27C010T
1 Megabit (128K x 8-Bit) -
OTP EPROM
VPP 1 32 VCC A5
A9
A16 PGM X-Decoder 1024 x 1024
A12 Memory Matrix
A16
A15 NC I/O0
I/O7
A12 A14
A7 A13 Input Y-Gating
Data Y-Decoder
A6 A8 Control
A5 A9
A4 27C010T A11
A3 OE
A2 A10
A1 CE
CE
A0 I/O7
OE
I/O0 I/O6 A0-A4 A10-A11
PGM
I/O1 I/O5 VCC
VPP H : High Threshold Inverter
I/O2 I/O4 H Memory
VSS
VSS 16 17 I/O3 Logic Diagram
FEATURES: DESCRIPTION:
128k x 8 Bit OTP EPROM organization Maxwell Technologies' 27C010T high density 1 Megabit
RAD-PAK radiation-hardened against natural space radia-
One-time Programmable Electrically Programmable Read
tion Only Memory microcircuit features a greater than 100 krad (Si)
Total dose hardness: total dose tolerance, depending upon space mission. The
27C010T features fast address times and low power dissipa-
- >100 krad (Si), depending upon space mission tion. The 27C010T offers high speed programming using page
Excellent Single Event Effects: programming mode. The 27C010T is offered in JEDEC-Stan-
dard Byte-Wide EPROM pinouts, which allows socket replace-
- SELTH LET: > 80 MeV/mg/cm2 ment with Flash Memory and Mask ROMs.
- SEUTH LET (read mode): >80 Mev/mg/cm2
Package: Maxwell Technologies' patented RAD-PAK packaging technol-
- 32 pin RAD-PAK flat pack ogy incorporates radiation shielding in the microcircuit pack-
- Weight - 6.0 grams age. It eliminates the need for box shielding while providing
Fast access time: the required radiation shielding for a lifetime in orbit or space
- 120, 150, 200 ns (max) times available mission. In a GEO orbit, RAD-PAK provides greater than 100
Low power consumption: krad (Si) radiation dose tolerance. This product is available
- Active mode: 50 mW/MHz (typ) with screening up to Class S.
- Standby mode: 5W (typ)
High speed page and word programming:
- Page programming time: 14 sec (typ)
Programming power supply:
- VPP = 12.5 V 0.3 V
One-time Programmable
Pin Arrangement
- JEDEC standard byte-wide EPROM
- Flash memory and mask ROM compatible
12.12.01 Rev 2 All data sheets are subject to change without notice 1
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com 2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
TABLE 1. 27C010T PINOUT DESCRIPTION
PIN SYMBOL DESCRIPTION
12-5, 27, 26, 23, 25, A0 - A16 Address
4, 28, 29, 3 ,2
I/O0 - I/O7 Input/Output
22 CE Chip Enable
24 OE Output Enable
32 VCC Power Supply
1 VPP Programming Supply
16 VSS Ground
31 PGM Programming Enable
30 NC No Connection
TABLE 2. 27C010T ABSOLUTE MAXIMUM RATINGS Memory
PARAMETER SYMBOL MIN MAX UNIT
Supply Voltage 1 VCC -0.6 7.0 V
Programming Voltage 1
All Input and Output Voltage 1,2 VPP -0.6 13.5 V
A9 Voltage 2
Operating Temperature Range VIN, VOUT -0.6 7.0 V
Storage Temperature Range
VID -0.6 13.0 V
TA -55 +125 C
TS -65 +150 C
1. Relative to VSS.
2. VIN, VOUT, and VID min = -1.0V for pulse width < 20 ns.
TABLE 3. DELTA LIMITS
PARAMETER VARIATION
10% of value specified on Table 6
ICC1 10% of value specified on Table 6
ICC2 10% of value specified on Table 6
ICC3 10% of value specified on Table 6
ISB
12.12.01 Rev 2 All data sheets are subject to change without notice 2
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
TABLE 4. 27C010T RECOMMENDED OPERATING CONDITIONS
PARAMETER SYMBOL MIN MAX UNITS
V
Supply Voltage VCC 4.5 5.5 V
Input Voltage
VIL -0.31 0.8 C/W
Thermal Impedance C
Operating Temperature Range VIH 2.2 VCC +12
JC -- 1.27
TA -55 +125
1. VIL min = -1.0V for pulse width < 50 ns.
2. VIH max = VCC + 1.5V for pulse width < 20 ns.
TABLE 5. 27C010T CAPACITANCE 1
PARAMETER SYMBOL MIN MAX UNIT
Input Capacitance CIN -- 10 pF Memory
Output Capacitance
COUT -- 15 pF
1. Guaranteed by design.
TABLE 6. 27C010T DC ELECTRICAL CHARACTERISTICS FOR READ OPERATION
(VCC = 5V 10%, VPP = VSS, TA = -55 TO +125 C, UNLESS OTHERWISE SPECIFIED)
PARAMETER SYMBOL TEST CONDITION SUB MIN TYP MIN UNIT
GROUPS
Input Leakage Current ILI VIN = 5.5V 1, 2, 3 -- -- 2 A
Output Leakage Current
Standby VCC Current ILO VOUT = 5.5V/0.45V 1, 2, 3 -- -- 2 A
Operating VCC Current
ISB CE = VIH 1, 2, 3 -- -- 1 mA
VPP Current
Input Voltage ICC1 IOUT = 0 mA, CE = VIL 1, 2, 3 -- -- 30 mA
Output Voltage ICC2 IOUT = 0 mA, f = 5 MHz 1, 2, 3 -- -- 30
ICC3 IOUT = 0 mA, f = 10 MHz 1, 2, 3 -- -- 50
IPP1 VPP = 5.5V 1, 2, 3 -- 1 20 A
VIH 1, 2, 3 2.2 -- -- V
VIL 1, 2, 3 -- -- 0.8
VOH IOH = -400 A 1, 2, 3 2.4 -- -- V
VOL IOL = 2.1 mA 1, 2, 3 -- -- 0.45
12.12.01 Rev 2 All data sheets are subject to change without notice 3
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
TABLE 7. 27C010T AC ELECTRICAL CHARACTERISTICS FOR READ OPERATION 1
(VCC = 5V 10%, VPP = VSS, TA = -55 TO +125 C, UNLESS OTHERWISE SPECIFIED)
PARAMETER TEST CONDITION SYMBOL SUB GROUPS MIN MAX UNIT
Address Access Time CE = OE = VIL tACC 9, 10, 11 ns
- 120 120
- 150 -- 150
- 200 200
--
--
Chip Enable Access Time OE = VIL tCE 9, 10, 11 ns
- 120 120
- 150 -- 150
- 200 200
--
--
Output Enable Access TIme CE = VIL tOE 9, 10, 11 ns
- 120 CE = VIL 60
- 150 CE = OE = VIL -- 70
- 200 70
--
Output Hold to Address Change ns
- 120 -- --
- 150 --
- 200 tOH 9, 10, 11 --
Output Disable to High-Z 2 0 ns Memory
- 120 50
- 150 0 50
- 200 50
0
tDF 9, 10, 11
0
0
0
1. Test conditions:
- Input pulse levels 0.45V/2.4V
- Input rise and fall times < 10 ns
- Output load 1 TTL gate + 100 pF (including scope and jig)
- Referenced levels for measuring timing 0.8V/2.0V
2. tDF is defined as the time at which the output becomes an open circuit and data is no longer driven.
12.12.01 Rev 2 All data sheets are subject to change without notice 4
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
TABLE 8. 27C010T DC ELECTRICAL CHARACTERISTICS FOR PROGRAMMING OPERATIONS 1,2,3,4
(VCC = 6.25V + 0.25V, VPP = 12.5V + 0.3V, TA = 25C)
PARAMETER SYMBOL TEST CONDITION SUB GROUPS MIN MAX UNIT
Input Leakage Current ILI VIN = 0V to VCC 1, 2, 3 -- 2 A
Operating VCC Current 1, 2, 3
Operating VPP Current ICC 1, 2, 3 -- 30 mA
Input Voltage 5 1, 2, 3
IPP CE = PGM = VIL 1, 2, 3 -- 40 mA
Output Voltage 1, 2, 3
VIH 1, 2, 3 2.2 VCC +5 6 V
VIL -0.1 7 0.8
VOH IOH = -400 A 2.4 -- V
VOL IOH = 2.1 mA -- 0.45
1. VCC must be applied before VPP and removed after VPP. Memory
2. VPP must not exceed 13V, inlcuding overshoot.
3. Do not change VPP from VIL to 12.5V or 12.5V to VIL when CE =LOW.
4. DC electrical paramters for programming operations are not tested. These parameters are guaranteed by design.
5. Device reliability may be adversely affected if the device is installed or removed while VPP = 12.5V.
6. If VIH is over the specified maximum value, programming operation can not be guaranteed.
7. VIL min = -0.6V for pulse width < 20 ns.
TABLE 9. 27C010T AC ELECTRICAL CHARACTERISTICS FOR PROGRAMMING OPERATIONS 1,2
(VCC = 6.25V + 0.25V, VPP = 12.5V 0.3V, TA = 25C)
PARAMETER SYMBOL SUB GROUPS MIN TYP MAX UNIT
Address Setup Time tAS 9, 10, 11 2 -- -- s
Address Hold Time
Data Setup Time tAH 9, 10, 11 0 -- -- s
Data Hold Time
Chip Enable Setup TIme tDS 9, 10, 11 2 -- -- s
VPP Setup Time
VCC Setup Time tDH 9, 10, 11 2 -- -- s
Output Enable Setup Time
Output Disable Time tCES 9, 10, 11 2 -- -- s
PGM Initial Programming Pulse Width
PGM Overprogramming Pulse Width tVPS 9, 10, 11 2 -- -- s
Data Valid from Output Enable Time
Output Enable Pulse During Data Latch tVCS 9, 10, 11 2 -- -- s
Output Enable Hold Time
Chip Enable Hold Time tOES 9, 10, 11 2 -- -- s
tDF 9, 10, 11 0 -- 130 ns
tPW 9, 10, 11 0.19 0.20 0.21 ms
tOPW 9, 10, 11 0.19 -- 5.25 ms
tOE 9, 10, 11 0 -- 150 ns
tLW 9, 10, 11 1 -- -- s
tOEH 9, 10, 11 2 -- -- s
tCEH 9, 10, 11 2 -- -- s
12.12.01 Rev 2 All data sheets are subject to change without notice 5
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
TABLE 9. 27C010T AC ELECTRICAL CHARACTERISTICS FOR PROGRAMMING OPERATIONS 1,2
(VCC = 6.25V + 0.25V, VPP = 12.5V 0.3V, TA = 25C)
PARAMETER SYMBOL SUB GROUPS MIN TYP MAX UNIT
PGM Setup TIme tPGMS 9, 10, 11 2 -- -- s
1. Test conditions:
- Input pulse levels 0.45V / 2.4V
- Input rise and fall times < 20 ns
- Referenced levels for measuring timing 0.8V/2.0V
2. AC electrical parameters for programming operation are not tested. These are guaranteed by design.
TABLE 10. 27C010T MODE SELECTION 1,2
MODE VPP VCC CE OE PGM A0 I/O
READ
OUTPUT DISABLE VCC VCC VIL VIL VPP X DOUT
STANDBY
PROGRAM VCC VCC VIL VIH VIH X High-Z
PROGRAM VERIFY
PAGE DATA LATCH VCC VCC VIH X X X High-Z
PAGE PROGRAM
PROGRAM INHIBIT VPP VCC VIL VIN VIL X DIN Memory
IDENTIFIER VPP VSS VIL VIL VIH X DOUT
1. X = Don't care.
2. 11.5V < VH < 12.5V. VPP VCC VIH VIL VIH X DIN
VPP VCC VIH VIH VIL X High-Z
VCC VCC VIL VIL VIL X High-Z
VPP VCC VIL VIH VIH X High-Z
VPP VCC VIH VIL VIL X High-Z
VPP VCC VIH VIH VIH X High-Z
VCC VCC VIL VIL VIH VIH ID
12.12.01 Rev 2 All data sheets are subject to change without notice 6
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
FIGURE 1. READ TIMING WAVEFORM
FIGURE 1. Memory
12.12.01 Rev 2 All data sheets are subject to change without notice 7
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
FIGURE 2. BYTE PROGRAMMING FLOWCHART
Memory
12.12.01 Rev 2 All data sheets are subject to change without notice 8
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
FIGURE 3. BYTE PROGRAMMING TIMING WAVEFORM
Memory
12.12.01 Rev 2 All data sheets are subject to change without notice 9
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
FIGURE 4. PAGE PROGRAMMING FLOWCHART
Memory
12.12.01 Rev 2 All data sheets are subject to change without notice 10
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
FIGURE 5. PAGE PROGRAMMING TIMING WAVEFORM
Memory
12.12.01 Rev 2 All data sheets are subject to change without notice 11
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
32LDFP
Memory
32 PIN RAD-PAK FLAT PACKAGE
SYMBOL DIMENSION
A MIN NOM MAX
b 0.220
c 0.194 0.207 0.019
D 0.015 0.017 .002 0.007
E 0.004 0.828
E1 0.812 0.005 0.486
E2 0.474 0.820 0.498
E3 0.480 0.316
e --
L 0.304 -- --
Q 0.030 0.310
S1 0.085 0.390
N 0.370 0.050 BSC 0.073
0.067 0.380
0.005 0.070 --
0.027
32
F32-09
Note: All dimensions in inches
12.12.01 Rev 2 All data sheets are subject to change without notice 12
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
Important Notice:
These data sheets are created using the chip manufacturer's published specifications. Maxwell Technologies verifies
functionality by testing key parameters either by 100% testing, sample testing or characterization.
The specifications presented within these data sheets represent the latest and most accurate information available to
date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no
responsibility for the use of this information.
Maxwell Technologies' products are not authorized for use as critical components in life support devices or systems
without express written approval from Maxwell Technologies.
Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Tech-
nologies. Maxwell Technologies' liability shall be limited to replacement of defective parts.
Memory
12.12.01 Rev 2 All data sheets are subject to change without notice 13
2001 Maxwell Technologies
All rights reserved.
1 Megabit (128K x 8-Bit) - OTP EPROM 27C010T
Product Ordering Options Option Details
Model Number 12 = 120 ns
15 = 150 ns
27C010T XX F X -XX Feature 20 = 200 ns
Access Time
Monolithic
Screening Flow S = Maxwell Class S
B = Maxwell Class B
E = Engineering (testing @ +25C)
I = Industrial (testing @ -55C,
+25C, +125C)
Package F = Flat Pack Memory
Radiation Feature RP = RAD-PAK package
RT1 = Guaranteed to 10 krad at
Base Product die level
Nomenclature RT2 = Guaranteed to 25 krad at
die level
RT4 = Guaranteed to 40 krad at
die level
1 Megabit (128K x 8-Bit) - OTP
EPROM
12.12.01 Rev 2 All data sheets are subject to change without notice 14
2001 Maxwell Technologies
All rights reserved.
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采用双同步采样 ADC 的隔离式 16 通道交流模拟输入模块参考设计
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