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MX25L1606EM2I-12G/TR

器件型号:MX25L1606EM2I-12G/TR
器件类别:存储    存储   
厂商名称:Macronix
厂商官网:http://www.macronix.com/en-us/Pages/default.aspx
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器件描述

Flash,

参数
厂商名称Macronix
包装说明SOP,
Reach Compliance Codeunknown
备用内存宽度1
最大时钟频率 (fCLK)86 MHz
JESD-30 代码R-PDSO-G8
长度5.28 mm
内存密度16777216 bit
内存集成电路类型FLASH
内存宽度2
功能数量1
端子数量8
字数8388608 words
字数代码8000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8MX2
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行SERIAL
编程电压2.7 V
座面最大高度1.75 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度5.23 mm
Base Number Matches1

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MX25L1606E
MX25L1606E
3V, 16M-BIT [x 1/x 2]
CMOS SERIAL FLASH MEMORY
Key Features
• Hold Feature
• Low Power Consumption
• Auto Erase and Auto Program Algorithms
• Additional 512 bit secured OTP for unique identifier
P/N: PM1548
1
Rev. 1.9, November 13, 2017
MX25L1606E
Contents
FEATURES .................................................................................................................................................................. 5
GENERAL DESCRIPTION ......................................................................................................................................... 6
PIN CONFIGURATIONS ............................................................................................................................................. 7
PIN DESCRIPTION ...................................................................................................................................................... 8
BLOCK DIAGRAM....................................................................................................................................................... 9
MEMORY ORGANIZATION ....................................................................................................................................... 10
Table 1. Memory Organization ........................................................................................................................... 10
DEVICE OPERATION ................................................................................................................................................ 11
Figure 1. Serial Modes Supported...................................................................................................................... 11
DATA PROTECTION.................................................................................................................................................. 12
Table 2. Protected Area Sizes ............................................................................................................................ 13
Table 3. 512 bit Secured OTP Definition
............................................................................................................ 14
HOLD FEATURE........................................................................................................................................................ 15
Figure 2. Hold Condition Operation ................................................................................................................... 15
COMMAND DESCRIPTION ....................................................................................................................................... 16
Table 4. COMMAND DEFINITION ..................................................................................................................... 16
(1) Write Enable (WREN) ................................................................................................................................... 17
(2) Write Disable (WRDI) .................................................................................................................................... 17
(3) Read Status Register (RDSR) ...................................................................................................................... 17
Table 5. Status Register ..................................................................................................................................... 18
(4) Write Status Register (WRSR) ...................................................................................................................... 18
Table 6. Protection Modes .................................................................................................................................. 19
(5) Read Data Bytes (READ) ............................................................................................................................. 20
(6) Read Data Bytes at Higher Speed (FAST_READ) ....................................................................................... 20
(7) Dual Output Mode (DREAD) ......................................................................................................................... 20
(8) Sector Erase (SE) ......................................................................................................................................... 20
(9) Block Erase (BE)........................................................................................................................................... 21
(10) Chip Erase (CE) .......................................................................................................................................... 21
(11) Page Program (PP) ..................................................................................................................................... 21
(12) Deep Power-down (DP) .............................................................................................................................. 22
(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................. 22
(14) Read Identification (RDID)
.......................................................................................................................... 23
(15) Read Electronic Manufacturer ID & Device ID (REMS) .............................................................................. 23
Table 7. ID DEFINITIONS ................................................................................................................................. 23
(16) Enter Secured OTP (ENSO) ....................................................................................................................... 23
(17) Exit Secured OTP (EXSO) .......................................................................................................................... 24
(18) Read Security Register (RDSCUR) ............................................................................................................ 24
Table 8. SECURITY REGISTER DEFINITION ................................................................................................... 24
(19) Write Security Register (WRSCUR) ............................................................................................................ 24
P/N: PM1548
2
Rev. 1.9, November 13, 2017
MX25L1606E
(20) Read SFDP Mode (RDSFDP)..................................................................................................................... 25
Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence..................................................... 25
Table 9. Signature and Parameter Identification Data Values
........................................................................... 26
Table 10. Parameter Table (0): JEDEC Flash Parameter Tables ....................................................................... 27
Table 11. Parameter Table (1): Macronix Flash Parameter Tables ..................................................................... 29
POWER-ON STATE ................................................................................................................................................... 31
ELECTRICAL SPECIFICATIONS .............................................................................................................................. 32
ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 32
Figure 4. Maximum Negative Overshoot Waveform .......................................................................................... 32
CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 32
Figure 5. Maximum Positive Overshoot Waveform ............................................................................................ 32
Figure 6. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL
.............................................................. 33
Figure 7. OUTPUT LOADING ........................................................................................................................... 33
Figure 8. SCLK TIMING DEFINITION ................................................................................................................ 33
Table 12. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V - 3.6V)
... 34
Table 13. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V - 3.6V)
... 35
Timing Analysis ........................................................................................................................................................ 36
Figure 9. Serial Input Timing .............................................................................................................................. 36
Figure 10. Output Timing .................................................................................................................................... 36
Figure 11. Hold Timing ....................................................................................................................................... 37
Figure 12. WP# Disable Setup and Hold Timing during WRSR when SRWD=1 ............................................... 37
Figure 13. Write Enable (WREN) Sequence (Command 06h) ........................................................................... 38
Figure 14. Write Disable (WRDI) Sequence (Command 04h)............................................................................ 38
Figure 15. Read Status Register (RDSR) Sequence (Command 05h) .............................................................. 39
Figure 16. Write Status Register (WRSR) Sequence (Command 01h)............................................................. 39
Figure 17. Read Data Bytes (READ) Sequence (Command 03h) .................................................................... 39
Figure 18. Read at Higher Speed (FAST_READ) Sequence (Command 0Bh)................................................. 40
Figure 19. Dual Output Read Mode Sequence (Command 3Bh) ....................................................................... 41
Figure 20. Sector Erase (SE) Sequence (Command 20h) ................................................................................ 41
Figure 21. Block Erase (BE) Sequence (Command 52h or D8h) ...................................................................... 41
Figure 22. Chip Erase (CE) Sequence (Command 60h or C7h) ....................................................................... 42
Figure 23. Page Program (PP) Sequence (Command 02h).............................................................................. 42
Figure 24. Deep Power-down (DP) Sequence (Command B9h) ...................................................................... 43
Figure 25. Release from Deep Power-down (RDP) Sequence (Command ABh) ............................................. 43
Figure 26. Read Electronic Signature (RES) Sequence (Command ABh) ........................................................ 43
Figure 27. Read Identification (RDID) Sequence (Command 9Fh)
.................................................................... 44
Figure 28. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90h)............................ 44
Figure 29. Read Security Register (RDSCUR) Sequence (Command 2Bh) ...................................................... 45
Figure 30. Write Security Register (WRSCUR) Sequence (Command 2Fh) ..................................................... 45
Figure 31. Power-up Timing ............................................................................................................................... 46
Table 14. Power-Up Timing ............................................................................................................................... 46
P/N: PM1548
3
Rev. 1.9, November 13, 2017
MX25L1606E
OPERATING CONDITIONS ....................................................................................................................................... 47
Figure 32. AC Timing at Device Power-Up ......................................................................................................... 47
Figure 33. Power-Down Sequence .................................................................................................................... 48
ERASE AND PROGRAMMING PERFORMANCE .................................................................................................... 49
DATA RETENTION .................................................................................................................................................... 49
LATCH-UP CHARACTERISTICS .............................................................................................................................. 49
ORDERING INFORMATION ...................................................................................................................................... 50
PART NAME DESCRIPTION ..................................................................................................................................... 51
PACKAGE INFORMATION ........................................................................................................................................ 52
16-PIN SOP (300mil).......................................................................................................................................... 52
8-PIN SOP (150mil)............................................................................................................................................ 53
8-PIN SOP (200mil)............................................................................................................................................ 54
8-PIN PDIP (300mil) ........................................................................................................................................... 55
8-LAND WSON (6x5mm) ................................................................................................................................... 56
8-LAND USON (4x4mm) .................................................................................................................................... 57
24-BALL BGA ..................................................................................................................................................... 58
REVISION HISTORY ................................................................................................................................................. 59
P/N: PM1548
4
Rev. 1.9, November 13, 2017
MX25L1606E
16M-BIT [x 1 / x 2] CMOS SERIAL FLASH
FEATURES
GENERAL
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program opera-
tions
• Supports Serial Peripheral Interface -- Mode 0 and
Mode 3
16,777,216 x 1 bit structure or 8,388,608 x 2 bits (Dual
Output mode) structure
• 512 Equal Sectors with 4K byte each
- Any Sector can be erased individually
• 32 Equal Blocks with 64K byte each
- Any Block can be erased individually
• Program Capability
- Byte base
- Page base (256 bytes)
• Latch-up protected to 100mA from -1V to Vcc +1V
PERFORMANCE
• High Performance
- Fast access time: 86MHz serial clock
- Serial clock of Dual Output mode : 80MHz
- Fast program time: 0.6ms(typ.) and 3ms(max.)/page
- Byte program time: 9us (typ.)
- Fast erase time: 40ms(typ.) /sector ; 0.4s(typ.) /block
• Low Power Consumption
- Low active read current: 25mA(max.) at 86MHz
- Low active programming current: 15mA (typ.)
- Low active sector erase current: 9mA (typ.)
- Low standby current: 15uA (typ.)
- Deep power-down mode 2uA (typ.)
• Typical 100,000 erase/program cycles
• 20 years of data retention
SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- Block lock protection
The BP3-BP0
status bit defines the size of the area
to be software protection against program and
erase instructions
- Additional 512 bit secured OTP for unique identifier
• Auto Erase and Auto Program Algorithm
-
Automatically erases and verifies data at selected
sector
-
Automatically programs and verifies data at select-
ed page by an internal algorithm that automatically
times the program pulse widths (Any page to be pro-
gramed should have page in the erased state first)
Status Register Feature
Electronic Identification
-
JEDEC 1-byte manufacturer ID and 2-byte device
ID
- RES command for 1-byte Device ID
- REMS commands for 1-byte manufacturer ID and
1-byte device ID
Support Serial Flash Discoverable Parameters (SFDP)
mode
HARDWARE FEATURES
• PACKAGE
-
16-pin SOP (300mil)
-
8-pin SOP (150mil)
-
8-pin SOP (200mil)
-
8-pin PDIP (300mil)
- 8-land WSON (6x5mm)
- 8-land USON (4x4mm)
-
24-Ball BGA
-
All devices are RoHS Compliant and Halogen-
free
P/N: PM1548
5
Rev. 1.9, November 13, 2017
小广播

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