DSC1001/3/4
1.8V-3.3V Low-Power Precision CMOS Oscillators
Features General Description
• Frequency Range: 1 MHz to 150 MHz The DSC1001/3/4 is a silicon MEMS based CMOS
• Exceptional Stability over Temperature family of oscillators that offers excellent jitter and
- ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm stability performance over a wide range of supply
• Operating Voltage voltages and temperatures. The device operates from
- 1.7 to 3.6V 1 MHz to 150 MHz with supply voltages between 1.8 to
3.3 volts and temperature ranges up to –40°C to
• Operating Temperature Range 105°C.
- Ext. Industrial –40°C to 105°C The DSC1001/3/4 incorporate an all silicon resonator
- Industrial –40°C to 85°C that is extremely robust and nearly immune to stress
- Commercial –20°C to 70°C related fractures, common to crystal based oscillators.
• Low Operating and Standby Current Without sacrificing the performance and stability
- 6 mA Operating (1 MHz) required of today’s systems, a crystal-less design
- 15 µA Standby (Max.) allows for a higher level of reliability, making the
• Ultra Miniature Footprint DSC1001/3/4 ideal for rugged, industrial, and portable
applications where stress, shock, and vibration can
- 2.5 mm x 2.0 mm x 0.85 mm damage quartz crystal based systems.
- 3.2 mm x 2.5 mm x 0.85 mm Available in industry standard packages, the
- 5.0 mm x 3.2 mm x 0.85 mm DSC1001/3/4 can be “dropped-in” to the same PCB
- 7.0 mm x 5.0 mm x 0.85 mm footprint as standard crystal oscillators.
• MIL-STD 883 Shock and Vibration Resistant The DSC1003 and DSC1004 have the same
• Pb Free, RoHS, Reach SVHC Compliant functionality and performance as the DSC1001, but
• AEC-Q100 Reliability Qualified feature higher output drives of 25 pF and 40 pF,
respectively.
Applications Package Types
• Mobile Applications
• Consumer Electronics DSC1001/3/4
• Portable Electronics CDFN/DFN
• DVR, CCTV, Surveillance Cameras (Top View)
• Low Profile Applications
• Industrial Applications STANDBY# 1 4 VDD
Benefits
• Pin for Pin “Drop-In” Replacement for Industry GND 2 3 OUT
Standard Oscillators
• Semiconductor Level Reliability, Significantly
Higher than Quartz
• Short Mass Production Lead Times
• Longer Battery Life/Reduced Power Consumption
• Compact Plastic Package
• Cost Effective
2017 Microchip Technology Inc. DS20005529B-page 1
DSC1001/3/4
Block Diagram
VDD OUTPUT
RESONATOR PFD VCO
FFRRAACC-N
PLL
STANDBY# GND
(PIN1)
DS20005529B-page 2 2017 Microchip Technology Inc.
DSC1001/3/4
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage (VIN) ............................................................................................................................–0.3V to VDD + 0.3V
ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM
Recommended Operating Conditions
Supply Voltage (VDD) ................................................................................................................................ +1.7V to +3.6V
Output Load (ZL) ............................................................................................................................. R > 10 kΩ, C ≤ 15 pF
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
TABLE 1-1: DC CHARACTERISTICS
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Frequency F0 1 — 150 MHz Single Frequency
— — ±10 Includes frequency variations
Frequency Tolerance ∆f — — ±20 ppm due to initial tolerance,
— — ±25 temperature and power supply
— — ±50 voltage
Aging ∆f — — ±5 ppm 1 year @ +25°C
Supply Current, Standby IDD — — 15 µA T = +25°C
Output Startup Time tSU — 1.0 1.3 ms T = +25°C
(Note 1)
Output Disable Time tDA — 20 100 ns —
Output Duty Cycle SYM 45 — 55 % —
Input Logic Level High VIH 0.75 x VDD — — V —
Input Logic Level Low VIL — — 0.25 x VDD V —
VDD = 1.8V
— 6.0 6.3 1 MHz
Supply Current, No Load IDD — 6.5 7.1 mA 27 MHz CL = 0 pF,
RL = ∞,
— 7.2 8.5 70 MHz T = +25°C
— 8.3 11.9 150 MHz
0.8 x VDD — — –6 mA, DSC1004, CL = 40 pF
Output Logic Level High VOH 0.8 x VDD — — V –6 mA, DSC1003, CL = 25 pF
0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF
— — 0.2 x VDD 6 mA, DSC1004, CL = 40 pF
Output Logic Level Low VOL — — 0.2 x VDD V 6 mA, DSC1003, CL = 25 pF
— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
2017 Microchip Technology Inc. DS20005529B-page 3
DSC1001/3/4
TABLE 1-1: DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
— 1.4 3.0 DSC1001, CL =
15 pF
Output Transition Rise tR — 1.5 3.0 ns DSC1003, CL = T = +25°C,
Time 25 pF 20% to 80%
— 1.8 3.0 DSC1004, C2 =
40 pF
— 1.0 3.0 DSC1001, CL =
15 pF
Output Transition Fall tF — 1.1 3.0 ns DSC1003, CL = T = +25°C,
Time 25 pF 20% to 80%
— 1.2 3.0 DSC1004, C2 =
40 pF
Jitter, Max. JCC — 60 — ps f = 100 MHz (Note 2)
Cycle-to-Cycle
Period Jitter JP — 10 15 psRMS f = 100 MHz (Note 2)
VDD = 2.5V
— 6.0 6.4 1 MHz
Supply Current, No Load IDD — 6.7 7.5 mA 27 MHz CL = 0 pF,
RL = ∞,
— 7.7 9.4 70 MHz T = +25°C
— 9.6 13.9 150 MHz
0.9 x VDD — — –6 mA, DSC1004, CL = 40 pF
Output Logic Level High VOH 0.8 x VDD — — V –6 mA, DSC1003, CL = 25 pF
0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF
— — 0.1 x VDD 6 mA, DSC1004, CL = 40 pF
Output Logic Level Low VOL — — 0.2 x VDD V 6 mA, DSC1003, CL = 25 pF
— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF
— 1.0 2.0 DSC1001, CL =
15 pF
Output Transition Rise tR — 1.1 2.0 ns DSC1003, CL = T = +25°C,
Time 25 pF 20% to 80%
— 1.2 2.0 DSC1004, C2 =
40 pF
— 0.9 2.0 DSC1001, CL =
15 pF
Output Transition Fall tF — 1.0 2.0 ns DSC1003, CL = T = +25°C,
Time 25 pF 20% to 80%
— 1.1 2.0 DSC1004, C2 =
40 pF
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
DS20005529B-page 4 2017 Microchip Technology Inc.
DSC1001/3/4
TABLE 1-1: DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Jitter, Max. JCC — 50 — ps f = 100 MHz (Note 2)
Cycle-to-Cycle
Period Jitter JP — 5 10 psRMS f = 100 MHz (Note 2)
VDD = 3.3V
— 6.0 6.5 1 MHz
Supply Current, No Load IDD — 6.8 8.0 mA 27 MHz CL = 0 pF,
RL = ∞,
— 8.2 10.5 70 MHz T = +25°C
— 10.8 16.6 150 MHz
0.9 x VDD — — –8 mA, DSC1004, CL = 40 pF
Output Logic Level High VOH 0.9 x VDD — — V –6 mA, DSC1003, CL = 25 pF
0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF
— — 0.1 x VDD 8 mA, DSC1004, CL = 40 pF
Output Logic Level Low VOL — — 0.1 x VDD V 6 mA, DSC1003, CL = 25 pF
— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF
— 1.0 2.0 DSC1001, CL =
15 pF
Output Transition Rise tR — 1.1 2.0 ns DSC1003, CL = T = +25°C,
Time 25 pF 20% to 80%
— 1.2 2.0 DSC1004, C2 =
40 pF
— 0.9 2.0 DSC1001, CL =
15 pF
Output Transition Fall tF — 1.0 2.0 ns DSC1003, CL = T = +25°C,
Time 25 pF 20% to 80%
— 1.1 2.0 DSC1004, C2 =
40 pF
Jitter, Max. JCC — 50 — ps f = 100 MHz (Note 2)
Cycle-to-Cycle
Period Jitter JP — 5 10 psRMS f = 100 MHz (Note 2)
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
2017 Microchip Technology Inc. DS20005529B-page 5
DSC1001/3/4
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
–40 — +105 °C Ordering Option L
Operating Temperature Range (T) TA –40 — +85 °C Ordering Option I
–20 — +70 °C Ordering Option E
Junction Operating Temperature TJ — — +150 °C —
Storage Temperature Range TA –55 — +150 °C —
Soldering Temperature Range TS — — +260 °C 40 sec. max
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20005529B-page 6 2017 Microchip Technology Inc.
DSC1001/3/4
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1 and Table 2-2.
TABLE 2-1: CDFN PACKAGE PIN FUNCTION TABLE
Pin Number Symbol Description
1 STANDBY# Standby input (Section 4.1 “Standby Function”)
2 GND Power supply ground
3 OUT Oscillator output
4 VDD Positive power supply
TABLE 2-2: DFN PACKAGE PIN FUNCTION TABLE
Pin Number Symbol Description
1 STANDBY# Standby input (Section 4.1 “Standby Function”)
2 GND Power supply ground
3 OUT Oscillator output
4 VDD Positive power supply
Center Pad NC Tie to GND or do not connect.
2017 Microchip Technology Inc. DS20005529B-page 7
DSC1001/3/4
3.0 NOMINAL PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 3-1: Supply Current. FIGURE 3-4: Supply Current.
FIGURE 3-2: Rise Time. FIGURE 3-5: Fall Time.
FIGURE 3-3: Rise Time. FIGURE 3-6: Fall Time.
DS20005529B-page 8 2017 Microchip Technology Inc.
DSC1001/3/4
4.0 OUTPUT WAVEFORM
tR tF
VOH
OUTPUT
VOL
1/fo tEN
tDA VIH
STANDBY# VIL
FIGURE 4-1: Output Waveform.
4.1 Standby Function
Standby# (Pin 1) Output (Pin 3)
High Level Output ON
Open (no connect) Output ON
Low Level High Impedance
2017 Microchip Technology Inc. DS20005529B-page 9
DSC1001/3/4
5.0 TEST CIRCUIT
IDD
4 3
1 2
VDD 0.01μF 15pF
*VSD
*VSD = Standby# Logic Level Input
FIGURE 5-1: DSC1001/3/4 Test Circuit.
DS20005529B-page 10 2017 Microchip Technology Inc.
DSC1001/3/4
6.0 BOARD LAYOUT (RECOMMENDED)
Via to GND Layer
C1
VDD Output
Standby GND
Via to GND Layer
FIGURE 6-1: Recommended Board Layout for DSC1001/3/4.
2017 Microchip Technology Inc. DS20005529B-page 11
DSC1001/3/4
7.0 SOLDER REFLOW PROFILE
20-40
260°C 3C/Sec Max. Sec
(°C) 217°C 60-150
Temperature 200°C Sec 6C/Sec Max.
150°C 3C/Sec Max. 60-180 ReŇow
Sec
Pre heat Cool
25°C Time
8 min max
FIGURE 7-1: Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max.
Preheat Time 150°C to 200°C 60 to 180 sec.
Time maintained above 217°C 60 to 150 sec.
Peak Temperature 255°C to 260°C
Time within 5°C of Actual Peak 20 to 40 sec.
Ramp-Down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 minutes max.
DS20005529B-page 12 2017 Microchip Technology Inc.
DSC1001/3/4
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
4-Lead CDFN/DFN* Example
XXXXXX 0400000
DCPYYWW DCP1121
0SSS 0603
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e3
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
*
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc. DS20005529B-page 13
DSC1001/3/4
4-Lead DFN 7.0 mm x 5.0 mm Package Outline & Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005529B-page 14 2017 Microchip Technology Inc.
DSC1001/3/4
4-Lead CDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern
2017 Microchip Technology Inc. DS20005529B-page 15
DSC1001/3/4
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern
DS20005529B-page 16 2017 Microchip Technology Inc.
DSC1001/3/4
4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern
2017 Microchip Technology Inc. DS20005529B-page 17
DSC1001/3/4
NOTES:
DS20005529B-page 18 2017 Microchip Technology Inc.
DSC1001/3/4
APPENDIX A: REVISION HISTORY
Revision A (September 2017)
• Converted Micrel data sheet DSC1001 to Micro-
chip format data sheet DS20005529A.
• Minor text changes throughout.
• Added Table 2-2 for DFN package.
• Combined Micrel data sheet DSC1003 and
DSC1004 into this data sheet.
- Updated Section 1.0 “Electrical Character-
istics” to reflect this change.
- Updated General Description and Features
to reflect this change.
Revision B (November 2017)
• Updated VOH and VOL values in Table 1-1.
2017 Microchip Technology Inc. DS20005529B-page 19
DSC1001/3/4
NOTES:
DS20005529B-page 20 2017 Microchip Technology Inc.
DSC1001/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO. X X X -XXX.XXXX X Examples:
a) DSC1001AE1-010.0000T:
Device Package Temperature Stability Frequency Package 1.8V - 3.3V Low-Power Pre-
Range cision CMOS Oscillator, 4-
Lead 7.0 mm x 5.0 mm
DSC1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS DFN, Ext. Commercial Tem-
Device: perature Range, ±50 ppm,
Oscillator 10 MHz Output Fre-
quency, 1,000/Reel
Package: A = 4-Lead 7.0 mm x 5.0 mm DFN b) DSC1003BL2-030.0000:
B = 4-Lead 5.0 mm x 3.2 mm CDFN 1.8V - 3.3V Low-Power Pre-
C = 4-Lead 3.2 mm x 2.5 mm CDFN cision CMOS Oscillator, 4-
D = 4-Lead 2.5 mm x 2.0 mm CDFN Lead 5.0 mm x 3.2 mm
CDFN, Ext. Industrial Tem-
Temperature E = –20C to +70C (Extended Commercial) perature Range, ±25 ppm,
Range: I = –40C to +85C (Industrial) 30 MHz Output Fre-
L = –40C to +105C (Extended Industrial) quency, 110/Tube
c) DSC1001DE5-150.0000:
Stability: 1 = ±50ppm 1.8V - 3.3V Low-Power Pre-
2 = ±25ppm cision CMOS Oscillator, 4-
3 = ±20 ppm Lead 2.5 mm x 2.0 mm
5 = ±10 ppm CDFN, Ext. Commercial
Temperature Range,
Frequency: xxx.xxxx = 1 MHz to 150 MHz (user-defined) ±10 ppm, 150 MHz Output
Frequency, 110/Tube
Packing Option: = 110/Tube d) DSC1004AI3-075.0000T:
T = 1,000/Reel 1.8V - 3.3V Low-Power
Precision CMOS Oscilla-
tor, 4-Lead 7.0 mm x
5.0 mm DFN, Industrial
Temperature Range,
±20 ppm, 75 MHz
Output Frequency,
1,000/Reel
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2017 Microchip Technology Inc. DS20005529B-page 21
DSC1001/3/4
NOTES:
DS20005529B-page 22 2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device Trademarks
applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, AnyRate, AVR,
and may be superseded by updates. It is your responsibility to AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
ensure that your application meets with your specifications. CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
MICROCHIP MAKES NO REPRESENTATIONS OR KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
WARRANTIES OF ANY KIND WHETHER EXPRESS OR maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
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OTHERWISE, RELATED TO THE INFORMATION, Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
INCLUDING BUT NOT LIMITED TO ITS CONDITION, Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
QUALITY, PERFORMANCE, MERCHANTABILITY OR trademarks of Microchip Technology Incorporated in the U.S.A.
FITNESS FOR PURPOSE. Microchip disclaims all liability and other countries.
arising from this information and its use. Use of Microchip ClockWorks, The Embedded Control Solutions Company,
devices in life support and/or safety applications is entirely at EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
the buyer’s risk, and the buyer agrees to defend, indemnify and mTouch, Precision Edge, and Quiet-Wire are registered
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suits, or expenses resulting from such use. No licenses are Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
conveyed, implicitly or otherwise, under any Microchip Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
intellectual property rights unless otherwise stated. CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
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ZENA are trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
Microchip received ISO/TS-16949:2009 certification for its worldwide the U.S.A.
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are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping GestIC is a registered trademark of Microchip Technology
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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CERTIFIED BY DNV © 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2389-8
== ISO/TS 16949 ==
2017 Microchip Technology Inc. DS20005529B-page 23
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Fax: 949-462-9608
Tel: 951-273-7800 Spain - Madrid
Tel: 34-91-708-08-90
Raleigh, NC Fax: 34-91-708-08-91
Tel: 919-844-7510 Sweden - Gothenberg
New York, NY Tel: 46-31-704-60-40
Tel: 631-435-6000
San Jose, CA Sweden - Stockholm
Tel: 408-735-9110 Tel: 46-8-5090-4654
Tel: 408-436-4270 UK - Wokingham
Canada - Toronto Tel: 44-118-921-5800
Tel: 905-695-1980 Fax: 44-118-921-5820
Fax: 905-695-2078
DS20005529B-page 24 2017 Microchip Technology Inc.
10/25/17
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Microchip:
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