电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 

NSHC223G16TRB1

器件型号:NSHC223G16TRB1
器件类别:无源元件    电容器   
厂商名称:Nichicon(尼吉康)
厂商官网:http://www.nichicon.co.jp
下载文档

器件描述

CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 16V, 0.022uF, SURFACE MOUNT, 1206, CHIP

参数
是否Rohs认证不符合
厂商名称Nichicon(尼吉康)
包装说明, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.022 µF
电容器类型FILM CAPACITOR
介电材料POLYPHENYLENE SULPHIDE
高度0.9 mm
JESD-609代码e0
长度3.2 mm
制造商序列号NSHC
安装特点SURFACE MOUNT
负容差2%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, EMBOSSED PLASTIC, 7 INCH
正容差2%
额定(AC)电压(URac)12 V
额定(直流)电压(URdc)16 V
系列NSHC(1206,16 VOLT)
尺寸代码1206
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形状WRAPAROUND
宽度1.6 mm

文档预览

Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125
O
C (100pF ~ 0.1µF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC
ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW (100pF ~ 0.1µF) & FLOW (0.12µF ~ 0.22µF)
SOLDERING
• TAPE AND REEL PACKAGING
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
o
NSHC Series
NEW
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027
µF
100pF ~ .01
µF
3300pF ~ .047
µF
.012
µ
F ~ .1
µF
.047
µ
F ~ .1
µF
0.12
µ
F ~ 0.22
µF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt
-55 C ~ +125°C (0.12
µ
F ~ 0.22
µ
F voltage derated above 105°C)
0.6% max @ 1 KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3%
C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
1000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat:
+260°C Peak for 5 Seconds
(0.047
µ
F ~ 0.22
µ
F)
Humidity Load Life (Note 1):
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
Solderability with
10% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±2% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±2% of Initial Value
0.90% Maximum
(1) 1 Gigohm Minimum
(2) 0.5 Gigohm Minimum
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot
RECOMMENDED SOLDERING PROFILES
REFLOW SOLDERING
300
T
E
M
P
E
R
A
T
U
R
E
FLOW SOLDERING
0.12µF ~ 0.22µF only
300
Soldering
250°C Max.
RECOMMENDED LAND
PATTERN (mm)
EIA Size
0603
0805
1206
1210
1913
2416
A
0.6
0.8
1.8
1.8
2.6
3.8
B
2.0
2.4
3.6
3.6
6.6
7.8
C
0.7
1.1
1.4
2.3
3.0
3.8
250
200
°C 150
100
50
0
Pre-Heat
150°C Max.
Soldering
230°C Max.
Cool
Down
0
5 Seconds Max.
2 1/2 Minutes Max.
Less than
15 Seconds
2 Minutes Min.
3 Minutes Max.
5 Seconds Max.
2 Minutes Min.
A
B
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
181
C
T
E
M
P
E
R
A
T
U
R
E
250
200
°C 150
100
50
Pre-Heat
150°C Max.
Cool
Down
Stacked Film Capacitor Chips
STANDARD PRODUCTS AND SIZE CODE
Cap.
100 pF
120
150
180
220
270
330
390
470
560
680
820
0.001
µF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.18
0.22
Code
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
Working Voltage
(Vdc)
16
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
A1
A1
A1
A1
A1
A2
A2
B1
B1
B1
B1
B2
B2
B3
B3
C2
C2
C3
C3
50
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
B1
B1
B1
B1
B1
B2
B2
C1
C1
C2
C2
C2
C3
C3
D1
D2
D2
D3
D4
E1
E3
E4
E5
NSHC Series
Length
Width
L ±0.2
W
1.6
0.8 ±0.15
2.0
3.2
1.25±0.2
1.6±0.2
Height
H ±0.2
0.7±0.15
0.9
1.1
0.9
1.1
1.5
1.1
1.5
2.1
1.4
2.0
2.4
2.8
1.8
2.4
2.8
3.2
EIA
Code
0603
0805
1206
0.65±0.30
1210
DIMENSION (mm) AND CASE CODE
Case Code
J1
A1
A2
B1
B2
B3
C1
C2
C3
D1
D2
D3
D4
E1
E3
E4
E5
p
0.35±0.20
0.45±0.25
3.2
2.5±0.2
4.8
3.3±0.3
1913
0.35±0.20
2416
6.0
4.1±0.3
OUTLINE DRAWING (J1 ~ C3 CASE SIZES)
Stacked Element Terminations:
Standard: Sn/Pb
Optional: 95.5% Sn,
4% Ag and 0.5% Cu over
phosphorus copper barrier
over copper base
H
p
L
2
L
1
p
W
OUTLINE DRAWING (D1 ~ E5 CASE SIZES)
Stacked Element Terminations:
Standard: Sn/Pb
Optional: 95.5% Sn,
4% Ag and 0.5% Cu over
phosphorus copper barrier
over copper base
H
p
L
2
L
1
p
W
PART NUMBERING SYSTEM
NSHC 103 J 16 TR A2 F
Lead Free (Optional)
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%, G=±2%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
®
182
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
Stacked Film Capacitor Chips
REEL DIMENSIONS (mm) AND QUANTITY
Case Code
J1
A3
A4
B4
B5
B6
C4
C5
C6
C7
D ± 2.0 D2 ± 0.6
D3 ±
1.0
W ± 1.0
t ± 1.0
Q'ty/
Reel
Taping Specificaitons
3,000
178
21.0
60.0
9.0
2.0
2,000
REEL
t
13
.0
+/
0.
5
2.0
+/−
0.5
D2
D1
EMBOSSED PLASTIC TAPE DIMENSIONS (mm)
Case Code
J1
A3
A4
B4
B5
B6
C4
C5
C6
C7
A ±0.1 B ±0.1 C ±0.2
1.00
1.55
1.9
1.85
2.3
3.5
1.1
1.3
1.5
1.5
1.5
1.9
1.9
1.9
2.5
2.5
4.0 ±0.1
1.5 +0.1
-0
W
t ±0.5 W ±0.3 F ±0.5 P ±0.1 Dφ + 0.2
0.20
0.25
0.25
8.0
3.5
4.0
1.0
2.8
3.5
0.25
P
1
1.75 ±0.1
D3
t
F
W
B
D
o
A
P
C
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
185

技术资料推荐

论坛推荐

技术视频推荐

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
搜索索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
器件入口   4T 54 5Q 5R 99 AS DI J7 JF KE R5 RP SD UY WV

北京市海淀区知春路23号集成电路设计园量子银座1305 电话:(010)82350740 邮编:100191

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2021 EEWORLD.com.cn, Inc. All rights reserved