 1.67
G1
G 0.20 C 0.650
G1 0.40 X 0.400
Y3 Y2 X2 Y1 X1 0.285
X (6x)
X1 X1 1.0 X2 1.050
X2 0.45 Y 0.500
Y 0.37 X1 Y1 0.920
Y1 0.70 Y2 1.600
G C 0.65
Y1 Y3 2.300
Z
C Y (2x)
U-DFN2510-8 U-DFN2523-6
X X1 X1
C
Dimensions Value Y1 Dimensions Value (in mm)
(in mm)
Y Y C 0.650
c 0.5 X
Y2 X 0.400
c1 1.0 Y3
Y1 G X1 1.700
G 0.2
Y 0.650
X 0.2
Y1 0.450
X1 0.4
Y2 1.830
Y 0.6
Y3 2.700
c Y1 1.4
c1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 4 of 14 Suggested Pad Layout
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W-DFN3020-8
Type B
C X
Dimensions Value (in mm)
Y1 C 0.650
G1
G G 0.285
Y2 G1 0.090
Y
X 0.400
X1 1.120
Y 0.730
X1 Y1 0.500
Y2 0.365
U-DFN3030-4 U-DFN3030-8
Dimensions Value (in mm)
C 1.300
C G1 0.100
G2 0.150
Y3 (2x) G6 G3 0.830 Z
G4 0.115
G4 G5 0.135 Dimensions Value (in mm)
0.170
Y2 G1 G3 G6 0.500 Z 2.59
X3 R G7 0.500
0.150 X1 G 0.11
0.500
Y G8 1.375 X1 2.49
1.225
G2 R 1.175 X2 0.65
Y1 G5 X Y 0.39
X1 X2 X1 X2 C 0.65
G7 G8 X2 Y
G
X3 C
Y 1.980
X (4x) Y1 1.015
Y2 0.715
Y3 0.650
X (x8) U-DFN3030-8
Type E
Y
(x8) C
Y1 Y2 Dimensions Value (in mm)
C 0.65
C1 2.35
X 0.30
Y 0.65
Y1 1.60
Y2 2.75
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 5 of 14 Suggested Pad Layout
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U-DFN3030-10 U-DFN3030-12
Y C Y C
X Z
X1 Dimensions Value (in mm) X1 Dimensions Value (in mm)
G
Z 2.60 G Z 2.60
G 0.15 G 0.15
X X 1.80 X 1.80
Z
X1 0.60 X1 0.60
Y 0.30 G Y 0.28
G C 0.50 C 0.45
DFN322
C C X (3x) Dimensions Value
(in mm)
Y (2x) C
G 0.65
G Y1 X 0.20
Y4 Y3 X1 0.35
Y2 Y 1.52
X1 Y1 0.55
Y2 0.98
Y3 0.47
Y4 0.63
2.20
W-DFN5020-6 W-DFN5060-4
Y Z
C
XC G Dimensions Value (in mm)
C 0.50 Dimensions Value (in mm)
X1 Y2 G 0.35 C 4.00
Y3
X 0.35 X 0.75
X2
X1 0.90 Y 0.95
X2 1.80 Y1 Y1 6.20
Y 0.70 Z 4.75
Y2 1.60
Y3 3.20 X (4x)
Y (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 6 of 14 Suggested Pad Layout
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Diodes Incorporated
DF-S / MiniDIP MSOP-8
X Dimensions DF-S MiniDIP X Dimensions Value (in mm)
Y Z 10.26 6.91 C2 X 0.45
C Y
Z X 1.2 0.60 C1 Y 1.4
Y 1.52 0.76 C1 4.4
C 5.2 2.67 C2 0.65
MSOP-8L-EP MSOP-10
X Dimensions Value (in mm) X
X1
C1 4.2 C2 Dimensions Value (in mm)
Y1 Y
C2 0.65 X 0.30
C2
Y C1 X 0.32 C1 Y 1.4
X1 1.95 C1 4.4
Y 0.8 C2 0.50
Y1 1.65
POWERDI5 POWERDI123 / POWERDI323
X
Y X1 G X2
Y2
Y1
X1 G
(2x)
Y1
(2x)
C
Dimensions Value (in mm) Dimensions POWERDI123 POWERDI323
C 1.840
G 0.852 G 1.0 0.5
X 3.360
X1 1.390 X1 2.2 2.0
Y 4.860
Y1 1.400 X2 0.9 0.8
Y1 1.4 0.8
Y2 1.4 1.1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 7 of 14 Suggested Pad Layout
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POWERDI123 Type B Dimensions Value
X (in mm)
G
Y X 2.000
X1 1.050
G Y 4.100
X1 1.500
POWERDI3333-8 POWERDI5060-8
X X
G Y2
8 5
Y1
Y2 G1 Y Y1 X1
4 Y
1 G1
Y3 C
Y3 (4x)
X2 C X2 (8x) G
Dimensions Value (in mm) Dimensions Value (in mm)
C 0.650 C 1.270
G 0.230 G 0.660
G1 0.420 G1 0.820
Y 3.700 X 4.420
Y1 2.250 X1 4.100
Y2 1.850 X2 0.610
Y3 0.700 Y 6.610
X 2.370 Y1 3.810
X2 0.420 Y2 1.020
Y3 1.270
SM-8 SO-8
Y (8x) Dimensions Value (in mm) X Dimensions Value (in mm)
C 1.52
C1 C1 4.6 C2 X 0.60
Y1 X 0.95 Y
Y 2.80
Y1 6.80 C1 Y 1.55
C1 5.4
C2 1.27
X (8x) C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 8 of 14 Suggested Pad Layout
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Diodes Incorporated
SOD323F
X1 Y (2x) Dimensions Value (in mm)
X 0.710
X X1 2.700
C2 Y 0.403
Y X (2x)
X
C2 SOP-14 Dimensions Value (in mm)
Y C1 X 0.60
Y 1.50
C1 5.4
C2 1.27
SOP-16
Dimensions Value (in mm)
X 0.60
Y 1.50
C1 C1 5.4
C2 1.27
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 9 of 14 Suggested Pad Layout
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SOT143 SOT223
X X1
X2 Y1
Y
C1
ZG C
X1 X2 Y2
C2
X2
Dimensions Value (in mm) Dimensions Value (in mm)
Z 2.70 X1 3.3
G 1.30 X2 1.2
X 2.50 Y1 1.6
X1 1.0 Y2 1.6
X2 0.60 C1 6.4
Y 0.70 C2 2.3
C 2.0
SOT523 / SOT323 / SOT23 / SC59
Y
Z C
X E
Dimensions SOT523 SOT323 SOT23 SC59
Z 1.8 2.8 2.9 3.4
X 0.4 0.7 0.8 0.8
Y 0.51 0.9 0.9 1.0
C 1.3 1.9 2.0 2.4
E 0.7 1.0 1.35 1.35
SOT23F
C Dimensions Value (in mm)
Y (3x) Y1 C 0.95
X (3x)
X 0.60
Y 0.80
Y1 1.80
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 10 of 14 Suggested Pad Layout
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SC74R / SOT26 / SOT363 / SOT563 SOT25 / SOT353 / SOT553
C2 C2 C2 C2
G C1 ZG C1
Z
SOT363
Y 2.5 Y
X 1.3 X
0.42
Dimensions SC74R / SOT26 0.6 SOT563 Dimensions SOT25 SOT353 SOT553
Z 3.20 1.9 2.2 Z 3.20 2.5 2.2
G 1.60 0.65 1.2 G 1.60 1.3 1.2
X 0.55 X 0.55 0.42
Y 0.80 0.375 Y 0.80 0.6 0.375
C1 2.40 0.5 C1 2.40 1.9 0.5
C2 0.95 1.7 C2 0.95 0.65 1.7
0.5 0.5
SOT666
C Y (6x)
G Dimensions Value (in mm)
C 0.50
X G 0.80
(6x) X 0.35
Y 0.50
SOT953
C C
Y1 Dimensions Value (in mm)
Y (5X) C 0.350
X (5X) X 0.200
Y 0.200
Y1 1.100
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 11 of 14 Suggested Pad Layout
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SOT963
C C
Y1 Dimensions Value (in mm)
Y (6X) C 0.350
X 0.200
Y 0.200
Y1 1.100
X (6X)
SOT89-3 SOT89-5
X1 X1
Y4
Dimensions Value (in mm) Dimensions Value (in mm)
X 0.900 X1 1.7
X2 (2x) X1 1.733 X2 0.55
X2 0.416 X3 0.4
Y1 Y 1.300 Y1 Y1 4.6
Y3 Y4 Y1 4.600
Y2 1.475 X2 Y2 1.2
Y Y2 Y3 0.950 Y3 0.5
Y4 1.125 Y2 X3 Y3 Y4 1.1
C C 1.500 C 3.0
X (3x)
C
TO252 (DPAK) / TO263 (D2PAK)
X2 Dimensions TO252 / DPAK TO263 / D2PAK
Y2 Z 11.6 16.9
X1 1.5 1.1
CZ X2 7.0 10.8
Y1 Y1 2.5 3.5
Y2 7.0 11.4
X1 E1 C 6.9 9.5
E1 2.3 2.5
TO252-4
X1 Dimensions Value (in mm)
Y1
c 1.27
c1
X (4x) c c1 2.54
X 1.00
Y2 X1 5.73
Y3 Y 2.00
Y1 6.17
Y Y2 1.64
Y3 2.66
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 12 of 14 Suggested Pad Layout
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Diodes Incorporated
TO252-5 TO263-5
X X
Y1
Y Y1
Y
C1
Y2 Y2
X1 X1
C2 C
Dimensions Value (in mm) Dimensions Value (in mm)
X 5.6 X 10.9
X1 0.6 X1 1.05
Y 11.0 Y 15.7
Y1 5.6 Y1 9.1
Y2 2.0 Y2 2.5
C1 7.2 C 1.7
C2 1.27
TSOT25
CC
Y1 Dimensions Value (in mm)
Y (5x) C 0.950
X 0.700
X (5x) Y 1.000
Y1 3.199
TSOT26
CC
Y1 Dimensions Value (in mm)
Y (6x) C 0.950
X 0.700
X (6x) Y 1.000
Y1 3.199
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 13 of 14 Suggested Pad Layout
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TSSOP-14
X Dimensions Value (in mm)
C2 X 0.45
Y
Y 1.45
C1 C1 5.9
C2 0.65
U-WLB1010-4
D Dimensions Value (in mm)
C
C C 0.50
D 0.25
U-WLB1510-6
D
Dimensions Value
(in mm)
C1
C C 0.50
C C1 1.00
D 0.25
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the `Z' dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 14 of 14 Suggested Pad Layout
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Diodes Incorporated
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采用双同步采样 ADC 的隔离式 16 通道交流模拟输入模块参考设计
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