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SIMBA-PRO

器件型号:SIMBA-PRO
器件类别:模块/解决方案   
厂商名称:SensiEDGE
标准:
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器件描述

Bluetooth / 802.15.1 Modules SensiBLE Certified BLE4.1 Cortex-M4 CPU

参数
产品属性属性值
Product AttributeAttribute Value
制造商:
Manufacturer:
SensiEDGE
产品种类:
Product Category:
Bluetooth / 802.15.1 Modules
RoHS:YES
类:
Class:
Bluetooth Low Energy (BLE)
Protocol:Bluetooth 4.1
数据速率:
Data Rate:
1 Mb/s
工作电源电压:
Operating Supply Voltage:
1.7 V to 3.6 V
Output Power:4 dBm
最小工作温度:
Minimum Operating Temperature:
- 40 C
最大工作温度:
Maximum Operating Temperature:
+ 85 C
Sensitivity:- 88 dBm
接口类型:
Interface Type:
CAN, GPIO, I2C, SDIO, SPI, UART, USB
系列:
Series:
SIMBA
封装:
Packaging:
Bulk
Antenna:Integrated
频率:
Frequency:
2.4 GHz
产品:
Product:
Bluetooth Modules
商标:
Brand:
SensiEDGE
Antenna Connector Type:Integrated
产品类型:
Product Type:
Bluetooth Modules
工厂包装数量:
Factory Pack Quantity:
1
子类别:
Subcategory:
Wireless & RF Modules
Version:Bluetooth 4.1

SIMBA-PRO器件文档内容

Preliminary Data Sheet

----------------------------------------------------------------------------------------------------------------

                                                                    SIMBA-xxx

----------------------------------------------------------------------------------------------------------------

Version 1.1.3

SensiBLE – Certified Product combining MCU, Sensors and Bluetooth.
List of Content

1  Overview ................................................................................................................................... 5

   1.1    General Information ..................................................................................................................5

   1.2    Feature’s Summary ....................................................................................................................7

   1.3    Block Diagram .............................................................................................................................9

2  Main Hardware Components .......................................................................................... 10

   2.1    Microcontroller ........................................................................................................................ 11

   2.1.1  STM32L476 ............................................................................................................................................. 11

   2.2    Bluetooth .................................................................................................................................... 11

   2.2.1  SPBTLE-RF............................................................................................................................................... 11

   2.3    Sensors ........................................................................................................................................ 11

   2.3.1  LSM6DS3: inertial module: 3D accelerometer and 3D gyroscope................................... 11

   2.3.2  LIS3MDL: 3-Axis Magnetometer .................................................................................................... 11

   2.3.3  HTS221TR: humidity and temperature ...................................................................................... 11

   2.3.4  LPS25H: pressure sensor .................................................................................................................. 12

   2.3.5  MP34DT01-M: digital microphone ............................................................................................... 12

   2.3.6  APDS-9250: Digital RGB, IR and Ambient Light Sensor...................................................... 12

   2.4    Data Logger................................................................................................................................ 12

   2.4.1  AT25XE041B .......................................................................................................................................... 12

   2.5    User Interface ........................................................................................................................... 12

   2.5.1  LTST-C195KGJRKT Magnetic Buzzer .......................................................................................... 13

   2.5.2  SS304BS Button..................................................................................................................................... 13

   2.5.3  LTST-C195KGJRKT Dual color chip LED..................................................................................... 13

3  External Connectors........................................................................................................... 14

   3.1    Pin Mux........................................................................................................................................ 15

4  Microcontroller ................................................................................................................... 17

   4.1    STM32L476................................................................................................................................ 17

   4.1.1  General Description ............................................................................................................................. 17

   4.1.2  Features .................................................................................................................................................... 17

   4.1.3  Block Diagram ........................................................................................................................................ 19

5  Bleutooth ............................................................................................................................... 20

   5.1    SPBTLE-RF.................................................................................................................................. 20

   5.1.1  General Description ............................................................................................................................. 20

   5.1.2  Features .................................................................................................................................................... 21

   5.1.3  Block Diagram ........................................................................................................................................ 22

   5.1.4  SPBTLE-RF Connections and Signals : ......................................................................................... 22

6  Sensors ................................................................................................................................... 24

   6.1    3D accelerometer and 3D gyroscope ................................................................................ 24

   6.1.1  General Description ............................................................................................................................. 24

   6.1.2  Features .................................................................................................................................................... 24

   6.1.3  Block Diagram ........................................................................................................................................ 25

   6.1.4  Connections and Signals .................................................................................................................... 25

   6.2    Magnetic Sensor ....................................................................................................................... 27

   6.2.1  General Description ............................................................................................................................. 27

   6.2.2  Features .................................................................................................................................................... 27

   6.2.3  Block Diagram ........................................................................................................................................ 27

   6.2.4  Connections and Signals .................................................................................................................... 28

   6.3    Humidity and Temperature Sensor................................................................................... 29

   6.3.1  General Description ............................................................................................................................. 29

   6.3.2  Features .................................................................................................................................................... 29
    6.3.3  Block Diagram ........................................................................................................................................ 29

    6.3.4  Connections and Signals .................................................................................................................... 30

   6.4     Pressure Sensor ....................................................................................................................... 31

    6.4.1  General Description ............................................................................................................................. 31

    6.4.2  Features .................................................................................................................................................... 31

    6.4.3  Block Diagram ........................................................................................................................................ 31

    6.4.4  Connections and Signals .................................................................................................................... 32

   6.5     Digital Microphone ................................................................................................................. 33

    6.5.1  General Description ............................................................................................................................. 33

    6.5.2  Features .................................................................................................................................................... 33

    6.5.3  Block Diagram ........................................................................................................................................ 33

    6.5.4  Connections and Signals .................................................................................................................... 33

   6.6     Digital RGB, IR and Ambient Light Sensor....................................................................... 35

    6.6.1  General Description ............................................................................................................................. 35

    6.6.2  Features .................................................................................................................................................... 35

    6.6.3  Block Diagram ........................................................................................................................................ 35

    6.6.4  Connections and Signals .................................................................................................................... 36

7   Serial Flash ............................................................................................................................ 37

   7.1     AT25XE041B ............................................................................................................................. 37

    7.1.1  Description .............................................................................................................................................. 37

    7.1.2  Features .................................................................................................................................................... 37

    7.1.3  Block Diagram ........................................................................................................................................ 38

    7.1.4  Connections and Signals .................................................................................................................... 38

8   Absolute Maximum Characteristics.............................................................................. 40

9   Operational Characteristics ............................................................................................ 41

   9.1     Power supplies ......................................................................................................................... 41

   9.2     Power Consumption .............................................................................................................. 41

10  DC Electrical Characteristics ........................................................................................... 42

11  Environmental Specifications......................................................................................... 43

12  Mechanical Drawings ........................................................................................................ 44

   12.1    SensiBLE Module: SIMBA ....................................................................................................... 44

   12.2    Battery Holder: SIMBA-BAT-CR2032 ................................................................................ 44

   12.3    SensiBLE Module with Coin Battery: SIMBA-PRO ......................................................... 45
List of Figures

Figure 1  SensiBLE Block Diagram ......................................................................................... 9

Figure 2  SensiBLE Internal & External Connections Diagram ............................................ 10

Figure 3  SensiBLE’s MCU Block Diagram .......................................................................... 19

Figure 4  Embedded Bluetooth Low Energy Protocol Stack ................................................. 21

Figure 5  SPBTLE-RF HW Application Block Diagram ....................................................... 22

Figure 6  SPBTLE-RF Schematic Connections ..................................................................... 22

Figure 7  LSM6DS3 HW Application Diagram ..................................................................... 25

Figure 8  LSM6DS3 Schematic Connections......................................................................... 25

Figure 9 LIS3MDL Block Diagram ........................................................................................ 27

Figure 10 LIS3MDL Schematic Connections ......................................................................... 28

Figure 11 HTS221 Block Diagram.......................................................................................... 29

Figure 12 HTS221 Schematic Connections ............................................................................ 30

Figure 13 LPS25H Block Diagram ......................................................................................... 31

Figure 14 LPS25H Schematic Connections ............................................................................ 32

Figure 15 MP34DT01-M Schematic Connections .................................................................. 33

Figure 16 APDS-9250 Block Diagram.................................................................................... 35

Figure 17 APDS-9250 Schematic Connections ...................................................................... 36

Figure 18 AT25XE041B Block Diagram ................................................................................ 38

Figure 19 APDS-9250 Schematic Connections ...................................................................... 38

Figure 20 SensiBLE Top and Down View [mm] .................................................................... 44

Figure 21 SensiBLE Battery Holder Top and Down View [mm] ........................................... 44

Figure 22 SensiBLE Module with Coin Battery Side View [mm].......................................... 45

List of Tables

Table 1   SPBTLE-RF Pin Assignment ................................................................................... 23

Table 2   LSM6DS3 Pin Assignment ...................................................................................... 26

Table 3   LIS3MDL Pin Assignment....................................................................................... 28

Table 4   HTS221 Pin Assignment .......................................................................................... 30

Table 5   LPS25H Pin Assignment .......................................................................................... 32

Table 6   MP34DT01-M Pin Assignment................................................................................ 34

Table 7   APDS-9250 Pin Assignment .................................................................................... 36

Table 8   AT25XE041B Pin Assignment ................................................................................ 39
1 Overview

1.1  General Information

The  SensiBLE  is     a  high  performance     System  on  Module.  SensiBLE  integrates  Micro

Controller, variety of Sensors and BLE connectivity. It provides an ideal building block that

easily integrates with a wide range of target markets requiring rich functionality. SensiBLE

Compact, cost effective and with low power consumption.

SensiBLE IoT Module is a World’s smallest system-on-board (SoB), self-contained, low-

power, outperform Micro-Controller, multiple MEMS sensors and wireless Bluetooth Low

Energy connectivity.

The SensiBLE enables wireless connectivity, not requiring any RF experience or expertise. It

provides a complete RF platform in a tiny form factor and being a certified solution optimizes

the time to market of the final applications.

SensiBLE IoT Module is a Bridging-the-Gap solutions to any embedded design. Fit to the

vast array of battery-powered applications requiring the integration of Multiple Sensors with

BLE connectivity without compromising on cost and power consumption.

SensiBLE Capable to work down to 2v.

Supported products:

1. Base Part numbers

SIMBA                    : SensiBLE Module (Base part number)

SIMBA-BAT-CR2032         : Battery Holder (Coin Battery)   + CR2032 battery

SIM-DB1-JC     : Development Board with JTAG Connector (w/o SensiBLE Module)

SIM-DB1-SL     : Development Board with ST-LInk (w/o SensiBLE Module)

2. SensiBLE Module Versions

SIMBA-BASE               : module with MCU + BLE + SIMBA-BAT-CR2032

SIMBA-STD                : module with most of sensors (*) + BLE + SIMBA-BAT-CR2032

SIMBA-PRO                : Full configuration sensors  + BLE + SIMBA-BAT-CR2032

(*)Not include microphone and Buzzer.

3. Eval Kit part Number

SIMBA-DKL                - Development Kit (SIMBA-DB-21 + SIMBA-PRO + CR2032 battery)

SIMBA-DKJ                - Development Kit (SIMBA-DB-11 + SIMBA-PRO + CR2032 battery)

Schematics:

SIMBA-DB-11 - Development Board with JTAG Connector (w/o SensiBLE Module)

SIMBA-DB-21 - Development Board with ST-LInk (w/o SensiBLE Module)
Software:

BLUEMicrosystem1

MOTENV1

Contact SensiEDGE support services for further information:

mailto:Support@SensiEDGE.com.
1.2  Feature’s Summary

Product Type                    Module

Dimension                       30 x 20 x 10 mm

Bluetooth                       v4.1 Bluetooth Low Energy 2.4GHz

     BLE Certified Module       SPBTLE-RF

     Technology                 Bluetooth Smart sensor and hub device.

     BLE Chipset                ST BlueNRG-MS

     Antenna                    On Board

     RF Conn/ Antenna           Chip Antenna

     Internal High Speed Clock  32MHZ crystal oscillator

     External Low Power Clock   32.768KHZ

     Tx power                   + 4 dBm

     Rx sensitivity             -88 dBm

     link budget                92dB

     Data Rate Bluetooth        1Mb/s

     Host Interface BT          SPI

     CE qualified               CE qualified

     FCC/IC Certified           FCC/IC Certified

     BQE Qualified              BQE qualified (in progress)

Processor                       ARM® 32-bit Cortex®-M4 CPU with FPU

     Microcontroller            STM32L476RG

Sensors

     Accelerometer, Gyroscope   LSM6DS3

     Magnetic sensor            LIS3MDL

     Pressure sensor            LPS25H

     Relative humidity &        HTS221

     temperature

     Digital MEMS Microphone    MP34DT01-M

     Ambient Light Sensor       APDS-9250

User Input

     RG LED                     LTST-C195KGJRKT
User Button                TL1014

Buzzer                     ME05140SMC03

Data Logger                4Mbit SPI_Flash

Serial Flash               AT25XE041B-MHN-T

Mounting Type              Two 14pins/1.27 pitch female

Pin-Header Connector       PS3M34-114GBOTB-U

Extension Interface

GPIO                       18

I2C                        2

SPI                        2

USART                      2

UART                       2

ADC (12 bit)               4 ch

USB                        OTG FS

PWM                        5

SDIO                       1

CAN ( 2.0B Active )        1

Power Interface

Cell Battery               2 < Vin < 3.6

Coin Cell Battery          CR2025 , CR2032

Rechargeable Battery       Yes (external board)

Mini - USB                 Yes (on Carrier Board)

External Power             4.5v < Vin < 7v

Dimensions

SIMBA                      20mm * 30mm

SIMBA height with Battery  10.43mm * 7.5mm

Battery Holder             20 * 22.50
1.3  Block Diagram

The system based on 6 main block’s:

▪    Connectivity

▪    Micro Controller

▪    Extensions & Power

▪    Sensors

▪    Data Logger

▪    User Interface

Figure 1  SensiBLE Block Diagram
2 Main Hardware Components

This section summarizes the main hardware building blocks of the SensiBLE Module.

Part of the Connectivity used by the SensiBLE module for internal connection between MCU

and Sensors.

Microphone using DFSDM interface, Sensors connected to MCU using I!C1, while BLE

module and Data Logger connected via SPI1.

Figure 2  SensiBLE Internal & External Connections Diagram

Rest of unused Interfaces is free for user to interconnect with external world:

▪  18 I/O

▪  PWM

▪  I!C1, I!C2

▪  SPI2, SPI3

▪  USART 2, USART3

▪  UART4, UART5

▪  CAN

▪  SD

▪  ADC
2.1     Microcontroller

2.1.1   STM32L476

The SensiBLE module contains ST’s STM32L476xx MCU. The STM32L476RG device are

the ultra-low-power microcontrollers based on the high-performance ARM® Cortex®-M4

32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a

Floating point unit (FPU) single precision which supports all ARM single-precision data-

processing instructions and data types. It also implements a full set of DSP instructions and a

memory protection unit (MPU) which enhances application security.

2.2     Bluetooth

2.2.1   SPBTLE-RF

The     SensiBLE  module  contains  ST’s  SPBTLE-RF.  The  SPBTLE-RF  is  an  easy  to           use

Bluetooth® Smart master/slave network processor module, compliant with Bluetooth® v4.1.

The SPBTLE-RF B-SmarT module supports multiple roles simultaneously, and can act at the

same time as Bluetooth Smart sensor and hub device.

2.3     Sensors

The SensiBLE module contains verity of sensors :

     ▪  ST’s       3D accelerometer and 3D gyroscope

     ▪  ST’s       3-Axis Magnetometer

     ▪  ST’s       humidity and temperature

     ▪  ST’s       pressure sensor

     ▪  ST’s       digital microphone

     ▪  Avago’s    Digital RGB, IR and Ambient Light Sensor

2.3.1   LSM6DS3: inertial module: 3D accelerometer and 3D gyroscope

The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital

gyroscope. Enabling always-on low-power features for an optimal motion experience.

2.3.2   LIS3MDL: 3-Axis Magnetometer

The LIS3MDL is an ultra low-power high-performance 3-Axis Magnetometer. This device

offers the unique flexibility for designers to implement movement and position detection in

space-constrained products such as personal navigation devices.

2.3.3   HTS221TR: humidity and temperature
The HTS221 is an ultra compact sensor for relative humidity and temperature. It includes a

sensing element consists of a polymer dielectric planar capacitor structure and a mixed signal

ASIC to provide the measurement information through digital serial interfaces.

2.3.4     LPS25H: pressure sensor

The     LPS25H   is  an  ultra   compact  absolute   piezoresistive  pressure   sensor.  It  includes  a

monolithic sensing element capable to detect.

2.3.5     MP34DT01-M: digital microphone

The     MP34DT01-M       is  an  ultra-compact,      low-power,  omnidirectional,  digital   MEMS

microphone built with a capacitive sensing element and an IC interface.

The     sensing  element,    capable  of  detecting  acoustic    waves,  is    manufactured  using     a

specialized silicon micromachining process dedicated to produce audio sensors.

2.3.6     APDS-9250: Digital RGB, IR and Ambient Light Sensor

The Avago APDS-9250 is a low-voltage digital RGB, IR and ambient light sensor device that

converts  light  intensity   to  digital  output  signal.  The   color-sensing  feature  is  useful    in

applications such as LED RGB backlight control, solid-state lighting, reflected LED color

sampler and fluorescent light color temperature detection. With the IR sensing feature, the

device can be used to read the IR content in certain lighting condition and detect the type of

light source.

2.4     Data Logger

2.4.1     AT25XE041B

The SensiBLE module contains Adesto® AT25XE041B . Adesto’s AT25XE041B is a serial

flash memory device.

Flexible erase architectures with page erase and block erase sizes make this memory ideal for

data storage applications. AT25XE products feature ultra low-energy operation for active

current, Program and Erase operations, as well as improved standby energy consumption.

The device contains a specialized One-Time Programmable (OTP) security register usable for

unique device serialization, system-level electronic serial number storage, and locked key

storage.

2.5     User Interface

The SensiBLE module contains verity of user interfaces :

     ▪    TongKeElectronics’s             Buzzer (PB11)

     ▪    IL SWITCH’s                     Button (PC13)

     ▪    Lite-On’s                       RG-LED (Led G @ PA5, Led R @ PC6)
2.5.1  LTST-C195KGJRKT Magnetic Buzzer

TongKE Electronics Buzzer based on Electro-Magnetic Acoustic Transducer for non-contact

sound generation and reception using electromagnetic mechanisms.

2.5.2  SS304BS Button

IL SWITCH’s is a Side push Surface Horizontal operating direction button.

2.5.3  LTST-C195KGJRKT Dual color chip LED

Lite-On’s SMD Red/Green LED based 2 separate LED’s in a package, allows two colors (red

and green), while only having 4 pins (Dual set cathode and anode) miniature sizes and special

configurations for space-sensitive applications. The color of the LED depends on the polarity

of the connection, allowing separate and both colors at the same time.
3 External Connectors

The SensiBLE exposes two low profile connectors. First J1 is 14 pin while Second J2 is 13

pin Board to Board connectors. The recommended mating connectors for Custom board

interfacing are:

Pin Name: J1, J2

J1 - 14 pins 1row 1.27 Female

J2 - 13 pins 1row 1.27 Female

Pin #:            Pin Number

Schematic Name:   MCU name description

Type:             Pin type & direction

                  S – Power Pin and/or Ground Pin

                  I/O – GPIO

Func (#):         Function Number 1 to 4

Description:      Description of the Pin
     3.1  Pin Mux

     Table 3.1 and Table 3.2 explain function of connectivity pins  in  SensiBLE module  as  well

     Pin MUX and alternate function available.

     Table 3.1 - J1 SensiBLE Module – Alternate Function

Pin  #  Schematic  Type  Func1                  Func2      Func3        Func4                Description

        Name

1       +5V_USB    S                                                                         Input

                                                                                             voltage

                                                                                             from     USB

                                                                                             +5V

2       VDD        S                                                                         +3.3V    from

                                                                                             voltage

                                                                                             regulator

3       PB1        I/O   TIM3_CH4               TIM3_CH3N  ADC12_16

4       PC4        I/O   ADC12_13               USART3_TX

5       PB12       I/O   SPI2_NSS

6       PB13       I/O   SPI2_SCK               I2C2_SCL

7       PB14       I/O   SPI2_MISO              I2C2_SDA

8       PC3        I/O   SPI2_MOSI              ADC123_14

9       PA3        I/O   USART2_RX              TIM2_CH4   TIM5_CH4     TIM15_CH2

10      PA2        I/O   USART2_TX              TIM2_CH3   TIM15_CH1    ADC12_7

                                                TIM5_CH3

11      JTCK/SW    I/O                                                                       Serial clk

        CLK                                                                                  pin SWD

12      JTMS/SW    I/O                                                                       Serial data

        DAT                                                                                  pin SWD

13      nReset     I/O                                                                       Reset pin

14      GND        S                                                                         Ground pin
    Table 3.2 - J2  SensiBLE Module – Alternate Function

    Schematic       Ty   Func1      Func2                 Func3     Func4      Description

    Name            pe

1   PB5             I/O  TIM3_CH2                         -         -

2   GND             S    -          -                     -         -          Ground pin

3   PA12            I/O  OTG_FS_DP  CAN1_TX                                    CAN/USB

4   PA11            I/O  OTG_FS_DM  CAN1_RX                                    CAN/USB

5   PA10            I/O  TIM1_CH3   OTG_ID

6   PD2             I/O  SDMMC_CMD  UART5_RX                                   SDIO_CM

                                                                               D

7   PC12            I/O  SDMMC_CK   UART5_TX                        SPI3_MOSI  SDIO_CLK

8   PC11            I/O  SDMMC_D3   USART3_RX             UART4_RX  SPI3_MISO  SDIO

                                                                               DATA3

9   PC10            I/O  SDMMC_D2   USART3_TX             UART4_TX  SPI3_SCK   SDIO

                                                                               DATA2

10  PC9             I/O  SDMMC_D1   TIM3_CH4              TIM8_CH4             SDIO

                                                                               DATA1

11  PC8             I/O  SDMMC_D0   TIM3_CH3              TIM8_CH3             SDIO

                                                                               DATA0

12  I2C1_SCL        I/O  I2C1_SCL                                              I2C1   bus

                                                                               clock

13  I2C1_SDA        I/O  I2C1_SDA                                              I2C1   bus

                                                                               data
4 Microcontroller

4.1    STM32L476

4.1.1  General Description

The STM32L476xx are the ultra-low-power microcontrollers based on the high performance

ARM Cortex-M4, 32-bit RISC core operating at a frequency of up to 80 MHz.

The Cortex-M4 core features a Floating-point unit (FPU) single precision, which supports all

ARM single-precision data-processing instructions and data types. It also implements a full

set of DSP instructions and a memory protection unit (MPU) which enhances application

security.

The STM32L476 embed high-speed memories (Flash memory up to 1 Mbyte, up to 128

Kbyte of SRAM), an extensive range of enhanced I/Os and peripherals connected to two

APB buses, two AHB buses and a 32-bit multi-AHB bus matrix. The STM32L476 embed

several protection mechanisms for embedded Flash memory and SRAM: readout protection,

write protection, proprietary code readout protection and Firewall.

The devices offer fast 12-bit ADCs (5 Msps), an internal voltage reference buffer, a low-

power RTC, two general-purpose 32-bit timer, two 16-bit PWM timers dedicated to motor

control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. The Micro

Controller support digital filter for external sigma delta modulators (DFSDM).

In addition, 1 capacitive sensing button is available.

They also feature standard and advanced communication interfaces.

▪      Two I2Cs (I2C1 connected internally to Sensors).

▪      Three SPIs (SPI1 connected internally to BLE and Serial Flash).

▪      Two USARTs, two UARTs.

▪      One SDMMC

▪      One CAN

▪      One USB OTG full-speed

The STM32L476xx operates in the -40 to +85 C (+105 C junction), -40 to +105 C

(+125 C junction) and -40 to +125 C (+130 C junction) temperature ranges from a 1.71 to

3.6 V power supply. A comprehensive set of power-saving modes allows the design of low

power applications.

4.1.2  Features

▪      Core: ARM® 32-bit Cortex®-M4 CPU

       –   Frequency up to 80 MHz

       –   FPU - Floating Point Unit

       –   DSP instructions

       –   Adaptive  real-time  accelerator  (ART       Accelerator™)   allowing  0-wait-state

           execution from Flash memory

       –   MPU – Memory Protecting Unit
   –  100DMIPS/1.25DMIPS/MHz (Dhrystone 2.1)

   –  14-channel DMA controller

   –  True random number generator

   –  CRC calculation unit, 96-bit unique ID

▪  Memories

   –  Up to 1 MB Flash, 2 banks read-while-write, proprietary code readout protection

   –  Up to 128 KB of SRAM including 32 KB with hardware parity check

▪  Ultra-low-power with FlexPowerControl

   –  300 nA in VBAT mode: supply for RTC and 32x32-bit backup registers

   –  30 nA Shutdown mode (5 wakeup pins)

   –  120 nA Standby mode (5 wakeup pins)

   –  420 nA Standby mode with RTC

   –  µA Stop 2 mode, 1.4 µA Stop 2 with RTC

   –  100 µA/MHz run mode

   –  Batch acquisition mode (BAM)

   –  4 µs wakeup from Stop mode

   –  Brown out reset (BOR) in all modes except shutdown

   –  Interconnect matrix

▪  Clock Sources

   –  4 to 48 MHz crystal oscillator

   –  32 kHz crystal oscillator for RTC (LSE)

   –  Internal 16 MHz factory-trimmed RC (±1%)

   –  Internal low-power 32 kHz RC (±5%)

   –  Internal multispeed 100 kHz to 48 MHz oscillator,   auto-trimmed  by  LSE  (better

      than ±0.25 % accuracy)

   –  3 PLLs for system clock, USB, audio, ADC

   –  RTC with HW calendar, alarms and calibration

▪  1 capacitive sensing channels: support touchkey

▪  Timers

   –  16x timers: 2 x 16-bit advanced motor-control, 2 x 32-bit and 5 x 16-bit general

      purpose, 2x 16-bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x

      watchdogs, SysTick timer

▪  digital filters for sigma delta modulator

▪  Analog

   –  Rich analog peripherals (independent supply)

   –  12-bit ADC 5 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps

▪  Communication:

   –  10x communication interfaces

   –  USB OTG 2.0 full-speed, LPM and BCD

   –  2x I2C FM+(1 Mbit/s), SMBus/PMBus

   –  2x USARTs (ISO 7816, LIN, IrDA, modem)

   –  2x USARTs (ISO 7816, LIN, IrDA, modem)

   –  2x SPIs
       –  CAN (2.0B Active)

       –  SDMMC interface

▪      Development support: serial wire debug (SWD).

▪      1.71 V to 3.6 V power supply

▪      -40 °C to 85/105/125 °C temperature range

4.1.3  Block Diagram

Figure 3  SensiBLE’s MCU Block Diagram

(*) Some of the peripherals are connected internally on-board  sensors,  others  are  available  at

extension connector (list).
5 Bleutooth

5.1    SPBTLE-RF

5.1.1  General Description

The SPBTLE-RF is a single-mode Bluetooth low energy master/slave network processor

module compliant with Bluetooth® v4.1.

The SPBTLE-RF B-SmarT module integrates a 2.4 GHz RF radio the ST BlueNRG-MS on

which a complete power-optimized stack for Bluetooth single mode protocol runs, providing

▪      Master, slave role support

▪      GAP: central, peripheral, observer or broadcaster roles

▪      ATT/GATT: client and server

▪      SM: privacy, authentication and authorization

▪      L2CAP

▪      Link Layer: AES-128 encryption and decryption

The BlueNRG-MS radio embeds nonvolatile Flash memory allows on-field stack upgrading.

In addition, according the Bluetooth specification v4.1 the SPBTLE-RF B-SmarT module

provides:

▪      Multiple roles simultaneously support

▪      Support simultaneous advertising and scanning

▪      Support being slave of up to two masters simultaneously

▪      Privacy V1.1

▪      Low duty cycle directed advertising

▪      Connection parameters request procedure

▪      LE Ping

▪      32 bits UUIDs

▪      L2CAP connection oriented channels

The SPBTLE-RF B-SmarT module is equipped with Bluetooth low energy profiles in C
source code.

Application resides in the SensiBLE’s host application processor STM32L476, is interfaced

with the SPBTLE-RF B-SmarT module through an application controller interface protocol,

which is based on a standard SPI interface.

Figure 4  Embedded Bluetooth Low Energy Protocol Stack

The entire Bluetooth Smart stack and protocols are embedded in the BLE Module.

The SensiBLE enables wireless connectivity, not requiring any RF experience or expertise. It

provides a complete RF platform in a tiny form factor and being a certified solution optimizes

the time to market of the final applications.

5.1.2  Features

▪      Bluetooth v4.1 compliant

       – Supports master and slave modes

       – Multiple roles supported simultaneously

▪      Embedded Bluetooth low energy protocol stack

       – GAP, GATT, SM, L2CAP, LL, RFPHY

▪      Bluetooth low energy profiles provided separately

▪      Bluetooth radio performance:

       – Embedded ST BlueNRG-MS

       – Tx power: + 4 dBm

       – Rx sensitivity: - 88 dBm

       – Provides up to 92 dB link budget with excellent  link  reliability

▪      Host interface

       – SPI, IRQ, and RESET

       – On-field stack upgrading available via SPI
▪      AES security co-processor

▪      Certification

       – CE qualified

       – FCC, IC modular approval certified

       – BQE qualified (in progress)

▪      On-board chip antenna

▪      Operating supply voltage: from 1.7 to 3.6 V

▪      Operating temperature range: -40 °C to 85 °C

5.1.3  Block Diagram

Figure 5  SPBTLE-RF HW Application Block Diagram

5.1.4  SPBTLE-RF Connections and Signals :

SPBTLE-RF Bluetooth NRG Certified Module soldered on top of SensiBLE PCB to    gain  the

Certification done previously by the SPBTLE-RF. The module connected by SPI1.

Figure 6  SPBTLE-RF Schematic Connections
Table 1   SPBTLE-RF Pin Assignment

Name        Type  Pin #  Description                         V max Tolerant

                              SPI Interface

SPI_IRQ     O     4      SPI IRQ (slave has data for master  Vin

SPI_CLK     I     7      SPI Clock (max. 8 MHZ)              Vin

SPI_MISO    O     8                                          Vin

SPI_MOSI    I     9                                          Vin

SPI_CS      I     10                                         Vin

                              Power and Ground

Vin               5      Vin                                 (1.7V – 3.6V max)

GND               6      GND

                                    Reset

BT_Reset    I     11     Reset Input (active low < 0.35Vin)  (1.7V – 3.6V max)

                                      LPO

EXT_LPCLK   I     1      Not connected

GPIO2       I/O   2      Not connected

ANA TEST 0  I     3      Not connected
6 Sensors

6.1     3D accelerometer and 3D gyroscope

6.1.1       General Description

The     LSM6DS3        is  a  system-in-package    featuring  both  high-performance     3-axis     digital

accelerometer and 3-axis digital gyroscope.

The integrated power-efficient modes are able to reduce the power consumption down to 1.25

mA      in  high-performance     mode,  combining  always-on    low-power      features  with    superior

sensing precision for an optimal motion experience for the consumer thanks to ultra-low

noise performance for both the gyroscope and accelerometer.

The LSM6DS3 delivers best-in-class motion sensing that can detect orientation and gestures

in order to empower application developers with features and capabilities that are more

sophisticated than simply orienting their devices to portrait and landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual

awareness, implementing hardware recognition of free-fall events, 6D orientation, tap and

double-tap sensing, activity or inactivity, and wakeup events.

The     LSM6DS3        supports  main   OS  requirements,     offering  real,  virtual  and  batch  mode

sensors. In addition, the LSM6DS3 can efficiently run the sensor-related features specified in

Android, saving power and enabling faster reaction time. In particular, the LSM6DS3 has

been designed to implement hardware features such as significant motion, tilt, pedometer

functions, time stamping and to support the data acquisition of an external magnetometer

with ironing correction (hard, soft).

6.1.2       Features

     ▪      Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-

            performance mode up to 1.6 kHz.

     ▪      “Always-on” experience with low power consumption for both accelerometer and

            gyroscope

     ▪      Smart FIFO up to 8 kbyte data buffering based on features set

            –  100% efficiency with flexible configurations and partitioning

            –  possibility to store timestamp

     ▪      Event-detection interrupts (fully configurable):

            –  free-fall

            –  wakeup

            –  6D orientation

            –  tap and double-tap sensing

            –  activity / inactivity recognition

     ▪      Specific IP blocks with negligible power consumption and high-performance:

            –  pedometer functions: step detector and step counters

            –  tilt detection (Android compliant)

            –  significant motion (Android compliant)
▪      Data  rate  synchronization  with  external  trigger  for    reduced  sensor  access  and

       enhanced fusion

▪      Compliant with Android K and L

▪      Hard, soft ironing for external magnetic sensor corrections

▪      ±2/±4/±8/±16 g full scale

▪      ±125/±245/±500/±1000/±2000 dps full scale

▪      Analog supply voltage: 1.71 V to 3.6 V

▪      Independent IOs supply (1.62 V)

▪      Compact footprint, 2.5 mm x 3 mm x 0.83 mm

▪      SPI/I2C serial interface with main processor data synchronization feature

▪      Embedded temperature sensor

▪      ECOPACK®, RoHS and “Green” compliant

6.1.3  Block Diagram

Figure 7  LSM6DS3 HW Application Diagram

The LSM6DS3 has three operating modes available:

▪      only accelerometer active and gyroscope in power-down

▪      only gyroscope active and accelerometer in power-down

▪      both accelerometer and gyroscope sensors active with independent ODR

6.1.4  Connections and Signals

Figure 8  LSM6DS3 Schematic Connections
Table  2  LSM6DS3 Pin Assignment

Pin#      Name    Mode 1 function                          Mode 2 Function

1      SDO/SA0    SPI  4-wire   interface   serial   data  SPI    4-wire  interface    serial    data

                  output (SDO)                             output (SDO)

                  I!C Least    significant  bit  of  the   I!C  Least     significant  bit   of  the

                  device address (SA0)                     device address (SA0)

2         SDx     Connect to VDDIO or GND                  I!C Serial data master (MSDA)

3         SCx     Connect to VDDIO or GND                  I!C Serial data master (MSDA)

4         INT1                              Programmable interrupt 1

5      VDDIO(!)                             Power supply for I/O pins

6         GND                                        0 V supply

7         GND                                        0 V supply

8         VDD(!)                                     Power suppl

9         INT2    Programmable     interrupt           2   Programmable           interrupt      2

                  (INT2)/Data enable (DEN)                 (INT2)/Data enable (DEN)/

                                                           I!C master external synchronization

                                                           signal (MDRDY)

10        NC(!)                                  Leave unconnected

11        NC(!)                                  Leave unconnected

12        CS      I!C /SPI mode selection                  I!C /SPI mode selection

                  (1:SPI     idle  mode          /   I!C   (1:SPI      idle   mode           /   I!C

                  communication enabled;                   communication enabled;

                  0:SPI   communication     mode/ I!C      0:SPI   communication        mode/    I!C

                  disabled)                                disabled)

13        SCL     I!C serial clock (SCL)                   I!C serial clock (SCL)

                  SPI serial port clock (SPC)              SPI serial port clock (SPC)

14        SDA     I!C serial data (SDA)                    I!C serial data (SDA)

                  SPI serial data input (SDI)              SPI serial data input (SDI)

                  3-wire interface serial data output      3-wire  interface  serial   data     output

                  (SDO)                                    (SDO)
6.2    Magnetic Sensor

6.2.1  General Description

The SensiBLE module contains ST’s LIS3MDL. The LIS3MDL is an ultra-low-power high-

performance three-axis magnetic sensor.

The LIS3MDL has user-selectable full scales of ±4/ ±8/ ±12/ ±16 gauss.

The self-test capability allows the user to check the functioning of the sensor in the final

application.

The device may be configured to generate interrupt signals for magnetic field detection.

6.2.2  Features

▪      Wide supply voltage, 1.9 V to 3.6 V

▪      Independent IO supply (1.8 V)

▪      ±4/ ±8/ ±12/ ±16 gauss selectable magnetic full scale

▪      Continuous and single-conversion modes

▪      16-bit data output

▪      Interrupt generator

▪      Self-test

▪      I2C digital output interface

▪      Power-down mode/ low-power mode

▪      ECOPACK® , RoHS and “Green” compliant

6.2.3  Block Diagram

Figure 9 LIS3MDL Block Diagram
6.2.4  Connections and Signals

Figure 10 LIS3MDL Schematic Connections

Table 3  LIS3MDL Pin  Assignment

Pin#     Name                   Function

1        SCL                    ! Serial clock (SCL)

         SPC                    SPI serial port clock (SPC)

2        Reserved               Connect to GND

3        GND                    Connect to GND

4        C1                     Capacitor connection (C1=100nf)

5        Vdd                    Power supply

6        Vdd_IO                 Power supply for I/O pins

7        INT                    interrupt

8        DRDY                   Data Ready

9        SDO                    SPI serial data output (SDO)

         SA1                    ! less significant bit of the device address (SA1)

10       CS                     SPI enable

                                /SPI mode selection

                                (1: SPI idle mode / ! communication enabled;

                                0: SPI commication mode / ! disabled)

11       SDA                    ! serial data (SDA)

         SDI                    SPI serial data input (SDI)

         SDO                    3-wire interface serial data output (SDO)

12       Reserved               Connect to GND
6.3    Humidity and Temperature Sensor

6.3.1  General Description

The SensiBLE module contains ST’s HTS221. The HTS221 is an ultra compact sensor for

relative humidity and temperature. It includes a sensing element and a mixed signal ASIC to

provide the measurement information through digital serial interfaces.

The sensing element consists of a polymer dielectric planar capacitor structure capable of

detecting relative humidity variations.

6.3.2  Features

▪      0 to 100% relative humidity range

▪      Supply voltage: 1.7 to 3.6 V

▪      Low power consumption: 2 µA @ 1 Hz ODR

▪      Selectable ODR from 1 Hz to 12.5 Hz

▪      High rH sensitivity: 0.004% rH/LSB

▪      Humidity accuracy: ± 3.5% rH, 20 to +80% rH

▪      Temperature accuracy: ± 0.5 °C,15 to +40 °C

▪      Embedded 16-bit ADC

▪      16-bit humidity and temperature output data

▪      I²C interfaces

▪      Factory calibrated

▪      Tiny 2 x 2 x 0.9 mm package

▪      ECOPACK® compliant

6.3.3  Block Diagram

Figure 11 HTS221 Block Diagram
6.3.4  Connections and Signals

Figure 12 HTS221 Schematic Connections

Table 4  HTS221 Pin Assignment

Pin #    Name                                 Function

1        Vdd                    Power Supply

2        SCL                    ! serial clock (SCL)

3        DRDY                   Data Ready output signal

4        SDA                    ! serial data (SDA)

5        GND                    Ground

6        SPI enable             ! /SPI mode selection

                                1: SPI idle mode / ! communication  enabled
6.4    Pressure Sensor

6.4.1  General Description

The SensiBLE module contains ST’s LPS25H. The LPS25H is an ultra compact absolute

piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface

able to take the information from the sensing element and to provide a digital signal.

The sensing element consists of a suspended membrane realized inside a single mono-silicon

substrate.

6.4.2  Features

▪      260 to 1260 mbar absolute pressure range

▪      High-resolution mode: 1 Pa RMS

▪      Low power consumption:

▪      Low resolution mode: 4 µA

▪      High resolution mode: 25 µA

▪      High overpressure capability: 20x full scale

▪      Embedded temperature compensation

▪      Embedded 24-bit ADC

▪      Selectable ODR from 1 Hz to 25 Hz

▪      I²C interfaces

▪      Embedded FIFO

▪      Supply voltage: 1.7 to 3.6 V

▪      High shock survivability: 10,000 g

▪      Small and thin package

▪      ECOPACK® lead-free compliant

6.4.3  Block Diagram

Figure 13 LPS25H Block Diagram
6.4.4  Connections and Signals

Figure 14 LPS25H Schematic Connections

Table 5  LPS25H Pin Assignment

Pin Number                      Name      Function

1                               Vdd_IO    Power supply for I/O pins

2                               SCL       ! Serial clock (SCL)

                                SPC       SPI serial port clock (SPC)

3                               Reserved  Connect to GND

4                               SDA       ! Serial data (SDA)

                                SDI       4-wire SPI serial data input (SDI)

                                SDI/SDO   3-wire serial data input/output (SDI/SDO)

5                               SDO       4-wire SPI serial data output (SDO)

                                SA0       ! less significant bit of the device address

                                          (SA0)

6                               CS        SPI enable

                                          ! / SPI mode selection

                                          (1: SPI idle mode / communication enabled;

                                          0: SPI communication mode / ! disabled)

7                               INT_DRDY  Interrupt or Data Ready

8                               GND       0V supply

9                               GND       0V supply

10                              VDD       Power supply
6.5    Digital Microphone

6.5.1  General Description

The SensiBLE module contains ST’s MP34DT01-M. The MP34DT01-M is an ultra-compact,

low-power,     omnidirectional,  digital  MEMS  microphone  built  with  a  capacitive  sensing

element and an IC interface.

The sensing element, capable of detecting acoustic waves. Able to provide a digital signal

externally in PDM format.

The MP34DT01-M has an acoustic overload point of 120 dBSPL with a 61 dB signal-to-

noise ratio and –26 dBFS sensitivity.

6.5.2  Features

▪      Single supply voltage

▪      Low power consumption

▪      120 dBSPL acoustic overload point

▪      61 dB signal-to-noise ratio

▪      Omnidirectional sensitivity

            –  26 dBFS sensitivity

▪      PDM output

▪      HCLGA package

▪      Top-port design

▪      SMD-compliant

▪      EMI-shielded

▪      ECOPACK®,RoHS, and “Green” compliant

6.5.3  Block Diagram

       TBD

6.5.4  Connections and Signals

Figure 15 MP34DT01-M Schematic Connections
Table 6  MP34DT01-M Pin Assignment

Pin #            Pin name           Function

         1       Vdd                Power supply

         2       LR                 Left/Right channel selection

         3       CLK                Synchronization input clock

         4       DOUT               Left/Right PDM data output

5 (ground ring)  GND                0 V Supply
6.6    Digital RGB, IR and Ambient Light Sensor

6.6.1   General Description

The SensiBLE module contains Avago’s APDS-9250. The Avago APDS-9250 is a low-

voltage digital RGB, IR and ambient light sensor device that convert light intensity to digital

output  signal.   The  device  supports  I2C-bus  interface  and  has  a  programmable  interrupt

controller that takes minimal micro-controller (MCU) resources. The color-sensing feature is

useful in applications such as LED RGB backlight control, solid-state lighting, reflected LED

color sampler and fluorescent light color temperature detection. With the IR sensing feature,

the device can be used to read the IR content in certain lighting condition and detect the type

of light source.

6.6.2   Features

▪       Colour and Ambient Light Sensing (CS-RGB and ALS)

        –  Accuracy of Correlated Color Temperature (CCT)

        –  Individual channels for Red, Green, Blue and Infared

        –  Approximates Human Eye Response with Green Channel

        –  Red, Green, Blue, Infrared and ALS Sensing

        –  High Sensitivity in low lux condition - Ideally suited for     Operation  Behind  Dark

           Glass

        –  Wide Dynamic Range: 18,000,000: 1

        –  Up to 20-Bit Resolution

▪       Power Management

        –  Low Active Current - 130 µA typical

        –  Low Standby Current - 1µA typical

▪       I2C-bus Fast Mode Compatible Interface

        –  Up to 400kHz (I2C Fast-Mode)

        –  Dedicated Interrupt Pin

6.6.3   Block Diagram

Figure  16 APDS-9250 Block Diagram
6.6.4  Connections and Signals

Figure 17 APDS-9250 Schematic Connections

Table 7     APDS-9250 Pin Assignment

Pin    Name  Type    Description

1      SCL   I       ! Serial Clock input Terminal – Clock Signal for I2C Serial  Data

2      SDA   I/O     Serial Data I/O for !

3      VDD   Supply  Power Supply Voltage

4      INT   O       Interrupt – Open Drain

5      NC            No Connect

6      GND   Ground  Power Supply Ground. All Voltage and reference to GND.
7 Serial Flash

7.1     AT25XE041B

7.1.1   Description

The Adesto® AT25XE041B is a serial interface Flash memory device designed for use in

applications in which program code is shadowed from Flash memory into embedded or

external RAM for execution. The flexible erase architecture of the AT25XE041B, with its

page erase granularity it is ideal for data storage as well, eliminating the need for additional

data storage devices. The erase block sizes of the AT25XE041B have been optimized to meet

the needs of today's code and data storage applications. By optimizing the size of the erase

blocks, the memory space can be used much more efficiently. Because certain code modules

and data storage segments must reside by themselves in their own erase regions, the wasted

and     unused   memory  space  that  occurs   with  large   sectored  and   large  block  erase  Flash

memory devices can be greatly reduced. This increased memory space efficiency allows

additional code routines and data storage segments to be added while still maintaining the

same    overall  device  density.  The  device     also  contains  a   specialized  OTP    (One-Time

Programmable)     Security  Register  that    can  be  used  for   purposes  such   as  unique    device

serialization, system-level Electronic Serial Number (ESN) storage, locked key storage, etc.

The AT25XE041B supports read, program, and erase operations.

7.1.2   Features

     ▪  Single 1.65V - 3.6V Supply

     ▪  Serial Peripheral Interface (SPI) Compatible

        –        Supports SPI Modes 0 and 3

        –        Supports Dual-I/O Operation

     ▪  85MHz Maximum Operating Frequency

        –        Clock-to-Output (tV) of 6 ns

     ▪  Flexible, Optimized Erase Architecture for Code + Data Storage Applications

        –        Uniform 4-Kbyte Block Erase

        –        Uniform 32-Kbyte Block Erase

        –        Uniform 64-Kbyte Block Erase

        –        Full Chip Erase

     ▪  Hardware Controlled Locking of Protected Sectors via WP Pin

     ▪  128-byte, One-Time Programmable (OTP) Security Register

        –        64 bytes factory programmed with a unique identifier

        –        64 bytes user programmable

     ▪  Flexible Programming

        –        Byte/Page Program (1 to 256 Bytes)

        –        Dual-Input Byte/Page Program (1 to 256 Bytes)

        –        Sequential Program Mode Capability

     ▪  Fast Program and Erase Times

        –        2ms Typical Page Program (256 Bytes) Time

        –        45ms Typical 4-Kbyte Block Erase Time

        –        360ms Typical 32-Kbyte Block Erase Time
       –  720ms Typical 64-Kbyte Block Erase Time

▪      Automatic Checking and Reporting of Erase/Program Failures

▪      Software Controlled Reset

▪      JEDEC Standard Manufacturer and Device ID Read Methodology

▪      Low Power Dissipation

       –  200nA Ultra Deep Power Down current (Typical)

       –  5µA Deep Power-Down Current (Typical)

       –  25uA Standby current (Typical)

       –  3.5mA Active Read Current (Typical)

▪      Endurance: 100,000 Program/Erase Cycles

▪      Data Retention: 20 Years

▪      Complies with Full Industrial Temperature Range

7.1.3  Block Diagram

Figure 18 AT25XE041B Block Diagram

7.1.4  Connections and Signals

Figure 19 APDS-9250 Schematic Connections
Table 8    AT25XE041B Pin Assignment

Symbol     Name and Function                                                                                    Asserte  Type

                                                                                                                d State

           CHIP  SELECT:         Asserting     the pin  selects   the  device.  When     the pin  is  Low      Input

           deasserted, the device will be deselected and normally be placed in standby mode

       (not Deep Power-Down mode), and the SO pin will be in a high-impedance state.

           When the device is deselected, data will not be accepted on the SI pin. A high-to-

           low transition on the pin is required to start an operation, and a low-to-high

           transition is required to end an operation. When ending an internally self-timed

           operation such as a program or erase cycle, the device will not enter the standby

           mode until the completion of the operation.

SCK        SERIAL CLOCK: This pin is used to provide a clock to the device and is used to                       -        Input

           control the flow of data to and from the device. Command, address, and input data

           present on the SI pin is always latched in on the rising edge of SCK, while output

           data on the SO pin is always clocked out on the falling edge of SCK.

SI (I/O0)  SERIAL INPUT: The SI pin is used to shift data into the device. The SI pin is                        -        Input/

           used for all data input including command and address sequences. Data on the SI                               Output

           pin is always latched in on the rising edge of SCK. With the Dual-Output Read

           commands, the SI Pin becomes an output pin (I/O0) in conjunction with other pins

           to allow two bits of data on (I/O1-0) to be clocked out on every falling edge of SCK.

           To maintain consistency with the SPI nomenclature, the SI (I/O0) pin will be

           referenced  as  the   SI  pin   unless  specifically    addressing  the      Dual-I/O   modes    in

           which case it will be referenced as I/O0. Data present on the SI pin will be ignored

           whenever the device is deselected (CS is deasserted).

SO (I/O1)  SERIAL OUTPUT: The SO pin is used to shift data out from the device. Data on                         -        Input/

           the SO pin is always clocked out on the falling edge of SCK. With the Dual-Output                             Output

           Read commands, the SO Pin remains an output pin (I/O1) in conjunction with other

           pins to allow two bits of data on (I/O1-0) to be clocked out on every falling edge of

           SCK. To maintain consistency with the SPI nomenclature, the SO (I/O1) pin will

           be referenced as the SO pin unless specifically addressing the Dual-I/O modes in

           which case it ise referenced as I/O1. The SO pin will be in a high-impedance state

           whenever the device is deselected (CS is deasserted).

       WRITE PROTECT: The pin controls the hardware locking feature of the                             Low      Input

           device. Please refer to “Protection Commands and Features” on page 17 for more

           details on protection features and the pin. The pin is internally pulled-high

           and  may    be  left  floating  if  hardware      controlled     protection  will  not  be  used.

           However, it is recommended that the pin also be externally connected to VCC

           whenever possible.

   HOLD: The pin is used to temporarily pause serial communication without                     Low      Input

           deselecting or resetting the device. While the pin is asserted, transitions on

           the SCK pin and data on the SI pin will be ignored, and the SO pin will be in a

           high-impedance state. The CS pin must be asserted, and the SCK pin must be in

           the low state in order for a Hold condition to start. A Hold condition pauses

           serial communication only and does not have an effect on internally self-timed

           operations such as a program or erase cycle. Please refer to “Hold” on page 35

           for additional details on the Hold operation.The pin is internally pulled-

           high and may be left floating if the Hold function will not be used. However, it

           is  recommended       that  the pin      also  be    externally     connected  to  VCC

           whenever possible.

VCC        DEVICE POWER SUPPLY: The VCC pin is used to supply the source voltage to                             -        Power

           the device. Operations at invalid VCC voltages may produce spurious results and

           should not be attempted.

GND        GROUND: The ground reference for the power supply. GND should be connected                           -        Power

           to the system ground.
8 Absolute Maximum Characteristics

TBD
9 Operational Characteristics

9.1  Power supplies

TBD

9.2  Power Consumption

TBD
10   DC Electrical Characteristics

TBD
11   Environmental Specifications

TBD
12    Mechanical Drawings

12.1  SensiBLE Module: SIMBA

Figure 20 SensiBLE Top and Down View [mm]

      Top View [mm]                                       Down View

12.2  Battery Holder: SIMBA-BAT-CR2032

Figure 21 SensiBLE Battery Holder Top and Down View [mm]

      Top View [mm]                                       Down View
12.3  SensiBLE Module with Coin Battery: SIMBA-PRO

Figure 22 SensiBLE Module with Coin Battery Side View [mm]

      Side View [mm]
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