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MCFT0FT10N8

器件型号:MCFT0FT10N8
厂商名称:Multicomp
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器件描述

INDUCTOR 0402 10.8NH +/-1%

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Thin Film Chip Inductor
AL Series
Features
• 
• 
• 
• 
• 
• 
Photolithographic single layer ceramic chip
High SRF, excellent Q, superior temperature stability
Tight tolerance of ± 1% or ± 0.1nH
Self resonant frequency controlled within 10%
Stable inductance in high frequency circuit
Highly stable design for critical needs
Applications
•  Cellular Telephone, Pagers and GPS Products
•  VCO, TCXO Circuit and RF Transceiver Module
•  Wireless LAN, Bluetooth Module, Communication Appliances
Construction
1
2
3
4
Alumina Substrate
Inner Electrode (Ni-Cr)
Barrier Layer (Ni)
External Electrode (Sn)
5
6
7
8
Edge Electrode
Cu Circuits
Overcoat
Marking
Dimensions
Size
(Inch)
0201
0402
A
0.6 ± 0.05
1 ± 0.05
B
0.3 ± 0.05
0.5 ± 0.05
C
0.23 ± 0.05
0.32 ± 0.05
D
0.15 ± 0.05
0.2 ± 0.1
Weight
(g)
(1,000pcs)
0.3
0.9
Dimensions: mm
www.element14.com
www.farnell.com
www.newark.com
Page <1>
17/05/12
V1.0
Thin Film Chip Inductor
AL Series
Standard Electrical Specifications
Chip Inductors / High Current Type
Inductance
(nH)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3
3.1
3.2
3.3
0.50
400
0.35
450
0.30
500
±0.1, 0.2, 0.3nH
10 / 500MHz
6
0.20
0.25
0.15
0.1
600
0.05
Inductance
Tolerance
(nH or %)
Quality
Factor
min.
SRF
(GHz) min.
DCR
(Ω) max.
IDC
(mA) max.
www.element14.com
www.farnell.com
www.newark.com
Page <2>
17/05/12
V1.0
Thin Film Chip Inductor
AL Series
Inductance
(nH)
3.4
3.5
3.6
3.7
3.8
3.9
4
Chip Inductors / Standard Type
0.2
0.3
0.4
0.5
0.8
0.9
1.1
1.2
1.3
1.4
1.6
1.7
1.8
1.9
2.0
2.1
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.4
3.5
3.6
0.55
6
0.45
380
8
0.35
440
±0.1, 0.2, 0.3nH
13 / 500MHz
560
10
0.25
12
0.15
700
14
0.1
800
±0.1, 0.2, 0.3nH
10 / 500MHz
6
0.80
350
Inductance
Tolerance
(nH or %)
Quality
Factor
min.
SRF
(GHz) min.
DCR
(Ω) max.
IDC
(mA) max.
www.element14.com
www.farnell.com
www.newark.com
Page <3>
17/05/12
V1.0
Thin Film Chip Inductor
AL Series
Inductance
(nH)
3.7
3.8
3.9
4.3
5.4
5.6
5.9
6.5
7.2
8.0
8.1
9.1
10.8
12.0
13.8
17.0
18.0
20.8
27.0
±1, 2, 3, 5%
4.5
3.7
3.1
2.8
2.5
1.35
1.55
1.75
1.95
2.15
2.55
3.25
200
180
100
90
75
13 / 500MHz
5.5
1.25
220
±0.1, 0.2, 0.3nH
6
0.85
280
0.65
320
0.55
340
Inductance
Tolerance
(nH or %)
Quality
Factor
min.
SRF
(GHz) min.
DCR
(Ω) max.
IDC
(mA) max.
1.05
260
Reflow
www.element14.com
www.farnell.com
www.newark.com
Page <4>
17/05/12
V1.0
Thin Film Chip Inductor
AL Series
Environmental Characteristics
Item
Inductance
Requirement
As Spec.
Test Method
Measuring equipment and fixture:
0201: HP4287 + Agilent 16196C
0402: HP4287 + Agilent 16196B
Apply 100V 
dc
 for 1minute
40 ± 2°C, 90 ~ 95% R.H. Max. working voltage for 1,000 hrs 
with 1.5 hrs “ON” and 0.5 hrs “OFF”
Bending Amplitude 3mm for 10 seconds
245 ± 5°C for 3 seconds
260 ± 5°C for 10 seconds
Apply 100VA (rms) for 1minute
85 ± 2°C, 1,000 +48/-0 hours
ΔL ≤ 10%
-40 ± 3°C, 1,000 +48/-0 hours
-40 / RT / 85 / RT, 10 cycles
Insulation Resistance
Damp Heat with Load
Bending Strength
Solderability
Resistance to Soldering Heat
Dielectric Withstand Voltage
High Temperature Exposure
Low Temperature Storage
Temperature Cycle
> 1,000MΩ
ΔL ≤ 10%
As Spec.
95% min. coverage
ΔL ≤ 10%
> 100V
Reference Standards: MIL-STD-202F, JIS-C 5201-1
Storage Temperature : 25 ± 3°C; Humidity < 80%RH
Packaging
Reel Specifications & Packaging Quantity
Size
(Inch)
0201
0402
ψA
178 ± 1.0
ψB
60 + 1
ψC
13.5 ± 0.7
W
9.5 ± 1
T
11.5 ± 1
Quantity
(EA)
10,000
Dimensions: mm
www.element14.com
www.farnell.com
www.newark.com
Page <5>
17/05/12
V1.0

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