器件类别:半导体    电源管理IC    稳压器与电压控制器    低压差稳压器   
厂商名称:Texas Instruments



                                                                                                TPS7A4001-DIE                                                                                      SBVS223 FEBRUARY 2013


                                 Check for Samples: TPS7A4001-DIE

FEATURES                                                                 APPLICATIONS

1                                                                         Microprocessors, Microcontrollers Powered by
                                                                             Industrial Busses with High Voltage Transients
2 Very High Maximum Input Voltage
CMOS Logic-Level-Compatible Enable Pin                                  Industrial Automation
Stable with Ceramic Capacitors                                          Telecom Infrastrucure
Built-In Current-Limit and Thermal Shutdown                            Automotive
                                                                         Power over Ethernet (PoE)
    Protection                                                            LED Lighting
                                                                         Bias Power Supplies


The TPS7A4001-DIE is a very high voltage-tolerant linear regulator that is able to withstand continuous dc or
transient input voltages.

The TPS7A4001-DIE offers an enable pin (EN) compatible with standard CMOS logic to enable a low-current
shutdown mode.

The TPS7A4001-DIE has an internal thermal shutdown and current limiting to protect the system during fault

In addition, the TPS7A4001-DIE is ideal for generating a low-voltage supply from intermediate voltage rails in
telecom and industrial applications; not only it can supply a well-regulated voltage rail, but it can also withstand
and maintain regulation during very high and fast voltage transients. These features translate to simpler and
more cost-effective electrical surge-protection circuitry for a wide range of applications, including PoE, bias
supply, and LED lighting.

                                                                ORDERING INFORMATION(1)

PRODUCT       PACKAGE                                           PACKAGE  ORDERABLE PART NUMBER  PACKAGE QUANTITY
                        Bare die in waffle pack(2)                       TPS7A4001TDA1                       132
                    TD                                                   TPS7A4001TDA2                        10

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
      web site at

(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
      Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
      temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
      warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.


           Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
           Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.


PRODUCTION DATA information is current as of publication date.                           Copyright 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

SBVS223 FEBRUARY 2013                                                         

   This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
   appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

   ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
   susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

                                            BARE DIE INFORMATION

   DIE THICKNESS     BACKSIDE FINISH        BACKSIDE                    BOND PAD          BOND PAD
        10.5 mils.  Silicon with backgrind  POTENTIAL    METALLIZATION COMPOSITION        THICKNESS

                                               Floating                     AlTiW            760 nm

                                  Table 1. Bond Pad Coordinates in Microns

   DESCRIPTION           PAD NUMBER          X MIN        Y MIN                  X MAX    Y MAX
          OUT                     1         356.94        46.08                    432    121.14
           FB                     2         776.97        46.08                           121.14
         GND                      3         1293.12       46.08                  852.03   121.14
           EN                     4         1210.05      1285.56                 1368.18  1360.62
           IN                     5         403.56       1285.56                 1285.11  1360.62

2  Submit Documentation Feedback                                                 Copyright 2013, Texas Instruments Incorporated

                                            Product Folder Links: TPS7A4001-DIE
                                                                                                                         PACKAGE OPTION ADDENDUM                                                                                                                                                                               6-Mar-2013


Orderable Device  Status Package Type Package Pins Package Qty                              Eco Plan   Lead/Ball Finish  MSL Peak Temp               Op Temp (C)  Top-Side Markings                   Samples
TPS7A4001TDA1                                                                                                 Call TI
TPS7A4001TDA2     (1)     Drawing                                                                 (2)                                  (3)                                         (4)

                  ACTIVE           0  132                                                      TBD                       N / A for Pkg Type

                  ACTIVE           0                                                    10  TBD              Call TI     N / A for Pkg Type

(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

                                                                                            Addendum-Page 1
                                               IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale
supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products                                       Applications

Audio                Automotive and Transportation

Amplifiers           Communications and Telecom

Data Converters    Computers and Peripherals

DLP Products             Consumer Electronics

DSP                        Energy and Lighting

Clocks and Timers       Industrial       

Interface            Medical          

Logic                    Security         

Power Mgmt               Space, Avionics and Defense

Microcontrollers  Video and Imaging


OMAP Applications Processors   TI E2E Community 

Wireless Connectivity

                       Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
                                            Copyright 2013, Texas Instruments Incorporated



About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程

北京市海淀区知春路23号集成电路设计园量子银座1305 电话:(010)82350740 邮编:100191

电子工程世界版权所有 京ICP证060456号 京ICP备10001474号 电信业务审批[2006]字第258号函 京公海网安备110108001534 Copyright © 2005-2017, Inc. All rights reserved