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器件描述：SMART 3 ADVANCED BOOT BLOCK WORD-WIDE
器件厂商：INTEL [Intel Corporation]
厂商主页：http://www.intel.com/
文件大小：427.94KB
文件页数：49
PDF阅读：28F400B3.pdf (点击阅读器件资料)
摘要：
E
PRELIMINARY
May 1997 Order Number: 290580-002
c110 Flexible SmartVoltage Technology
? 2.7V–3.6V Program/Erase
? 2.7V–3.6V Read Operation
? 12V V
PP
Fast Production
Programming
c110 2.7V or 1.8V I/O Option
? Reduces Overall System Power
c110 Optimized Block Sizes
? Eight 4-KW Blocks for Data,
Top or Bottom Locations
? Up to Thirty-One 32-KW Blocks for
Code
c110 High Performance
? 2.7V–3.6V: 120 ns Max Access Time
c110 Block Locking
? V
CC
-Level Control through WP#
c110 Low Power Consumption
? 20 mA Maximum Read Current
c110 Absolute Hardware-Protection
? V
PP
= GND Option
? V
CC
Lockout Voltage
c110 Extended Temperature Operation
? –40°C to +85°C
c110 Supports Code Plus Data Storage
? Optimized for FDI, Flash Data
Integrator Software
? Fast Program Suspend Capability
? Fast Erase Suspend Capability
c110 Extended Cycling Capability
? 10,000 Block Erase Cycles
c110 Automated Word Program and Block
Erase
? Command User Interface
? Status Registers
c110 SRAM-Compatible Write Interface
c110 Automatic Power Savings Feature
c110 Reset/Deep Power-Down
? 1 ?A I
CC
Typical
? Spurious Write Lockout
c110 Standard Surface Mount Packaging
? 48-Ball ?BGA* Package
? 48-Lead TSOP Package
c110 Footprint Upgradeable
? Upgradeable from 2-, 4- and 8-Mbit
Boot Block
c110 ETOX? V (0.4 ?) Flash Technology
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4? technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide
products will be available in 48-lead TSOP and 48-ball ?BGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp.
SMART 3 ADVANCED BOOT BLOCK
WORD-WIDE
4-MBIT (256K X 16), 8-MBIT (512K X 16),
16-MBIT (1024K X 16)
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3
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