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SC-WII

器件型号:SC-WII
器件类别:开发板/开发套件/开发工具   
厂商名称:SolderCore
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器件描述

Development Boards u0026 Kits - ARM SolderCore CPU MAIN BOARD

参数
产品属性属性值
产品种类:
Product Category:
Daughter Cards & OEM Boards
制造商:
Manufacturer:
SolderCore
RoHS:YES
产品:
Product:
Daughter Boards
商标:
Brand:
SolderCore
接口类型:
Interface Type:
I2C
工作电源电压:
Operating Supply Voltage:
3.3 V
工厂包装数量:
Factory Pack Quantity:
1

SC-WII器件文档内容

CoreWii

Issue: A (Preliminary)

                        1
Contents

Table of Figures ........................................................................................................................2

Introduction ..............................................................................................................................3

Electrical ...................................................................................................................................4

Further Information ..................................................................................................................4

Appendix A: SolderCore Expansion Interface.....................................................................5

Table of Figures

Figure 1. CoreWii Module. ......................................................................................................3

Figure 2. SExI device foot print. ............................................. Error! Bookmark not defined.

                                                                                                                                                 2
Introduction

CoreWii is a SExI-compliant adapter for the Wii Nunchuk and Wii Classic Controller.

This module provides easy access to the Nunchuk communication and power lines.

With this PCB users can access the built in accelerometer, joystick and buttons the

Nunchuck provides

Features

  SExI-compliant footprint.

  Supported in CoreBASIC using the NUNCHUK-CONTROLLER and CLASSIC-

   CONTROLLER drivers

  User-controllable LED.

Applications

  Game controller

  Remote control

                              Figure 1. CoreWii Module.

                                                                                     3
Electrical

CoreWii uses the SExI interface (Appendix A: SolderCore Expansion Interface) for

rapid integration into a hardware platform.  The communications pins (I2C) are

taken to the appropriate SExI connector pins, as are the power rails.

There is an LED on the CoreWii module that can be controlled using the DIO line.

Table 1 details the pin configuration. CoreMag uses the 3V3 rail and not 5V.

Left Con       Description                   Right Con      Description

J1                                           J2

AN                   NC                      RX         NC

SDA                  I2C Data                5V0        NC

SCL                  I2C Clock               3V3        3.3V power supply rail

DIO            LED Indicator                 0V         Power return path

                     Table 1.   CoreWii pin Information

The pull-up resistors, R1 and R2, are not fitted to the board by default.  You will need

to fit both R1 and R2 if the external development platform does not provide I2C pull-

up resistors.

Further Information

More information about CoreWii, including sample code and schematics please visit

www.SolderCore.com.

                                                                                          4
Appendix A: SolderCore Expansion Interface

The SolderCore range of sensors use a standard interface named SExI (Sensor

Expansion Interface).  This 16-pin standard allows a single development hardware

platform to be used to evaluate a range of sensors. SExI has been designed to make

prototyping sensors simpler; the standard makes use of two 0.1” headers on a 0.1”

grid for easy assembly on to bread or vero-board

SExI defines signals so that sensors that use I2C, SPI and simple UART can take

advantage of a common footprint. SExI provides connections for two power rails,

3.3V and 5.0V. Figure 2 shows a dimensioned drawing of a full SExI device.

For sensors/devices that only support either I2C or SPI, it is not necessary to use a full

16 pin footprint. For SPI only sensors, only the top four rows of pins are required. For

I2C based sensors, only the bottom four pins are required, in both instances the

sensor foot print can be halved, saving board space and lowering cost. Sensors that

utilize UART communications require a full 16 pin footprint.

The DIO signal (bottom left) can be used as a digital input or output. Many sensors

use interrupt signals, to inform the external electronics/processor that an even has

occurred. In most instances the interrupt line is taken to DIO pin.

The AN pin can be either a Digital IO or an Analog output pin. Sensors that output

analog signals use this pin. The SenseCore shield routes the ANx signals to the ADC

pins of the SolderCore / Arduino headers.

The right hand side of the PCB is marked with a thick white bar this identifies the

power side of the connector.

                              Figure 2.  SExI device footprint.

                                                                                            5
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SC-WII
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