SN74AUC2G241YZPR
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器件描述：DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
器件厂商：TI [
Texas Instruments]
厂商主页：http://www.ti.com/
文件大小：427.57KB
文件页数：14
PDF阅读：SN74AUC2G241YZPR.pdf (点击阅读器件资料)
摘要：
www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1 VCC81OE
2 71A 2OE
3 62Y 1Y
4 5GND 2A
3 6 1Y2Y
81 VCC1OE
5GND 4 2A
2 7 2OE1A
GND 54 2A
3 6 1Y2Y
2 7 2OE1A
8 VCC11OE
DESCRIPTION/ORDERING INFORMATION
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
? Available in the Texas Instruments ? Low Power Consumption, 10 ? A at 1.8 V
NanoFree ? Package ? ± 8-mA Output Drive at 1.8 V
? Optimized for 1.8-V Operation and Is 3.6-V I/O ? Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal JESD 78, Class II
Operation ? ESD Protection Exceeds JESD 22
? I off Supports Partial-Power-Down Mode – 2000-V Human-Body Model (A114-A)
Operation – 200-V Machine Model (A115-A)
? Sub-1-V Operable – 1000-V Charged-Device Model (C101)
? Max t pd of 1.9 ns at 1.8 V
This dual buffer/driver is operational at 0.8-V to 2.7-V V CC , but is designed specifically for 1.65-V to 1.95-V V CC
operation.
The SN74AUC2G241 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 1-bit line drivers with separate output-enable (1 OE , 2OE) inputs. When 1 OE is
low or 2OE is high, the device passes data from the A inputs to the Y outputs. When 1 OE is high or 2OE is low,
the outputs are in the high-impedance state.
NanoFree ? package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2)
NanoFree ? – WCSP (DSBGA) Reel of 3000 SN74AUC2G241YZPR _ _ _U2_
0.23-mm Large Bump – YZP (Pb-free)
– 40 ° C to 85 ° C SSOP – DCT Reel of 3000 SN74AUC2G241DCTR U41_ _ _
VSSOP – DCU Reel of 3000 SN74AUC2G241DCUR U2_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ? = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright ? 2003 – 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
