电子工程世界电子工程世界电子工程世界

型号

产品描述

搜索
 

RI-TMS3705ADR_08

器件型号:RI-TMS3705ADR_08
器件类别:热门应用    无线_射频_通信   
厂商名称:Pericom Semiconductor Corporation (Diodes Incorporated)
厂商官网:https://www.diodes.com/
下载文档

器件描述

SPECIALTY TELECOM CIRCUIT, PDSO16

专业电信电路, PDSO16

参数

RI-TMS3705ADR_08功能数量 1
RI-TMS3705ADR_08端子数量 16
RI-TMS3705ADR_08最大工作温度 85 Cel
RI-TMS3705ADR_08最小工作温度 -40 Cel
RI-TMS3705ADR_08额定供电电压 5 V
RI-TMS3705ADR_08加工封装描述 10 X 6 MM, SO-16
RI-TMS3705ADR_08状态 DISCONTINUED
RI-TMS3705ADR_08包装形状 RECTANGULAR
RI-TMS3705ADR_08包装尺寸 SMALL OUTLINE
RI-TMS3705ADR_08表面贴装 Yes
RI-TMS3705ADR_08端子形式 GULL WING
RI-TMS3705ADR_08端子间距 1.27 mm
RI-TMS3705ADR_08端子涂层 NICKEL PALLADIUM GOLD
RI-TMS3705ADR_08端子位置 DUAL
RI-TMS3705ADR_08包装材料 PLASTIC/EPOXY
RI-TMS3705ADR_08温度等级 INDUSTRIAL
RI-TMS3705ADR_08通信类型 TELECOM CIRCUIT

文档预览

RI-TMS3705ADR_08器件文档内容

                                                                                                                  RI-TMS3705ADR

www.ti.com                                                                                                        SCBS863 NOVEMBER 2003

                                                                LF BASE STATION IC

FEATURES                                                         Digital FSK Demodulator
                                                                High Speed Data Transmission in
Low Current Consumption in Sleep Mode
Automatic Transponder Frequency                                   Synchronous Mode

    Measurement and Adaptation                                  Power on Reset
                                                                PLL
Diagnosis Function                                             Short Circuit Protection
Full Bridge Antenna Driver                                     Support of All TI-RFidTM LF Transponder
Built in Band-Pass Filter and Limiter
                                                                    Functions

DESCRIPTION

The LF base station IC TMS3705ADR allows efficient development and production of RFID readers for low
power hand scanners, stationary readers and vehicle immobilizers. This base station IC drives the antenna of a
TI-RFidTM transponder system to send data modulated on the antenna signal, and to detect and demodulate the
response from the transponder. It allows also minimizing the external component count.

Package/Pin count                                               ORDERING INFORMATION
Packing/Delivery
                                                                               PACKAGE (1)
                                                                               SO 16 (10 mm 6 mm)
                                                                               Tape on Reel, 2500 units per reel

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
      www.ti.com/sc/package.

             Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
             Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

TI-RFid is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.                      Copyright 2003, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
RI-TMS3705ADR

                                                                                                                     www.ti.com

SCBS863 NOVEMBER 2003

ABSOLUTE MAXIMUM RATINGS(1)

over operating free-air temperature range (unless otherwise noted)

                                                              RI-TMS3705ADR                                          UNIT
                                                                                                                       V
   Operating Voltage                          4.5 to 5.5 DC
                                                                                                                       V
   Current Consumption                        Charge Phase (without antenna load)  typical 8 mA;   max. 20 mA         C
                                                                                                   max. 0.2 mA        C
   ESD Protection (MILSTD 883, HBM )          Sleep Mode (without I/O currents)    typical 15 A;
   Operating Temperature
   Storage Temperature                        2000 to +2000

                                              40 to +85

                                              40 to +100 (125 up to 1000hrs over lifetime)

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
      only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
      Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

OPERATING CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

                                   PARAMETER                                           PART NUMBER                   UNIT
                                                                                      RI-TMS3705ADR                  kHz
   Operating Frequency                                        Typical 134.2, FSK                                      H
   Interface to Micro Controller                              Two wire multifunctional serial interface, 15625 baud
   Antenna Inductivity                                        400700 recommended

2                                             Submit Documentation Feedback
www.ti.com                                         PACKAGE OPTION ADDENDUM

                                                                                                                  15-Jan-2008

PACKAGING INFORMATION

Orderable Device  Status (1)  Package Package  Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TMS3705A1DRG4     ACTIVE        Type Drawing              Qty

                                               16  Green (RoHS & CU NIPDAU Level-3-260C-168 HR

                                                   no Sb/Br)

(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

                              Addendum-Page 1
                                                     IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products                     amplifier.ti.com        Applications        www.ti.com/audio
Amplifiers                   dataconverter.ti.com    Audio               www.ti.com/automotive
Data Converters              dsp.ti.com              Automotive          www.ti.com/broadband
DSP                          www.ti.com/clocks       Broadband           www.ti.com/digitalcontrol
Clocks and Timers            interface.ti.com        Digital Control     www.ti.com/medical
Interface                    logic.ti.com            Medical             www.ti.com/military
Logic                        power.ti.com            Military            www.ti.com/opticalnetwork
Power Mgmt                   microcontroller.ti.com  Optical Networking  www.ti.com/security
Microcontrollers             www.ti-rfid.com         Security            www.ti.com/telephony
RFID                         www.ti.com/lprf         Telephony           www.ti.com/video
RF/IF and ZigBee Solutions                          Video & Imaging     www.ti.com/wireless
                                                     Wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
                       Copyright 2008, Texas Instruments Incorporated
This datasheet has been downloaded from:
             www.EEworld.com.cn

                 Free Download
           Daily Updated Database
      100% Free Datasheet Search Site
  100% Free IC Replacement Search Site
     Convenient Electronic Dictionary

               Fast Search System
             www.EEworld.com.cn

                                                 All Datasheets Cannot Be Modified Without Permission
                                                                Copyright Each Manufacturing Company

小广播

该厂商的其它器件

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程

北京市海淀区知春路23号集成电路设计园量子银座1305 电话:(010)82350740 邮编:100191

电子工程世界版权所有 京ICP证060456号 京ICP备10001474号 电信业务审批[2006]字第258号函 京公海网安备110108001534 Copyright © 2005-2017 EEWORLD.com.cn, Inc. All rights reserved