256LBGA资料PDF,256LBGA功能介绍,Datasheet由SMSC公司出品

免费NewsLetter申请

设为首页

EEWorld独家

博客

论坛热点

3,000,000器件资料库等你来搜

元器件厂商按字母排序

256LBGA
EEWorld咨询电话：82357002，82350740－8068 邮件咨询：datasheet@eeworld.com.cn 器件描述：256 LBGA/LBGN PACKAGE OUTLINE 器件厂商：SMSC [SMSC Corporation] 厂商主页：http://www.smsc.com/ 文件大小：84.43KB 文件页数：1 PDF阅读：256LBGA.pdf (点击阅读器件资料) 摘要： 256 LBGA/LBGN PACKAGE OUTLINE SINGLE (LID) MOLDED MATRIX MOLDED & SAWED Min Nominal Max Remark A 1.10 - 1.50 Overall Package Height A1 0.25 - 0.50 Standoff A2 0.49 - 0.75 Mold Thickness D 16.80 17.00 17.20 X Board Length D1 - 15.00 - X Distance Between End Ball Centers D2 14.80 15.00 15.20 X Lid Length (see Note 4) E 16.80 17.00 17.20 Y Board Length E1 - 15.00 - Y Distance Between End Ball Centers E2 14.80 15.00 15.20 Y Lid Length (see Note 4) b 0.40 0.50 0.70 Ball Diameter e 1.00 Basic Pitch ccc - - 0.20 Coplanarity Notes: 1. Controlling Unit: millimeter. 2. Maximum radial true position tolerance of each ball is 0.125 mm at maximum material condition. Dimension "b (max)" is 0.70mm for all devices, which start production after 2004, and is 0.60mm for all devices, which started production prior to 2005, until the end of their product life. 3. Details of ball A1 identifier are optional but must be located within the zone indicated. 4. Single molded (Lid) version of the package is optional - see dashed line. 5. Provided for reference only - contact your SMSC Regional Sales Office for latest information. Rev. 8/23/05 80 Arkay Drive Hauppauge, NY 11788 (631) 435-6000 FAX (631) 273-3123 相关器件：

256LBGA

EEWorld咨询电话：82357002，82350740－8068 邮件咨询：datasheet@eeworld.com.cn

器件描述：256 LBGA/LBGN PACKAGE OUTLINE
器件厂商：SMSC [SMSC Corporation]
厂商主页：http://www.smsc.com/
文件大小：84.43KB
文件页数：1
PDF阅读：256LBGA.pdf (点击阅读器件资料)

摘要：
256 LBGA/LBGN PACKAGE OUTLINE
SINGLE (LID) MOLDED
MATRIX MOLDED & SAWED
Min Nominal Max Remark
A 1.10 - 1.50 Overall Package Height
A1 0.25 - 0.50 Standoff
A2 0.49 - 0.75 Mold Thickness
D 16.80 17.00 17.20 X Board Length
D1 - 15.00 - X Distance Between End Ball Centers
D2 14.80 15.00 15.20 X Lid Length (see Note 4)
E 16.80 17.00 17.20 Y Board Length
E1 - 15.00 - Y Distance Between End Ball Centers
E2 14.80 15.00 15.20 Y Lid Length (see Note 4)
b 0.40 0.50 0.70 Ball Diameter
e 1.00 Basic Pitch
ccc - - 0.20 Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Maximum radial true position tolerance of each ball is 0.125 mm at maximum material condition. Dimension
"b (max)" is 0.70mm for all devices, which start production after 2004, and is 0.60mm for all devices, which
started production prior to 2005, until the end of their product life.
3. Details of ball A1 identifier are optional but must be located within the zone indicated.
4. Single molded (Lid) version of the package is optional - see dashed line.
5. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
Rev. 8/23/05
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123

相关器件：

元器件厂商按字母排序

热点新闻: Freescale亏损33.7亿美元即将裁员10%; AMD向博通贱卖数字电视芯片剥离非核心业务; 分析称第四季苹果或削减iPhone产量达40%; Gartner:明年芯片业营收或跌10% 后年将复苏; 我国有线电视数字转换用户首次突破4000万; ST与Arkados合作研制HomePlug AV soc; 中国汽车电子排名第十航盛电子掘金混合动力; Morpho加入Tensilica为汽车GPS提供技术; 化合物半导体全球单体最大芯片厂在深投产; 2008中国RFID发展年会暨年度评选活动正式启动

应用设计: 基于ARM和蓝牙的无线信号采集系统的设计与实现; 基于单片机和GPRS的矿区铁路道口监测系统; 基于MSP430单片机的开关稳压电源设计; 基于嵌入式系统的虚拟仪器设计; 基于80C51微处理器的OLED模块设计; 嵌入式阵列处理器的发展现状及前景; 广泛应用于未来一代汽车的高亮LED照明方案; 利用微控制器进行网络通信的网卡配置; 基于MCU的家庭防盗报警系统的设计与应用; 基于FPGA的UART接口开发

电子电路: [集成稳压电源]LM317集成稳压电路; [电脑主板]电脑主板电路图 830_58; [有线通信]实用门铃电路; [充电电路]简单充电器电路; [电子镇流器]电子式节能灯的装配; [线性稳压电源]电容降压稳压电源电路图; [充电电路]锂电池充电器电路; [电话机原理图]电话机原理图02; [充电电路]劲牛充电器电路; [供电电路]可控硅交流调压器电路

关于我们 - 广告合作 - 联系方式 - 给我们建议 - 器件索引

北京市海淀区知春路23号集成电路设计园量子银座506　电话:(010)82350740