MLC
Capacitors
Introduction to Knowles Capacitors
At Knowles Capacitors we make Single Layer, Multilayer,
High Reliability and Precision Variable Capacitors; EMI Filters
and Thin Film Devices.
Our business was formed by combining Dielectric
Laboratories, Johanson Manufacturing, Novacap, Syfer
Technology and Voltronics into a single organization - each
well-established specialty capacitor makers with a combined
history of over 175 years.
Our expertise is the design and manufacture of components
important to engineers in applications where function and
reliability are key. The markets we serve include medical
implantable and medical equipment, military, aerospace/
avionics, EMI and connector filtering, oil exploration,
instrumentation, industrial electronics, optical networks,
telecom and automotive.
We aim to be a leader in every market we serve, to
the benefit of our customers and our mutual long-
term success. We achieve this by:
l Understanding our customers’ real needs and providing
products and services to meet and exceed them.
l Providing better products and services than competitors.
l Investing in product development, manufacturing
processes and people.
l Insisting on the highest ethical standards and a business
culture of trust, respect and open communication.
Products in this catalogue form the basis of our ranges for
‘new designs’. However, there are legacy products from
our five brands that will still be available – we ask that you
contact your local Sales Office for details and ordering.
Product Selector
Medical
RF
High Frequency
Snubber
Frequency Control/Tuning,
Impedance Matching
Capacitors Modem/Tip and Ring
and Decoupling/Smoothing
Filters AC Noise Removal
SM and High Voltage Circuitry
Leaded High Speed Decoupling
Feedthrough Filtering
Automotive
Harsh Environments
Mil/Aero
is particularly recommended
for these applications where
possible.
X7R, C0G/NP0, High Q & Ultra-low ESR
0402 to 4040 non-magnetic termination Pages 68-71
0.1pF to 6.8µF - 16V to 3kV
High Q, C0G/NP0 & Porcelain Range Pages 40-52
Ultra-low ESR
MRI/Non-Magnetic C0G/NP0 Range
0402 to 8060 Pages 30-33
0.47pF to 1µF - 10V to 12kV & 36-37
Class 1 Dielectrics
Low DF/ESR X7R Pages 24-25
1812/2220/2225 & 60-61
100nF to 1µF - 250Vdc
Class 1 Dielectrics X7R, C0G/NP0 Y2/X1, X2
Safety Certified Ranges UL/TÜV Pages 65-67
1808/1812/2211/2215/2220
High Capacitance
X7R/X5R Ranges Pages 24-25
0603 to 8060 & 60-61
100pF to 22µF - 16V to 12kV
Safety Certified
X7R, E03 X2Y IPCs Pages 92-95
0603 to 1812
150pF to 1.2µF - 16V to 1kV
High Capacitance
X7R, C0G/NP0, Y2/X1, X2 Pages 65-67
Safety Certified Ranges UL/TÜV
1808/1812/2211/2215/2220
Balanced Line Capacitors
X7R, C0G/NP0 Ranges Page 64
250Vac rated 50/60Hz AC
Safety Certified
StackiCap™ Page 62
250Vac Range
0505/1111/1825 Ranges Page 40
X7R, C0G/NP0, High Q
PCB Space Saving
X7R and C0G/NP0, E03 X2Y IPCs Pages 92-95
0603 to 2220
10pF to 1.2µF
Low Inductance Capacitors
E01/E07/SBSGC/SBSMC Pages 92-95
X7R, C0G/NP0
0805 to 2220 - 1A to 20A
Capacitive
SBSP/SBSG/SBSM Pages 92-95
X7R, C0G/NP0 1206 to 2220
22pF to 470nF - 1A to 10A
Capacitive/Inductive Pi
AEC-Q200 E03 X2Y IPCs Pages 92-95
X7R and C0G/NP0 AEC-Q200 E01/E07
Feedthrough Capacitors
Filtering
Open Mode and Tandem Page 56
FlexiCap™ Capacitors
with extra safe electrode design
MLCC
AEC-Q200 Ranges Pages 58-59
X7R, C0G/NP0
High Temperature
X8R Range Page 74
Dipped Radial Leaded Operational temperature up to 150°C
Capacitors
Class I & II High Temperature Page 75
High Reliability 160ºC and 200ºC
Capacitors and Filters
X7R, C0G/NP0 Pages 83-91
4.7pF to 22µF - 50V to 12kV
115Vac 400Hz range Pages 57, 72,
S02A/IECQ-CECC/MIL-PRF/Burn in 94 & 95
Hi Rel X2Y IPCs
Contents
General & Dielectric classifications and characteristics.............................................................................2-5
Technical Termination types including FlexiCap™....................................................................................6-7
Introduction Manufacturing processes..........................................................................................................8
Testing....................................................................................................................................9
IECQ-CECC and AEC-Q200 Periodic Tests.................................................................................10
High Reliability Testing............................................................................................................11
Regulations and Compliance...................................................................................................12
Explanation on Ageing of MLC.................................................................................................13
Handling, Storage, Soldering and Mechanical Precautions..................................................... 14-16
Chip Marking System..............................................................................................................17
Packaging Information - Ceramic chip capacitors................................................................. 18-19
Chip Dimensions....................................................................................................................20
MLCC Ordering Chip Ordering Information..................................................................DLI..............................21
Information Chip Ordering Information..................................................................Novacap......................22
Chip Ordering Information..................................................................Syfer............................23
MLC Quick Reference Guide.......................................................................Novacap-Syfer.......24-25
Capacitors Industry Standard - X7R.....................................................................Novacap-Syfer.......26-29
Industry Standard - C0G/NP0..............................................................Novacap-Syfer.......30-33
Other Popular Sizes - X7R...................................................................Novacap-Syfer.......34-35
Other Popular Sizes - C0G/NP0............................................................Novacap-Syfer.......36-37
Standard Chip - BX.............................................................................Novacap..................... 38
Improved ESR - BX & X7R...................................................................Novacap..................... 39
High Q - Q(MS) & U ranges.................................................................Syfer......................40-42
High Q - H range - High Temperature 150ºC - X8G...............................Syfer..................... 43-44
High Q - High Power RF - Surface Mount & Ribbon Leaded....................Syfer..................... 45-46
High Q Porcelain - CF Series - C0G/NP0...............................................DLI......................... 47-49
High Q Porcelain - AH Series - P90......................................................DLI.........................50-52
VC1 Residual - X7R.............................................................................Syfer.......................... 53
TCC/VCC range - (BX & BZ) X7R..........................................................Syfer......................54-55
Open Mode and Tandem - X7R............................................................Syfer.......................... 56
IECQ-CECC range - C0G/NP0 & X7R....................................................Syfer.......................... 57
Automotive Grade - AEC-Q200 range - MLC, EMI & X2Y........................Syfer......................58-59
High Capacitance - X7R & X5R............................................................Novacap.................60-61
StackiCap™ - X7R..............................................................................Syfer.......................... 62
NC range - X7R..................................................................................Syfer.......................... 63
250Vac rated 50/60Hz AC...................................................................Syfer.......................... 64
250Vac Safety Certified AC..................................................................Syfer......................65-67
Non-Magnetic - High Q, C0G/NP0 & X7R..............................................Syfer-Voltronics.....68-69
Non-Magnetic - High Power RF - High Q..............................................Syfer-Voltronics..... 68-69
Non-Magnetic - High Power RF - High Q - Porcelain P90 & C0G/NP0......Voltronics............... 70-71
115Vac 400Hz - C0G/NP0 & X7R.........................................................Syfer.......................... 72
DWV (High Dielectric Withstand Voltage) range - C0G/NP0 & X7R..........Syfer.......................... 73
High Temperature - X8R - 150ºC.........................................................Novacap-Syfer........... 74
High Temperature - C0G/NP0 & Class II - 160ºC & 200ºC.....................Novacap..................... 75
HiT range of 200ºC Caps - C0G/NP0 & X7R..........................................Novacap-Syfer........... 76
Capacitor Assemblies - ST & SM ranges - C0G/NP0 & X7R.....................Novacap.................77-81
Capacitor Assemblies - ‘Cap-Rack’ Arrays.............................................Novacap..................... 82
MLC Radial Radial Leaded - Ordering Information..................................................Novacap-Syfer........... 83
Leaded Standard Radial Leaded - C0G/NP0, X7R & X8R....................................Novacap.................84-85
Capacitors Standard Radial Leaded - C0G/NP0, X7R..............................................Syfer......................86-89
High Temperature Radial Leaded - Epoxy Coated.................................Novacap..................... 90
High Temperature Radial Leaded - Encapsulated..................................Novacap..................... 91
SM EMI Filters Feedthrough Filters - E01 & E07..........................................................Syfer......................92-93
X2Y Integrated Passive Components - E03...........................................Syfer......................94-95
Dielectric characteristics
Class I Dielectrics
Multilayer Ceramic Capacitors are generally divided into classes dielectric characteristics with negligible dependence of capacitance
which are defined by the capacitance temperature characteristics and dissipation factor with time, voltage and frequency. They
over specified temperature ranges. These are designated by alpha exhibit the following characteristics:-
numeric codes. Code definitions are summarised below and are also a) Time does not significantly affect capacitance and dissipation
available in the relevant national and international specifications. factor (Tan δ) – no ageing.
Capacitors within this class have a dielectric constant range from b) Capacitance and dissipation factor are not affected by voltage.
10 to 100. They are used in applications which require ultra stable c) Linear temperature coefficient.
Class I Dielectrics
C0G/NP0 P90 C0G/NP0 X8G Class I
(Porcelain) (Porcelain) High Temperature
Ultra stable Ultra stable Ultra stable Ultra stable Ultra stable
Dielectric IECQ-CECC - - 1B/CG - - -
classifications EIA C0G/NP0 P90 C0G/NP0 X8G - -
MIL - - CG (BP) - - -
DLI CF AH - - - - -
Ordering code Novacap - - - N, RN - F D, RD
Syfer - - Q, U C H - G
Voltronics F H Q - - - -
Rated -55ºC to -55ºC to -55ºC to -55ºC to -55ºC to -55ºC to
temperature +125ºC +125ºC +125ºC -55ºC to +125ºC +150ºC +160ºC +200ºC
range
Maximum No DC voltage 0 ±15 ppm/ºC 0 ±20 ppm/ºC 0 ±30 ppm/ºC 0 ±30 ppm/ºC 0 ±30 ppm/ºC 0 ±30 ppm/ºC 0 ±30 ppm/ºC
capacitance applied
change over
temperature Rated DC -
range voltage applied
>50pF <0.0015
Tangent of loss ≤0.0005 @1MHz ≤0.0005 <50pF ≤0.0005 ≤0.001
angle (tan δ) @1MHz 0.0015 (15 + 0.7) @1MHz
Cr
@25ºC = 100GΩ or 1000ΩF
Insulation Time constant @25ºC = 106 MΩ min 100GΩ or 1000s @160ºC & 200ºC = 1GΩ or
resistance (Ri) (Ri x Cr) @125ºC = 105 MΩ min (whichever is the least) 10ΩF
(whichever is the least)
Cr <4.7pF ±0.05pF, ±0.10pF, ±0.25pF, ±0.5pF
Capacitance Cr >4.7 to ±0.10pF, ±0.25pF, ±0.5pF
Tolerance <10pF
Cr >10pF ±1%, ±2%, ±5%, ±10%
Dielectric <200V 2.5 times
strength >200V to 2.5 times Rated voltage +250V
Voltage applied <500V
for 5 seconds. 500V to <1kV 2.5 times 1.5 times
Charging
current limited >1kV to 1.25 times
to 50mA <1.2kV N/A
maximum. >1.2kV 1.2 times
Chip - - 55/125/56 - -
Climatic Dipped - - - 55/125/21 - -
category (IEC)
Discoidal - - - 55/125/56 - -
Ageing
characteristic Zero
(Typical)
Approvals Syfer Chip - - - QC-32100 - -
2 www.knowlescapacitors.com
Dielectric characteristics
Class II Dielectrics
Capacitors of this type have a dielectric constant range of 1000- Capacitance and dissipation factor are affected by:-
4000 and also have a non-linear temperature characteristic which a) Time (Ageing)
exhibits a dielectric constant variation of less than ±15% (2R1) b) Voltage (AC or DC)
from its room temperature value, over the specified temperature c) Frequency
range. Generally used for by-passing (decoupling), coupling,
filtering, frequency discrimination, DC blocking and voltage transient
suppression with greater volumetric efficiency than Class I units,
whilst maintaining stability within defined limits.
Class II Dielectrics
X5R X7R X8R Class II
High Temperature
Stable Stable Stable Stable
- 2C1 2R1 2X1 - - - IECQ-CECC Dielectric
X5R - X7R - X8R - - EIA classifications
- BZ - BX - - - MIL
- - - - - - - DLI
BW - B, RB X S G E, RE Novacap Ordering code
P R X B N - X Syfer
- - X - - - - Voltronics
-55ºC to -55ºC to -55ºC to -55ºC to -55ºC to Rated
+85ºC +125ºC +150ºC +160ºC +200ºC temperature
range
±15% ±15% ±15% ±15% ±15% +15 -40% +15 -65% No DC voltage Maximum
applied capacitance
change over
- +15 -45% - +15 -25% - - - Rated DC temperature
voltage applied range
≤ 0.025 >25V <0.025 <0.025 <0.025 Tangent of loss
Typical* <25V <0.035 angle (tan δ)
100GΩ or 1000s Time constant Insulation
(whichever is the least) (Ri x Cr) resistance (Ri)
±5%, ±10%, ±20% Capacitance
Tolerance
2.5 times <200V Dielectric
>200V to strength
Rated voltage +250V <500V Voltage applied
for 5 seconds.
1.5 times 500V to <1kV Charging
current limited
to 50mA
1.2 times >1kV maximum.
55/85/56 55/125/56 55/150/56 - Chip
- 55/125/21 - - Dipped Climatic
category (IEC)
- 55/125/56 - - Discoidal
5% Ageing
Typical <2% per time decade characteristic
(Typical)
- QC-32100 - - - QC-32100 - Syfer Chip Approvals
* Refer to page 61 for details of Dissipation Factor.
www.knowlescapacitors.com 3
Dielectric characteristics
Typical dielectric temperature characteristics Impedance vs Frequency
Porcelain C0G/NP0 & P90 Ultra Stable C0G/NP0 dielUelcttraricStable C0G/NP0 dielectric
1.25 100000000
Impedance (Ohms) 10000000 10pF 100pF
1 C0G/NP0 Porcelain 1000000
1nF 10nF
Capacitance Change % 0.75 P90 Porcelain 100000
10000
0.5 1000
100
0.25 10
0 1
0.1
-0.25 0.01
0.001 0.01 0.1 1 10 100 1000 10000
-0.5 Frequency (MHz)
-0.75 Stable X7R dielectric Stable X7R dielectric
-1 1000000
-55 -40 -20 0 20 40 60 80 100 125
Temperature (ºC) Impedance (Ohms) 100000 1nF 10nF
C0G/NP0 10000 100nF 1µF
1000
50 100
UPPER LIMIT 10
1
25 TYPICAL LIMIT 0.1
∆C ppm/°C 0.01
0.001 0.01 0.1 1 10 100 1000 10000
0 Frequency (MHz)
Stable X7R dielectric - 10nFStable X7R dielectric 10nF
-25 100000
LOWER LIMIT IImmppeeddaannccee ((OOhhmmss)) 10000 1808 0805
1000 1206 1210
-50
-55 -25 0 25 50 75 100 125 100
Temperature (ºC) 10
X7R 1
20 0.1
15 0.01
Typical capacitance change curves 0.001 0.01 0.1 1 10 100 1000 10000
Capacitance Change % 10 will lie within the shown limits FFrreeqquueennccyy ((MMHHzz))
5 ESR vs Frequency - chips
0 Ultra Stable C0G/NP0 dieUleltcrtariSctable C0G/NP0 dielectric
-5 1000
-10 100 100pF
ESR (Ohms) 1nF
-15 10 10nF
-20 1
-55 -35 -15 5 25 45 65 85 105 125
Temperature (ºC) 0.1
0.01
0.001
0.001 0.01 0.1 1 10 100 1000 10000
Frequency (MHz)
Stable X7R dielectric Stable X7R dielectric
10000
1000 1nF
10nF
ESR (Ohms) 100 100nF
10 1µF
1
0.1
0.01
0.001
0.0001
0.001 0.01 0.1 1 10 100 1000 10000
Frequency (MHz)
4 www.knowlescapacitors.com
Dielectric characteristics - Porcelain C0G/NP0 & P90
Typical ESR and Series Resonance characteristics
CF Porcelain (C0G/NP0) and AH Porcelain (P90)
Dielectric DLI Cap Typical ESR Series Resonance
Series (pF) 150 MHz 500 MHz 1 GHz (MHz)
1 0.182 0.276 0.428 10300
C06CF 10 0.095 0.159 0.243 3200
0603
47 0.081 0.127 0.173 1400
1 0.073 0.089 0.146 9900
C11CF 10 0.049 0.075 0.107 3100
0505
100 0.040 0.073 0.111 970
1 0.073 0.082 0.124 9060
C17CF 10 0.065 0.098 0.136 3100
CF 1111 100 0.041 0.070 0.102 1300
TCC (ppm/°C) 1000 0.034 0.073 – 400
(-55° to +125°C) 1 0.068 0.086 0.158 9060
Porcelain C18CF 10 0.058 0.087 0.118 3100
(C0G/NP0) 1111
1000 0.041 0.068 – 1000
0 ±15 10 0.072 0.113 0.164 2480
C22CF 100 0.047 0.079 0.119 1000
2225 1000 0.036 0.067 – 320
2700 0.035 – – 214
10MHz 30MHz 100MHz
10 0.121 0.054 0.037 2100
C40CF 100 0.044 0.038 0.045 680
3838 1000 0.032 0.036 0.038 210
5100 0.011 0.016 0.040 95
Dielectric DLI Cap Typical ESR Series Resonance
Series (pF) 150 MHz 500 MHz 1 GHz (MHz)
1 0.067 0.08 0.136 9200
C11AH 10 0.044 0.071 0.104 3000
0505
100 0.032 0.055 0.086 1000
1 0.059 0.063 0.114 9064
C17AH 10 0.039 0.06 0.085 3100
1111
1000 0.024 0.05 0.074 1290
AH 10 0.059 0.094 0.138 3100
C18AH 100 0.028 0.069 0.109 1290
TCC (ppm/°C) 1111
(-55° to +125°C) 1000 0.023 0.063 – 400
Porcelain 10 0.074 0.207 0.249 2480
(P90) C22AH 100 0.048 0.116 0.19 1000
+90 ±20 2225 1000 0.028 0.14 – 320
2700 0.027 – – 214
10MHz 30MHz 100MHz
15 0.066 0.033 0.027 2100
C40AH 100 0.018 0.026 0.052 680
3838 1000 0.009 0.017 0.033 210
5100 0.008 0.016 0.033 95
www.knowlescapacitors.com 5
Dielectric termination combinations
Palladium Silver Palladium Silver Nickel Barrier (100% matte tin plating). Lead free Nickel Barrier 90/10% tin/lead Nickel Barrier Gold flash FlexiCap™ with Nickel Barrier 100% tin FlexiCap™ with Nickel Barrier 90/10% tin/lead FlexiCap™ with Copper Barrier 100% tin FlexiCap™ Ag Layer, 400-u-in Cu barrier 200-u-in Sn Plate FlexiCap™ with Copper Barrier 90/10% tin/lead Copper Barrier 100% tin Ag Layer, 400-500u-in Cu barrier, 200-u-in 90/10 Sn Plate Copper Barrier 90/10% tin/lead Solderable Silver Solderable Palladium Silver Ag termination, Ni Barrier, Heavy SnPb Plated Solder Ag termination, Enhanced Ni Barrier, Sn Plated Solder Ag termination, Enhanced Cu Barrier, Sn Plated Solder Ag Termination, Cu Barrier Layer, Heavy SnPb Plated Solder
RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS
Recommended for Solder • • • • • • • • • • • • • • • •
Attachment
Recommended for Conductive • • •
Epoxy Attachment
DLI - P Z U S Q Y M - - W - V - - T E H R
Termination Novacap P PR N Y NG C D - - - B - E S K - - - -
ordering code: Syfer - F J A - Y H 3 - 5 2 - 4 - - - - - -
Voltronics - S - - - - - 3 M - 2 W - - - - - - -
Dielectric Code
NP0 Porcelain - Hi Q DLI - CF • • • • • • • • • • • •
P90 Porcelain - Hi Q DLI - AH • • • • • • • • • • • • •
C0G - Hi Q/Low ESR Syfer - Q, U • •
C0G - Hi Q/Low ESR BME Syfer - H •
Novacap - N/RN • • • • • • • • •
C0G/NP0 Syfer - A • • • •
Syfer - C, F • • • • •
C0G/NP0 - BME Syfer - G, K • • • •
Novacap - M • • • • •
C0G/NP0 - Syfer - C, Q • • • •
Non-Mag
Voltronics - Q • • • •
X5R Syfer - P • • • • •
Novacap - BW • • •
Novacap - B/RB • • • • • • • • •
X7R Syfer - E • •
Syfer - X, D • • • • •
Novacap - BB • • •
X7R - BME Syfer - J • • •
Syfer - S • •
BX Novacap - X • • • • • • • • •
Syfer - B • • • • •
BZ Syfer - R • • • • •
Novacap - C • • • • •
X7R - Syfer - X • •
Non-Mag
Voltronics - X • • • •
Novacap - S • • • • • • • •
X8R Syfer - N • • • • •
Syfer - T • •
C0G/NP0 (160ºC) Novacap - F • • • • • • • •
C0G/NP0 (200ºC) Novacap - D • •
C0G/NP0 (200ºC) Novacap - RD •
Syfer - G •
Class II (160ºC) Novacap - G • • • • • • • •
Novacap - E • •
Class II (200ºC) Novacap - RE •
Syfer - X •
Dielectric codes in Red - AEC-Q200 qualified. Dielectric codes in Green - IECQ-CECC.
6 www.knowlescapacitors.com
FlexiCap™ overview
FlexiCap™ termination working in partnership with customers world wide, to eliminate
MLCCs are widely used in electronic circuit design for a multitude of mechanical cracking.
applications. Their small package size, technical performance and An additional benefit of FlexiCap™ is that MLCCs can withstand
suitability for automated assembly makes them the component of temperature cycling -55ºC to 125ºC in excess of 1,000 times
choice for the specifier. without cracking.
However, despite the technical benefits, ceramic components are FlexiCap™ termination has no adverse effect on any electrical
brittle and need careful handling on the production floor. In some parameters, nor affects the operation of the MLCC in any way.
circumstances they may be prone to mechanical stress damage if
not used in an appropriate manner. Board flexing, depanelisation, ● Picture taken at 1,000x
mounting through hole components, poor storage and automatic magnification using a SEM
testing may all result in cracking. to demonstrate the fibrous
nature of the FlexiCapTM
Careful process control is important at all stages of circuit board termination that absorbs
assembly and transportation - from component placement to increased levels of
test and packaging. Any significant board flexing may result in mechanical stress.
stress fractures in ceramic devices that may not always be evident
during the board assembly process. Sometimes it may be the end
customer who finds out - when equipment fails!
Knowles has the solution - FlexiCap™
FlexiCap™ has been developed as a result of listening to customers’ Available on the following ranges:
experiences of stress damage to MLCCs from many manufacturers,
often caused by variations in production processes. ● All High Reliability ranges
Our answer is a proprietary flexible epoxy polymer termination ● Standard and High Voltage Capacitors
material, that is applied to the device under the usual nickel barrier ● Open Mode and Tandem Capacitors
finish. FlexiCap™ will accommodate a greater degree of board ● Safety Certified Capacitors
bending than conventional capacitors. ● Non-magnetic Capacitors
Knowles FlexiCap™ termination ● 3 terminal EMI chips
Ranges are available with FlexiCap™ termination material offering ● X2Y Integrated Passive Components
increased reliability and superior mechanical performance (board ● X8R High Temperature capacitors
flex and temperature cycling) when compared with standard Summary of PCB bend test results
termination materials. Refer to Knowles application note reference The bend tests conducted on X7R have proven that the FlexiCap™
AN0001. FlexiCap™ capacitors enable the board to be bent termination withstands a greater level of mechanical stress before
almost twice as much before mechanical cracking occurs. Refer to mechanical cracking occurs.
application note AN0002. The AEC-Q200 test for X7R requires a bend level of 2mm minimum
FlexiCap™ is also suitable for Space applications having passed and a cap change of less than 10%.
thermal vacuum outgassing tests. Refer to Syfer application note
reference AN0026.
Fired ceramic Product Typical bend performance under
dielectric X7R AEC-Q200 test conditions
Standard termination 2mm to 3mm
FlexiCap™ Typically 8mm to 10mm
Metal Application notes
electrodes FlexiCap™ may be handled, stored and transported in the same
Tin outer manner as standard terminated capacitors. The requirements for
layer Intermediate nickel termination mounting and soldering FlexiCap™ are the same as for standard
or copper layer base SMD capacitors.
FlexiCap™ MLCC cross section For customers currently using standard terminated capacitors there
should be no requirement to change the assembly process when
FlexiCap™ benefits converting to FlexiCap™.
With traditional termination materials and assembly, the chain Based upon board bend tests in accordance with IEC 60384-1
of materials from bare PCB to soldered termination, provides no the amount of board bending required to mechanically crack a
flexibility. In circumstances where excessive stress is applied - the FlexiCap™ terminated capacitor is significantly increased compared
weakest link fails. This means the ceramic itself, which may fail with standard terminated capacitors.
short circuit. It must be stressed however, that capacitor users must not
The benefit to the user is to facilitate a wider process window - assume that the use of FlexiCap™ terminated capacitors will totally
giving a greater safety margin and substantially reducing the typical eliminate mechanical cracking. Good process controls are still
root causes of mechanical stress cracking. required for this objective to be achieved.
FlexiCap™ may be soldered using your traditional wave or reflow
solder techniques including lead free and needs no adjustment to
equipment or current processes.
Knowles has delivered millions of FlexiCap™ components and
during that time has collected substantial test and reliability data,
www.knowlescapacitors.com 7
Manufacturing processes
Production process flowchart Knowles reliability grades
Ceramic powder Electrode ink High reliability
preparation material (space quality)
Space
Grade
ESCC 3009(1)
MIL Grade
Multilayer build
IECQ-CECC(2)
AEC-Q200(3)
Fire Standard components Standard
reliability
Rumble Notes:
1) Space grade tested in accordance with ESCC3009 (refer to Knowles
Spec S02A 0100) or MIL Grade (in accordance with MIL-PRF-123, MIL-
DPA inspection PRF-55681).
2) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality
Assessment System for Electronic Components. This is an internationally
Termination recognised product quality certification which provides customers with
assurance that the product supplied meets high quality standards.
View Knowles IECQ-CECC approvals at http://www.iecq.org or at
www.knowlescapacitors.com
3) AEC-Q200. Automotive Electronics Council Stress Test Qualification
Plating For Passive Components. Refer to Knowles application note reference
(if specified) AN0009.
Printing Knowles reliability surface mount product groups
(if specified)
High reliability
Electrical test Tandem
FlexiCapTM
capacitors(1)
Open Mode
Test verification FlexiCapTM capacitors(2)
Standard FlexiCapTM
capacitors(3)
Standard MLC capacitors(4) Standard
Additional sample reliability
Rel tests
(if specified)
Notes:
1) “Tandem” construction capacitors, ie internally having the equivalent
of 2 series capacitors. If one of these should fail short-circuit, there is still
QC inspection capacitance end to end and the chip will still function as a capacitor,
although capacitance maybe affected. Refer to application note AN0021.
Also available qualified to AEC-Q200.
2) “Open Mode” capacitors with FlexiCapTM termination also reduce the
possibility of a short circuit by utilising inset electrode margins. Refer to
Additional Hi Rel application note AN0022. Also available qualified to AEC-Q200.
activities 3) Multilayer capacitors with Knowles FlexiCapTM termination. By using
(S02A 100% burn-in, QC insp) FlexiCapTM termination, there is a reduced possibility of the mechanical
cracking occurring.
4) “Standard” capacitors includes MLCCs with tin finish over nickel but no
FlexiCapTM.
Packaging
Finished goods store
8 www.knowlescapacitors.com
Testing
Tests conducted during batch manufacture Knowles reliability SM product group
S (Space grade)
Standard SM IECQ-CECC / AEC-Q200 High Rel S02A
capacitors MIL grade ESCC 3009
MIL-PRF-123
Solderability l l l l
Resistance to soldering heat l l l l
Plating thickness verification (if plated) l l l l
DPA (Destructive Physical Analysis) l l l l
Voltage proof test (DWV / Flash) l l l l
Insulation resistance l l l l
Capacitance test l l l l
Dissipation factor test l l l l
100% visual inspection m m l l
100% burn-in. (2xRV @125ºC for 168 hours) m m m l
Load sample test @ 125ºC m m l LAT1 & LAT2
(1000 hours)
Humidity sample test. 85ºC/85%RH m m l 240 hours
Hot IR sample test m m m m
Axial pull sample test (MIL-STD-123) m m m m
Breakdown voltage sample test m m m m
Deflection (bend) sample test m m m m
SAM (Scanning Acoustic Microscopy) m m m m
LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and LAT3) - - - m
LAT2 (20 x 1000 hour life test + LAT3) - - - m
LAT3 (6 x TC and 4 x solderability) - - - m
l Test conducted as standard.
m Optional test. Please discuss with the Sales Office.
www.knowlescapacitors.com 9
IECQ-CECC and AEC-Q200 Periodic tests
Periodic tests conducted for IECQ-CECC and AEC-Q200
Test Sample
ref Test Termination type Additional requirements acceptance Reference
P N C
High
P1 temperature All types Un-powered. 1,000 hours @ T=150ºC. 12 77 0 MIL-STD-202
exposure Measurement at 24 ± 2 hours after test conclusion Method 108
(storage)
P2 Temperature C0G/NP0: All types 1,000 cycles -55ºC to +125ºC 12 77 0 JESD22
cycling X7R: Y and H only Measurement at 24 ± 2 hours after test conclusion Method JA-104
Moisture T = 24 hours/cycle. Note: Steps 7a and 7b not required. Un- MIL-STD-202
P3 resistance All types powered. 12 77 0 Method 106
Measurement at 24 ± 2 hours after test conclusion
Biased 1,000 hours 85ºC/85%RH. Rated voltage or 50V MIL-STD-202
P4 humidity All types whichever is the least and 1.5V. 12 77 0 Method 103
Measurement at 24 ± 2 hours after test conclusion
P5 Operational All types Condition D steady state TA=125ºC at full rated. 12 77 0 MIL-STD-202
life Measurement at 24 ± 2 hours after test conclusion Method 108
P6 Resistance All types Note: Add aqueous wash chemical. 12 5 0 MIL-STD-202
to solvents Do not use banned solvents Method 215
P7 Mechanical C0G/NP0: All types Figure 1 of Method 213. Condition F 12 30 0 MIL-STD-202
shock X7R: Y and H only Method 213
5g’s for 20 minutes, 12 cycles each of 3 orientations.
C0G/NP0: All types Note: Use 8” x 5” PCB 0.031” thick 7 secure points on one long MIL-STD-202
P8 Vibration X7R: Y and H only side and 2 secure points at corners of opposite sides. Parts 12 30 0 Method 204
mounted within 2” from any secure point.
Test from 10-2,000Hz
P9 Resistance to All types Condition B, no pre-heat of samples: 3 12 0 MIL-STD-202
soldering heat Single wave solder - Procedure 2 Method 210
C0G/NP0: All types -55ºC/+125ºC. Number of cycles 300. MIL-STD-202
P10 Thermal shock X7R: Y and H only Maximum transfer time - 20 seconds, 12 30 0 Method 107
dwell time - 15 minutes. Air-Air
Adhesion,
rapid temp X7R: A, F and 5N force applied for 10s, -55ºC/ +125ºC for 5 cycles, BS EN132100
P11 change and J only damp heat cycles 12 27 0 Clause 4.8, 4.12
climatic and 4.13
sequence
P12 Board flex C0G/NP0: All types 3mm deflection Class I 12 30 0 AEC-Q200-005
X7R: Y and H only 2mm deflection Class II
P13 Board flex X7R: A, F and 1mm deflection. 12 12 0 BS EN132100
J only Clause 4.9
P14 Terminal All types Force of 1.8kg for 60 seconds 12 30 0 AEC-Q200-006
strength
P15 Beam load All types - 12 30 0 AEC-Q200-003
test
P16 Damp heat All types 56 days, 40ºC / 93% RH 15x no volts, 15x 5Vdc, 12 45 0 BS EN132100
steady state 15x rated voltage or 50V whichever is the least. Clause 4.14
Test results are available on request.
P = Period in months.
N = Sample size.
C = Acceptance criteria.
10 www.knowlescapacitors.com
High Reliability Testing
Our High Rel products are designed for optimum Military Performance Specifications
reliability and are burned in at elevated voltage
and temperature levels. They are 100% MIL-PRF-55681 (GROUP A) MIL-PRF-123 (GROUP A)
electrically inspected to ascertain conformance to General purpose military high reliability The specification affords an increased
a strict performance criteria. specification for surface mount sizes 0805 reliability level over MIL-PRF-55681 for
Applications for High Reliability products include through 2225 in 50V and 100V. space, missile and other high reliability
medical implanted devices, aerospace, airborne, • VOLTAGE CONDITIONING applications such as medical implantable or
various military applications, and consumer uses • 100 HRS, 2X VDCW, 125°C life support equipment. The specification
requiring safety margins not attainable with covers surface mount sizes 0805 through
conventional product. • DWV, IR, 125°C IR, CAP, DF TEST 2225 in 50V rating and various radial / axial
• VISUAL & MECH. INSPECTION leaded products in 50V, 100V and 200V
We have the ability to test surface mount and (AQL SAMPLE PLAN) ratings.
leaded capacitors to High Reliability standards as • SOLDERABILITY, SAMPLE 13(0) • THERMAL SHOCK, 20 CYCLES
detailed below, or to customer SCD. • 8% PDA MAXIMUM • VOLTAGE CONDITIONING 168/264 HRS,
Military performance specifications are designed 2X VDCW, 125°C
and written for the voltage/capacitance ratings of • DWV, IR, 125°C IR, CAP, DF TEST
the individual product slash numbers associated • VISUAL & MECH. INSPECTION SAMPLE
with the specification. 20(0)
Some of the requirements of the military • DPA(1)
document may not apply to the High Reliability • PDA, 3% (0.1%), 5% (0.2%) MAX(2)
product. The following details the intent of the MIL-PRF-39014 (GROUP A) MIL-PRF-49467 (GROUP A)
individual military specifications available for test
and the deviations that may apply. The specification covers general military General purpose military high reliability
Product voltage ratings outside of the intended purpose radial / axial leaded and encapsulated specification for radial leaded epoxy coated.
military specification will follow the voltage test product in 50V, 100V, and 200V ratings. The specification covers sizes 1515 through
potential outlined. • THERMAL SHOCK, 5 CYCLES 13060 with 600V, 1kV, 2kV, 3kV, 4kV and 5kV
• VOLTAGE CONDITIONING 96 HRS, ratings.
Contact the Sales Office with any requirements or 2X VDCW, 125°C • THERMAL SHOCK, 5 CYCLES
deviations that are not covered here. • DWV, IR, 125°C IR, CAP, DF TEST • VOLTAGE CONDITIONING 96 HRS,
• VISUAL & MECH. INSPECTION RATED VDCW, 125°C
Environmental Testing (AQL SAMPLE PLAN) • PARTIAL DISCHARGE (OPTION) (3)
• SOLDERABILITY, SAMPLE 13(0) • DWV, IR, 125°C IR, CAP, DF TEST
We also have the capability to perform all • 8% PDA MAXIMUM • VISUAL & MECH. INSPECTION SAMPLE
the Environmental Group B, Group C and 13(0)
Qualification testing to the referenced • SOLDERABILITY, SAMPLE 5(0)
military specifications. • 10% PDA MAXIMUM
Testing abilities include the following: MIL-PRF-49470 (DSCC 87106) MIL-PRF-38534
• Nondestructive internal examination (GROUP A) Specification for Hybrid Microcircuits with a
General purpose military high reliability section for Element Evaluation on passive
• Destructive physical analysis specification for stacked and leaded capacitors components.
• Radiographic inspection for switch mode power supplies. The There are two classification levels of
• Terminal strength specification covers sizes 2225 through 120200 reliability. Class H is for a standard
in 50V, 100V, 200V and 500V ratings. military quality level. Class K is for the
• Resistance to soldering heat • THERMAL SHOCK, 5 CYCLES highest reliability level intended for space
• Voltage-temperature limits • VOLTAGE CONDITIONING 96 HRS, application.
• Temperature coefficient 2X VDCW(4), 125°C Knowles will perform a 100-hour burn-in
• DWV, IR, 125°C IR, CAP, DF TEST on all Class K products and assumes Class
• Moisture resistance • VISUAL & MECH. INSPECTION SAMPLE 13(0) K Subgroup 3 samples will be unmounted
• Humidity, steady state, low voltage and Subgroup 4 (wirebond) shall not apply
• SOLDERABILITY, SAMPLE 5(0) unless otherwise stated.
• Vibration • 10% PDA MAXIMUM
• Resistance to solvents
• Life TEST VOLTAGE (VDC) WVDC DWV V/C*
• Thermal shock and immersion This test potential shall be used on all High <200 2.5X Rated 2.0X Rated
• Low temperature storage Reliability Testing unless otherwise specified. 250 500V 400V
• Barometric pressure 300 500V 400V
• Shock, specified pulse 400 600V 500V
• Mechanical shock 500 750V 600V
• Constant acceleration 600 750V 600V
*V/C Is Voltage Conditioning. >700 1.2X Rated 1.0X Rated
• Wire bond evaluation
• Partial discharge (corona) Notes:
• 200°C Voltage Conditioning 1. MIL-PRF-123 DPA shall be per TABLE XIV AQL requirements unless otherwise specified.
2. MIL-PRF-123 allowable PDA shall be 3% overall and 0.1% in the last 48 hours for capacitance/voltage
values listed in MIL-PRF-123, and be 5% overall and 0.2% in the last 48 hours for capacitance/voltage
values beyond MIL-PRF-123.
3. MIL-PRF-49467 standard Group A is without Partial Discharge. Partial Discharge test is optional and must
be specified.
4. MIL-PRF-49470 (DSCC 87106) 500V rated product has Voltage Conditioning at 1.2X VDCW.
www.knowlescapacitors.com 11
Regulations and Compliance
Release documentation Knowles reliability SM product group
Standard SM IECQ-CECC AEC-Q200 S (Space grade)
capacitors MIL grade High Rel S02A
Certificate of conformance l - l l
IECQ-CECC Release certificate of conformity - l - -
Batch electrical test report m m m Included in
data pack
S (space grade) data documentation package - - - l
l Release documentation supplied as standard.
m Original documentation.
Periodic tests conducted and reliability data availability
Standard Surface Mount capacitors Example of FIT (Failure In Time) data available:
Components are randomly selected on a sample basis and the 10000
following routine tests are conducted:
Load Test. 1,000 hours @125ºC (150ºC for X8R). Applied RV 50% of RV
l 25% of RV 10% of RV
voltage depends on components tested. 10
l Humidity Test. 168 hours @ 85ºC/85%RH.
l Board Deflection (bend test). FIT
Test results are available on request. 0.01
Conversion factors
From To Operation 0.00001
25ºC 50ºC 75ºC 100ºC 125ºC
FITS MTBF (hours) 109 ÷ FITS
FITS MTBF (years) 109 ÷ (FITS x 8760) Component type: 0805 (C0G/NP0 and X7R).
FITS = Failures in 109 hours. Testing location: Knowles reliability test department.
MTBF = Mean time between failures. Results based on: 16,622,000 component test hours.
REACH (Registration, Evaluation, Authorisation and for special exceptions) and those with plated terminations are
restriction of Chemicals) statement suitable for soldering using common lead free solder alloys (refer
The main purpose of REACH is to improve the protection of human to ‘Soldering Information’ for more details on soldering limitations).
health and the environment from the risks arising from the use of Compliance with the EU RoHS directive automatically signifies
chemicals. compliance with some other legislation (e.g. China and Korea
Knowles maintains both ISO14001, Environmental Management RoHS). Please refer to the Knowles Capacitors Sales Office for
System and OHSAS 18001 Health and Safety Management System details of compliance with other materials legislation.
approvals that require and ensure compliance with corresponding Breakdown of material content, SGS analysis reports and tin
legislation such as REACH. whisker test results are available on request.
For further information, please contact the Knowles Capacitors Most Knowles MLCC components are available with non RoHS
Sales Office at www.knowlescapacitors.com compliant tin lead (SnPb) solderable termination finish for exempt
applications and where pure tin is not acceptable. Other tin free
RoHS compliance termination finishes may also be available – please refer to the
Knowles Capacitors Sales Office for further details.
Knowles routinely monitors world wide material restrictions (e.g. Radial components have tin plated leads as standard but tin/lead is
EU/China and Korea RoHS mandates) and is actively involved in available as a special option. Please refer to the radial section of the
shaping future legislation. catalogue for further details.
All standard C0G/NP0, X7R, X5R and High Q Knowles MLCC X8R ranges <250Vdc are not RoHS 2011/65/EU compliant. Check
products are compliant with the EU RoHS directive (see below the website, www.knowlescapacitors.com for latest RoHS update.
Export controls and dual-use regulations
Certain Knowles catalogue components are defined as ‘dual-use’ and a capacitance value of >250nF when measured at 750Vdc
items under international export controls - those that can be used and a series inductance <10nH. Components defined as dual-use
for civil or military purposes which meet certain specified technical under the above criteria may require a licence for export across
standards. international borders. Please contact the Sales Office for further
The defining criteria for a dual use component with respect to information on specific part numbers.
Knowles Capacitor products is one with a voltage rating of >750Vdc
12 www.knowlescapacitors.com
Explanation of Ageing of MLC
Ageing Capacitance measurements
Capacitor ageing is a term used to describe the negative, Because of ageing it is necessary to specify an age for reference
logarithmic capacitance change which takes place in ceramic measurements at which the capacitance shall be within the
capacitors with time. The crystalline structure for barium titanate prescribed tolerance. This is fixed at 1000 hours, since for practical
based ceramics changes on passing through its Curie temperature purposes there is not much further loss of capacitance after this
(known as the Curie Point) at about 125°C. This domain structure time.
relaxes with time and in doing so, the dielectric constant reduces All capacitors shipped are within their specified tolerance at the
logarithmically; this is known as the ageing mechanism of the standard reference age of 1000 hours after having cooled through
dielectric constant. The more stable dielectrics have the lowest their Curie temperature.
ageing rates. The ageing curve for any ceramic dielectric is a straight line when
The ageing process is reversible and repeatable. Whenever the plotted on semi-log paper.
capacitor is heated to a temperature above the Curie Point the
ageing process starts again from zero. Capacitance vs time
The ageing constant, or ageing rate, is defined as the percentage (Ageing X7R @ <2% per decade)
loss of capacitance due to the ageing process of the dielectric
which occurs during a decade of time (a tenfold increase in age)
and is expressed as percent per logarithmic decade of hours. As
the law of decrease of capacitance is logarithmic, this means that
in a capacitor with an ageing rate of 1% per decade of time, the
capacitance will decrease at a rate of:
a) 1% between 1 and 10 hours
b) An additional 1% between the following 10 and 100 hours ∆c %
c) An additional 1% between the following 100 and 1000 hours
d) An additional 1% between the following 1000 and 10000 C0G/NP0
hours etc
e) The ageing rate continues in this manner throughout the
capacitor’s life.
Typical values of the ageing constant for our Multilayer Ceramic 1 10 100 1000 10000
Capacitors are: Age (Hours)
Dielectric class Typical values Tight tolerance
Ultra Stable C0G/NP0 Negligible capacitance loss One of the advantages of Knowles’ unique ‘wet process’ of
through ageing manufacture is the ability to offer capacitors with exceptionally tight
capacitance tolerances.
Stable X7R <2% per decade of time The accuracy of the printing screens used in the fully automated,
computer controlled manufacturing process allows for tolerance as
close as +/-1% on C0G/NP0 parts greater than or equal to 10pF.
For capacitance values below <4.7pF, tolerances can be as tight as
+/-0.05pF.
www.knowlescapacitors.com 13
Mounting, Soldering, Storage & Mechanical Precautions
Detailed application notes intended to guide and assist our less than the chip width. In addition, the position of the chip on the
customers in using multilayer ceramic capacitors in surface board should also be considered.
mount technology are available on the Knowles website www. 3-Terminal components are not specifically covered by IPC-7351,
knowlescapacitors.com but recommended pad dimensions are included in the Knowles
The information concentrates on the handling, mounting, catalogue / website for these components.
connection, cleaning, test and re-work requirements particular to Alternative Printed Wire Board Land Patterns
MLC’s for SMD technology, to ensure a suitable match between
component capability and user expectation. Some extracts are Printed Wire Board land pattern design for chip components is
given below. critical to ensure a reliable solder fillet, and to reduce nuisance
Mechanical considerations for mounted ceramic chip type manufacturing problems such as component swimming and
capacitors tombstoning. The land pattern suggested can be used for reflow
and wave solder operations as noted. Land patterns constructed
Due to their brittle nature, ceramic chip capacitors are more prone with these dimensions will yield optimized solder fillet formation and
to excesses of mechanical stress than other components used in thus reduce the possibility of early failure.1
surface mounting. A = (Max Length) + 0.030” (.762mm)*
One of the most common causes of failure is directly attributable B = (Max Width) + 0.010” (.254mm)**
to bending the printed circuit board after solder attachment. C = (Min Length) – 2 (Nominal Band)***
The excessive or sudden movement of the flexible circuit board
stresses the inflexible ceramic block causing a crack to appear at
the weakest point, usually the ceramic/termination interface. The
crack may initially be quite small and not penetrate into the inner
electrodes; however, subsequent handling and rapid changes in
temperature may cause the crack to enlarge.
This mode of failure is often invisible to normal inspection * Add 0.030” for Wave Solder operations.
techniques as the resultant cracks usually lie under the capacitor ** Replace “Max Width” with “Max Thickness” for vertical mounting.
terminations but if left, can lead to catastrophic failure. More *** ”C” to be no less than 0.02”, change “A” to (Max Length) + 0.020”.
importantly, mechanical cracks, unless they are severe may not be For C04 ”C” to be no less than 0.01”.
detected by normal electrical testing of the completed circuit, failure
only occurring at some later stage after moisture ingression. 1. Frances Classon, James Root, Martin Marietta Orlando
The degree of mechanical stress generated on the printed circuit Aerospace, “Electronics Packaging and Interconnection Handbook”.
board is dependent upon several factors including the board MLC Orientation - Horizontal and Vertical Mounting
material and thickness; the amount of solder and land pattern.
The amount of solder applied is important, as an excessive amount The orientation of the MLC relative to the ground plane affects the
reduces the chip’s resistance to cracking. devices’ impedance. When the internal electrodes are parallel to
It is Knowles’s experience that more than 90% are due to board the ground plane (Horizontal mounting) the impedance of the MLC
depanelisation, a process where two or more circuit boards are resembles a folded transmission line driven from one end.
separated after soldering is complete. Other manufacturing stages The graphs below show the modeled insertion loss and parallel
that should be reviewed include: resonances of Knowles product C17AH101K-7UN-X0T with
1) Attaching rigid components such as connectors, relays, display horizontal mounting (modeling can be done in CapCad). When the
panels, heat sinks etc. internal electrodes are perpendicular to the ground plane (Vertical
mounting, bottom graph) the MLC impedance resembles a folded
2) Fitting conventional leaded components. Special care must transmission line driven from the center reducing resonance effects.
be exercised when rigid terminals, as found on large can Horizontal Orientation
electrolytic capacitors, are inserted. C17AH101K-7UN-X0T 100.0pF Temp = 25°C
0
3) Storage of boards in such a manner which allows warping. -1
4) Automatic test equipment, particularly the type employing “bed S21 (dB) -2
of nails” and support pillars. -3
5) Positioning the circuit board in its enclosure especially where -4
this is a “snap-fit”. -5
Knowles were the first MLCC manufacturer to launch a flexible -6
0 1 2 3 4 5 6 7 8 9 10
termination to significantly reduce the instances of mechanical Frequency (GHz)
cracking. FlexiCap™ termination introduces a certain amount of give
into the termination layer absorbing damaging stress. Unlike similar Vertical Orientation
systems, FlexiCap™ does not tear under tension, but absorbs the C17AH101K-7UN-X0T 100.0pF Temp = 25°C
0
stress, so maintaining the characteristics of the MLCC. -1
SM Pad Design S21 (dB) -2
Knowles conventional 2-terminal chip capacitors can generally -3
be mounted using pad designs in accordance with IPC-7351, -4
Generic Requirements for Surface Mount Design and Land Pattern -5
Standards, but there are some other factors that have been shown -6
to reduce mechanical stress, such as reducing the pad width to 0 1 2 3 4 5 6 7 8 9 10
Frequency (GHz)
14 www.knowlescapacitors.com
Mounting, Soldering, Storage & Mechanical Precautions
Knowles MLCCs are compatible with all recognised soldering / Wave soldering Surface Mount Chip Capacitors
mounting methods for chip capacitors. Wave soldering is generally acceptable, but the thermal stresses
Specific application notes on mounting and soldering Knowles caused by the wave have been shown to lead to potential problems
components are included on the website for each brand. with larger or thicker chips. Particular care should be taken when
• For DLI brand components please see DLI application soldering SM chips larger than size 1210 and with a thickness
note “Recommended Solder Attachment Techniques for MLC greater than 1.0mm for this reason. 0402 size components are
Chip and Pre-Tinned Capacitors” located at: http://www. not suitable for wave soldering. 0402 size components can also
knowlescapacitors.com/dilabs/en/gn/resources/ be susceptible to termination leaching and reflow soldering is
application-notes recommended for this size MLCC.
• For Syfer brand components, please see Syfer application Wave soldering exposes the devices to a large solder volume, hence
note AN0028 “Soldering / Mounting Chip Capacitors, Radial the pad size area must be restricted to accept an amount of solder
Leaded Capacitors and EMI Filters” located at: http://www. which is not detrimental to the chip size utilized. Typically the pad
knowlescapacitors.com/syfer/en/gn/technical-info/ width is 66% of the component width, and the length is .030” (.760
application-notes mm) longer than the termination band on the chip. An 0805 chip
which is .050” wide and has a .020” termination band therefore
• For Novacap brand products please refer to the appropriate requires a pad .033” wide by .050” in length. Opposing pads should
application note located at: http://www.knowlescapacitors. be identical in size to preclude uneven solder fillets and mismatched
com/novacap/en/gn/technical-info/application-notes surface tension forces which can misalign the device. It is preferred
The volume of solder applied to the chip capacitor can influence that the pad layout results in alignment of the long axis of the chips
the reliability of the device. Excessive solder can create thermal at right angles to the solder wave, to promote even wetting of all
and tensile stresses on the component which can lead to fracturing terminals. Orientation of components in line with the board travel
of the chip or the solder joint itself. Insufficient or uneven solder direction may require dual waves with solder turbulence to preclude
application can result in weak bonds, rotation of the device off line cold solder joints on the trailing terminals of the devices, as these
or lifting of one terminal off the pad (tombstoning). The volume of are blocked from full exposure to the solder by the body of the
solder is process and board pad size dependent. capacitor.
Soldering methods commonly used in industry are Reflow Soldering, The pre-heat ramp should be such that the components see a
Wave Soldering and, to a lesser extent, Vapour Phase Soldering. temperature rise of 1.5ºC to 4ºC per second as for reflow soldering.
All these methods involve thermal cycling of the components and This is to maintain temperature uniformity through the MLCC and
therefore the rate of heating and cooling must be controlled to prevent the formation of thermal gradients within the ceramic. The
preclude thermal shocking of the devices. preheat temperature should be within 120ºC maximum (100ºC
preferred) of the maximum solder temperature to minimise thermal
Without mechanical restriction, thermally induced stresses are shock. Maximum permissible wave temperature is 270ºC for SM
released once the capacitor attains a steady state condition. chips. Total immersion exposure time for Sn/Ni terminations is 30s
Capacitors bonded to substrates, however, will retain some stress, at a wave temperature of 260ºC. Note that for multiple soldering
due primarily to the mismatch of expansion of the component to operations, including the rework, the soldering time is cumulative.
the substrate; the residual stress on the chip is also influenced by The total immersion time in the solder should be kept to a
the ductility and hence the ability of the bonding medium to relieve minimum. It is strongly recommended that plated terminations
the stress. Unfortunately, the thermal expansion of chip capacitors are specified for wave soldering applications. PdAg termination
differ significantly from those of most substrate materials. is particularly susceptible to leaching when subjected to lead
Large chips are more prone to thermal shock as their greater free wave soldering and is not generally recommended for this
bulk will result in sharper thermal gradients within the device application.
during thermal cycling. Large units experience excessive stress if Cooling to ambient temperature should be allowed to occur
processed through the fast cycles typical of solder wave or vapour naturally, particularly if larger chip sizes are being soldered. Natural
phase operations. cooling allows a gradual relaxation of thermal mismatch stresses
Reflow soldering Surface Mount Chip Capacitors in the solder joints. Forced cooling should be avoided as this can
Knowles recommend reflow soldering as the preferred method for induce thermal breakage.
mounting MLCCs. Knowles MLCCs can be reflow soldered using Vapour phase soldering Chip Capacitors
a reflow profile generally as defined in IPC / JEDEC J-STD-020. Vapour phase soldering can expose capacitors to similar thermal
Sn plated termination chip capacitors are compatible with both shock and stresses as wave soldering and the advice is generally
conventional and lead free soldering, with peak temperatures of the same. Particular care should be taken in soldering large
260ºC to 270ºC acceptable. capacitors to avoid thermal cracks being induced and natural
The heating ramp rate should be such that components see cooling should be use to allow a gradual relaxation of stresses.
a temperature rise of 1.5ºC to 4ºC per seconds to maintain Hand soldering and rework of Chip Capacitors
temperature uniformity through the MLCC. The time for which
the solder is molten should be maintained at a minimum, so as to Attachment using a soldering iron requires extra care and is
prevent solder leaching. Extended times above 230ºC can cause accepted to have a risk of cracking of the chip. Precautions include
problems with oxidation of Sn plating. Use of inert atmosphere preheating of the assembly to within 100°C of the solder flow
can help if this problem is encountered. PdAg terminations can temperature and the use of a fine tip iron which does not exceed 30
be particularly susceptible to leaching with lead free, tin rich watts. In no circumstances should the tip of the iron be allowed to
solders and trials are recommended for this combination. Cooling contact the chip directly.
to ambient temperature should be allowed to occur naturally, Knowles recommend hot air/gas as the preferred method for
particularly if larger chip sizes are being soldered. Natural cooling applying heat for rework. Apply even heat surrounding the
allows a gradual relaxation of thermal mismatch stresses in the component to minimise internal thermal gradients.
solder joints. Forced cooling should be avoided as this can induce Minimise the rework heat duration and allow components to cool
thermal breakage. naturally after soldering.
www.knowlescapacitors.com 15
Mounting, Soldering, Storage & Mechanical Precautions
Wave soldering Radial Leaded Chip Capacitors Transportation
Radial leaded capacitors are suitable for wave soldering when Where possible, any transportation should be carried out with the
mounted on the opposite side of the board to the wave. The body product in its unopened original packaging. If already opened,
of radial components should not be exposed directly to the wave. any environmental control agents supplied should be returned to
Maximum permissible wave temperature is 260ºC for Radial Leaded packaging and the packaging re-sealed.
capacitors. Avoid paper and card as a primary means of handling, packing,
Hand soldering Radial Leaded capacitors transportation and storage of loose components. Many grades
Radial capacitors can be hand soldered into boards using soldering have a sulphur content which will adversely affect termination
irons, provided care is taken not to touch the body of the capacitor solderability.
with the iron tip. Soldering should be carried out from the opposite Loose chips should always be packed with sulphur-free wadding to
side of the board to the radial to minimise the risk of damage to prevent impact or abrasion damage during transportation.
the capacitor body. Where possible, a heat sink should be used Storage
between the solder joint and the body, especially if longer dwell Incorrect storage of components can lead to problems for the
times are required. user. Rapid tarnishing of the terminations, with an associated
Solder leaching degradation of solderability, will occur if the product comes into
Leaching is the term for the dissolution of silver into the solder contact with industrial gases such as sulphur dioxide and chlorine.
causing a failure of the termination system which causes increased Storage in free air, particularly moist or polluted air, can result in
ESR, tan δ and open circuit faults, including ultimately the termination oxidation.
possibility of the chip becoming detached. Leaching occurs more Packaging should not be opened until the MLCs are required
readily with higher temperature solders and solders with a high for use. If opened, the pack should be re-sealed as soon as is
tin content. Pb free solders can be very prone to leaching certain practicable. Alternatively, the contents could be kept in a sealed
termination systems. To prevent leaching, exercise care when container with an environmental control agent.
choosing solder alloys and minimize both maximum temperature Long term storage conditions, ideally, should be temperature
and dwell time with the solder molten. controlled between -5 and +40°C and humidity controlled between
Plated terminations with nickel or copper anti leaching barrier layers 40 and 60% R.H.
are available in a range of top coat finishes to prevent leaching Taped product should be stored out of direct sunlight, which might
occurring. These finishes also include Syfer FlexiCap™ for improved promote deterioration in tape or adhesive performance.
stress resistance post soldering. Product, stored under the conditions recommended above, in its “as
Bonding received” packaging, has a minimum shelf life of 2 years.
Hybrid assembly using conductive epoxy or wire bonding requires
the use of silver palladium or gold terminations. Nickel barrier
termination is not practical in these applications, as intermetallics
will form between the dissimilar metals. The ESR will increase
over time and may eventually break contact when exposed to
temperature cycling.
Cleaning
Chip capacitors can withstand common agents such as water,
alcohol and degreaser solvents used for cleaning boards. Ascertain
that no flux residues are left on the chip surfaces as these diminish
electrical performance.
Handling
Ceramics are dense, hard, brittle and abrasive materials. They are
liable to suffer mechanical damage, in the form of chips or cracks, if
improperly handled.
Terminations may be abraded onto chip surfaces if loose chips are
tumbled in bulk. Metallic tracks may be left on the chip surfaces
which might pose a reliability hazard.
Components should never be handled with fingers; perspiration and
skin oils can inhibit solderability and will aggravate cleaning.
Chip capacitors should never be handled with metallic instruments.
Metal tweezers should never be used as these can chip the product
and may leave abraded metal tracks on the product surface.
Plastic or plastic coated metal types are readily available and
recommended - these should be used with an absolute minimum of
applied pressure.
Counting or visual inspection of chip capacitors is best performed
on a clean glass or hard plastic surface.
If chips are dropped or subjected to rough handling, they should
be visually inspected before use. Electrical inspection may also
reveal gross damage via a change in capacitance, an increase in
dissipation factor or a decrease either in insulation resistance or
electrical strength.
16 www.knowlescapacitors.com
Chip Marking System
If required, we can mark capacitors with the EIA 198 two digit code to
show the capacitance value of the part. On chips larger than 3333, or A5 NA5
for leaded encapsulated devices, ink marking is available. However, for
chip sizes 0805 through to 3333 identification marking is accomplished
by using either laser or ink jet printer. This system does not degrade
the ceramic surface, or induce microcracks in the part.
Marking for other sizes may be available upon special request to
determine if applicable; please contact the sales office. Two position alpha numeric marking Three position alpha numeric
Marking is an option on Novacap and Syfer branded products and is available on chip sizes 0805 marking is available on chip sizes
needs to be specified when ordering. through 3333. 1206 and larger.
The marking denotes retma value The making denotes Novacap as
and significant figures of capacitance vendor (N), followed by the standard
(see table) eg: A5 = 100,000pF. two digit alpha numeric identification.
Marking Code - value in picofarads for alpha-numeric code
Number 0 1 2 3 4 5 6 7 9
A 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 0.1
B 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 0.11
C 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 0.12
D 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 0.13
E 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 0.15
F 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 0.16
G 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 0.18
H 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 0.2
J 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 0.22
K 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 0.24
L 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 0.27
M 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 0.3
N 3.3 33 330 3,300 33,000 330,000 3,000,000 33,000,000 0.33
P 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 0.36
Q 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 0.39
Letter R 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 0.43
S 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 0.47
T 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 0.51
U 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 0.56
V 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 0.62
W 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 0.68
X 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 0.75
Y 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 0.82
Z 9.1 91 910 9,100 91,000 920,000 9,200,000 92,000,000 0.91
a 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 0.25
b 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 0.35
d 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 0.4
e 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 0.45
f 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 0.5
m 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 0.6
n 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 0.7
t 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 0.8
y 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 0.9
www.knowlescapacitors.com 17
Ceramic Chip Capacitors - Packaging information
Tape and reel packing of surface mounting chip capacitors for automatic placement are in accordance with IEC60286-3.
Dimensions 1.5(.06) min 20.2(0.795) min
Product identifying label mm (inches) T
Plastic carrier tape 13(0.512) ± 0.5(0.02)
A 60(2.36) min
Top tape G
Embossment 8 or 12mm 178mm (7”) or Symbol Description 178mm reel 330mm reel
nominal 330mm (13”) dia. reel
A Diameter 178 (7) 330 (13)
Peel force G Inside width 8.4 (0.33) 12.4 (0.49)
The peel force of the top sealing tape is between 0.2 and 1.0 T Outside width 14.4 (0.56) max 18.4 (0.72) max
Newton at 180°. The breaking force of the carrier and sealing tape
in the direction of unreeling is greater than 10 Newtons.
Identification Leader and Trailer
Each reel is labelled with the following information: manufacturer, END START
chip size, capacitance, tolerance, rated voltage, dielectric type,
batch number, date code and quantity of components.
Missing components
Maximum number of missing components shall be 1 per reel
or 0.025% whichever is greater. There shall not be consecutive 40 empty sealed length is 20 sealed
components missing from any reel for any reason. embossments minimum quantity dependent embossments minimum
Tape dimensions TRAILER COMPONENTS LEADER 400mm min.
Feed direction
T D0 P0
Sealing tape P2
E
F W
K0 B0
t1 D1 P1 A0
Embossment Cavity centre lines
Dimensions mm (inches)
Symbol Description 8mm tape 12mm tape
A0 Width of cavity
B0 Length of cavity Dependent on chip size to minimize rotation
K0 Depth of cavity
W Width of tape 8.0 (0.315) 12.0 (0.472)
F Distance between drive hole centres and cavity centres 3.5 (0.138) 5.5 (0.213)
E Distance between drive hole centres and tape edge 1.75 (0.069)
P1 Distance between cavity centres 4.0 (0.156) 8.0 (0.315)
P2 Axial distance between drive hole centres and cavity centres 2.0 (0.079)
P0 Axial distance between drive hole centres 4.0 (0.156)
D0 Drive hole diameter 1.5 (0.059)
D1 Diameter of cavity piercing 1.0 (0.039) 1.5 (0.059)
T Carrier tape thickness 0.3 (0.012) ±0.1 (0.004) 0.4 (0.016) ±0.1 (0.004)
t1 Top tape thickness 0.1 (0.004) max
18 www.knowlescapacitors.com
Ceramic Chip Capacitors - Packaging information
Component orientation Outer Packaging
Tape and reeling is in accordance with IEC 60286 part 3, which Outer carton dimensions mm (inches) max.
defines the packaging specifications of lead less components on
continuous tapes. Reel Size No. of reels L W T
Notes: 1) IEC60286-3 states Ao < Bo 178 (7.0) 1 185 (7.28) 185 (7.28) 25 (0.98)
(see tape dimensions on page 18).
2) Regarding the orientation of 1825 and 2225 178 (7.0) 4 190 (7.48) 195 (7.76) 75 (2.95)
components, the termination bands are right to left, 330 (13.0) 1 335 (13.19) 335 (13.19) 25 (0.98)
NOT front to back. Please see diagram.
T
Product identifying label
W
Orientation of 1825 & 2225 components
Note: Labelling of box and L
reel with bar codes (Code 39)
available by arrangement.
Reel quantities - Novacap, Syfer and Voltronics products
Chip 0402 0505 0603 0805 1111 1206 1210 1410 1515 1808 1812 1825 2211 2215 2220 2221 2225 2520 3333 3530 3640 4540 5550 6560 7565
size
Max. chip thickness
mm 0.61 1.3 0.89 1.37 1.8 1.63 2.0 2.0 3.3 2.0 3.2 4.2 2.5 2.5 4.2 2.0 4.2 4.57 6.35 6.35 4.2 7.62 7.62 7.62 7.62
inches 0.02” 0.05” 0.03” 0.05” 0.07” 0.06” 0.08” 0.08” 0.13” 0.08” 0.13” 0.165” 0.1” 0.1” 0.165” 0.08” 0.165” 0.18” 0.25” 0.25” 0.165” 0.3” 0.3” 0.3” 0.3”
Reel quantities
178mm 10k 2500 4000 3000 1000 2500 2000 2000 500 1500 500 500 750 500 500 1000 500 1000 - - - - - -
(7”)
330mm 15k 10k 16k 12k 5000 10k 8000 8000 - 6000 2000 2000 4000 2000 2000 - 2000 1000 1000 500 500 500 500 500 200
(13”)
Packaging configurations - DLI products Bulk packaging, tubs
7" 13" Chips can be supplied in rigid re-sealable plastic tubs together with
Chip size 7" Reel, Reel, Reel, 2" x 2" impact cushioning wadding. Tubs are labelled with the details: chip
8mm Tape 16mm 16mm Waffle size, capacitance, tolerance, rated voltage, dielectric type, batch
Tape Tape Pack number, date code and quantity of components.
Style LxW Horizontal Vertical Horizontal
Orientation Orientation Orientation
C04 0.040" x 4000 - - - -
0.020" Product identifying label
C06 0.060" x 4000 - - - 108
0.030" Caution label
C07 0.110” x 2000 - - - - H
0.070”
C08 0.080" x 5000 3100 - - 108
0.050"
C11 0.055" x 3500 3100 - - 108
0.055"
C17 0.110" x 2350 750 - - 49 D Dimensions mm (inches)
0.110" H 60 (2.36)
C18 0.110" x 2350 750 - - 49 D 50 (1.97)
0.110"
C22 0.220" x 500 - - - -
0.245"
C40 0.380" x 250 - 250 1300 -
0.380"
www.knowlescapacitors.com 19
Chip dimensions L1
1. For FlexiCap™ terminations, length increase by maximum 0.004” (0.1mm). T
2. For special ranges, inc. High Q and Ultra-low ESR, dimensions may vary. See individual catalogue page.
3. High Q and Ultra-low ESR ranges dimensions may vary for optimum performance. W
4. Non-standard thicknesses are available – consult local Knowles Capacitors Sales Office. L2
Size Length (L1) Width (W) Max. Thickness (T) Termination Band (L2)
mm ~ inches mm ~ inches mm ~ inches min (mm ~ inches) max (mm ~ inches)
0402 1.0 ± 0.10 ~ 0.04 ± 0.004 0.50 ± 0.10 ~ 0.02 ± 0.004 0.60 ~ 0.024 0.10 ~ 0.004 0.40 ~ 0.016
C04 1.057 ± 0.188 ~ 0.042 ± 0.008 0.515 ± 0.153 ~ 0.02 ± 0.006 0.64 ~ 0.025 0.097 ~ 0.004 0.427 ~ 0.017
0504 1.27 ± 0.152 ~ 0.050 ± 0.006 1.02 ± 0.152 ~ 0.04 ± 0.006 1.12 ~ 0.044 0.20 ~ 0.008 0.50 ~ 0.02
0505 1.4 +0.35 -0.25 ~ 0.055 +0.014 -0.01 1.4 ± 0.25 ~ 0.055 ± 0.01 1.27 ~ 0.05 0.13 ~ 0.005 0.5 ~ 0.02
RF0505 1.4 ± 0.13 ~ 0.055 ± 0.005 1.4 ± 0.381 ~ 0.055 ± 0.015 1.45 ~ 0.057 0.20 ~ 0.008 0.50 ~ 0.02
C11 1.477 ± 0.391 ~ 0.059 ± 0.016 1.416 ± 0.451 ~ 0.056 ± 0.018 1.334 ~ 0.053 0.193 ~ 0.008 0.733 ~ 0.029
0603 1.6 ± 0.15 ~ 0.063 ± 0.006 0.8 ± 0.15 ~ 0.032 ± 0.006 0.90 ~ 0.036 0.20 ~ 0.004 0.40 ~ 0.016
C06 1.532 ± 0.229 ~ 0.06 ± 0.009 0.77 ± 0.191 ~ 0.031 ± 0.008 0.8 ~ 0.032 0.169 ~ 0.007 0.680 ~ 0.027
C07 1.797 ± 0.470 ~ 0.071 ± 0.019 2.813 ± 0.521 ~ 0.111 ± 0.021 2.667 ~ 0.105 0.193 ~ 0.008 1.20 ~ 0.047
0805 2.0 ± 0.20 ~ 0.079 ± 0.008 1.25 ± 0.20 ~ 0.049 ± 0.008 1.37 ~ 0.054 0.25 ~ 0.010 0.75 ~ 0.030
C08 2.048 ± 0.407 ~ 0.081 ± 0.016 1.28 ± 0.267 ~ 0.051 ± 0.011 1.360 ~ 0.054 0.362 ~ 0.014 1.04 ~ 0.041
0907 2.3 ± 0.30 ~ 0.090 ± 0.012 1.8 ± 0.30 ~ 0.070 ± 0.012 1.52 ~ 0.06 0.25 ~ 0.010 0.75 ~ 0.030
1005 2.54 ± 0.203 ~ 0.100 ± 0.008 1.27 ± 0.203 ~ 0.050 ± 0.008 1.37 ~ 0.054 0.25 ~ 0.010 0.75 ~ 0.030
1111 2.79 +0.51 -0.25 ~ 0.11 +0.02 -0.01 2.79 ± 0.38 ~ 0.113 ± 0.015 1.78 ~ 0.07 0.13 ~ 0.005 0.63 ~ 0.025
RF1111 2.79 ± 0.39 ~ 0.110 ± 0.005 2.79 ± 0.381 ~ 0.110 ± 0.015 2.59 ~ 0.102 0.25 ~ 0.010 0.75 ~ 0.030
C17 2.94 ± 0.527 ~ 0.116 ± 0.021 2.813 ± 0.521 ~ 0.111 ± 0.021 2.667 ~ 0.105 0.193 ~ 0.008 1.2 ~ 0.047
C18 3.14 ± 0.727 ~ 0.124 ± 0.029 2.946 ± 0.654 ~ 0.116 ± 0.026 2.667 ~ 0.105 0.193 ~ 0.008 1.2 ~ 0.047
1206 3.2 ± 0.20 ~ 0.126 ± 0.008 1.6 ± 0.20 ~ 0.063 ± 0.008 1.70 ~ 0.068 0.25 ~ 0.010 0.75 ~ 0.030
1210 3.2 ± 0.20 ~ 0.126 ± 0.008 2.5 ± 0.20 ~ 0.098 ± 0.008 2.0 ~ 0.08 0.25 ~ 0.010 0.75 ~ 0.030
1515 3.81 ± 0.381 ~ 0.150 ± 0.015 3.81 ± 0.381 ~ 0.150 ± 0.015 3.3 ~ 0.13 0.381 ~ 0.015 1.143 ~ 0.045
1808 4.5 ± 0.35 ~ 0.180 ± 0.014 2.0 ± 0.30 ~ 0.08 ± 0.012 2.0 ~ 0.08 0.25 ~ 0.01 1.0 ~ 0.04
1812 4.5 ± 0.30 ~ 0.180 ± 0.012 3.2 ± 0.20 ~ 0.126 ± 0.008 3.2 ~ 0.125 0.25 ~ 0.010 1.143 ~ 0.045
1825 4.5 ± 0.30 ~ 0.180 ± 0.012 6.40 ± 0.40 ~ 0.252 ± 0.016 4.2 ~ 0.16 0.25 ~ 0.010 1.0 ~ 0.04
2020 5.0 ± 0.40 ~ 0.197 ± 0.016 5.0 ± 0.40 ~ 0.197 ± 0.016 4.5 ~ 0.18 0.25 ~ 0.01 1.0 ~ 0.04
2220 5.7 ± 0.40 ~ 0.225 ± 0.016 5.0 ± 0.40 ~ 0.197 ± 0.016 4.2 ~ 0.165 0.25 ~ 0.01 1.0 ~ 0.04
2211 5.7 ± 0.40 ~ 0.225 ± 0.016 2.79 ± 0.30 ~ 0.11 ± 0.012 2.5 ~ 0.1 0.25 ~ 0.01 0.8 ~ 0.03
2215 5.7 ± 0.40 ~ 0.225 ± 0.016 3.81 ± 0.35 ~ 0.35 ± 0.02 2.5 ~ 0.1 0.25 ~ 0.01 0.8 ~ 0.03
2221 5.59 ± 0.381 ~ 0.220 ± 0.015 5.33 ± 0.381 ~ 0.210 ± 0.015 2.03 ~ 0.08 0.381 ~ 0.015 1.143 ~ 0.045
2225 5.7 ± 0.40 ~ 0.225 ± 0.016 6.30 ± 0.40 ~ 0.252 ± 0.016 4.2 ~ 0.165 0.381 ~ 0.01 1.143 ~ 0.045
C22 5.734 ± 0.667 ~ 0.226 ± 0.026 6.37 ± 0.699 ~ 0.251 ± 0.028 3.467 ~ 0.137 N/A N/A
2520 6.35 ± 0.40 ~ 0.250 ± 0.016 5.08 ± 0.40 ~ 0.200 ± 0.016 4.57 ~ 0.18 0.381 ~ 0.015 1.143 ~ 0.045
RF2525 5.84 ± 0.21 ~ 0.230 ± 0.008 6.35 ± 0.381 ~ 0.250 ± 0.015 4.19 ~ 0.165 0.381 ~ 0.015 1.143 ~ 0.045
3333 8.38 ± 0.432 ~ 0.330 ± 0.017 8.38 ± 0.432 ~ 0.330 ± 0.017 6.35 ~ 0.25 0.381 ~ 0.015 1.143 ~ 0.045
3530 8.89 ± 0.457 ~ 0.350 ± 0.018 7.62 ± 0.381 ~ 0.300 ± 0.015 6.35 ~ 0.25 0.381 ~ 0.015 1.143 ~ 0.045
3640 9.2 ± 0.50 ~ 0.36 ± 0.02 10.16 ± 0.50 ~ 0.40 ± 0.02 4.5 ~ 0.18 0.50 ~ 0.02 1.50 ~ 0.06
C40 9.732 ± 0.804 ~ 0.384 ± 0.032 8.665 ± 1.737 ~ 0.381 ± 0.029 3.467 ~ 0.137 N/A N/A
4040 10.2 ± 0.508 ~ 0.400 ± 0.020 10.2 ± 0.508 ~ 0.400 ± 0.020 7.62 ~ 0.30 0.50 ~ 0.02 1.50 ~ 0.06
4540 11.4 ± 0.584 ~ 0.450 ± 0.023 10.2 ± 0.508 ~ 0.400 ± 0.020 7.62 ~ 0.30 0.50 ~ 0.02 1.50 ~ 0.06
5440 13.7 ± 0.686 ~ 0.540 ± 0.027 10.2 ± 0.508 ~ 0.400 ± 0.020 7.62 ~ 0.30 0.50 ~ 0.02 1.50 ~ 0.06
5550 14.0 ± 0.711 ~ 0.550 ± 0.028 12.7 ± 0.635 ~ 0.500 ± 0.025 7.62 ~ 0.30 0.50 ~ 0.02 1.50 ~ 0.06
6560 16.5 ± 0.838 ~ 0.650 ± 0.033 15.2 ± 0.762 ~ 0.600 ± 0.030 7.62 ~ 0.30 0.50 ~ 0.02 1.50 ~ 0.06
7565 19.1 ± 0.965 ~ 0.750 ± 0.038 16.5 ± 0.838 ~ 0.650 ± 0.033 7.62 ~ 0.30 0.50 ~ 0.02 1.50 ~ 0.06
8060 20.3 ± 0.5 ~ 0.80 ± 0.02 15.24 ± 0.50 ~ 0.60 ± 0.02 4.2 ~ 0.165 0.50 ~ 0.02 1.50 ~ 0.06
20 www.knowlescapacitors.com
Chip ordering information - DLI parts
C 17 CF 620 J - 7 U N - X 0 T
MLC Case Dielectric Capacitance Capacitance Rated Termination Lead Test Marking Packaging
Capacitor Size Codes Tolerance voltage Type Level
Voltage
Case Size Codes Test Level
Case Dimensions Code Value Code Testing
04 0.040" x 0.020" 5 50V X Commercial or Industrial
06 0.060" x 0.030" 1 100V Y Reduced Visual
07 0.110" x 0.070" 8 150V A MIL-PRF-55681 Group A
08 0.080" x 0.050" 6 200V C MIL-PRF-55681 Group C
11 0.055" x 0.055" 9 250V
3 300V D Customer Specified
17 0.110" x 0.110" 4 500V
18 0.110" x 0.110" 7 1kV
22 0.220" x 0.250" A 1.5kV Laser Mark
40 0.380" x 0.380" G 2kV
B 2.5kV Code Laser Marking
D 3.6kV 0 No marking
H 7.2kV
Dielectric Codes S SPECIAL 1* Single-side marked
Material Characteristics 2* Double-side marked
AH P90 High-Q Capacitance Tolerance 3* Large single-side marked
CF NP0 High-Q 4* Large double-side marked
Code Value 5* Vertical edge marked
A ± 0.05pF 9 Customer Specified
B ± 0.1pF *Reduces DWV Rating.
Capacitance Codes C ± 0.25pF
D ± 0.5pF
1st two digits are 1R0 1.0pF F ± 1%
significant figures G ± 2% Packaging
of capacitance, 120 12pF J ± 5% Code Packaging
3rd digit denotes K ± 10%
number of zeros, 471 470pF M ± 20% T Tape & Reel – Horizontal
R = decimal point X GMV V Tape & Reel – Vertical
Examples: 102 1,000pF
S SPECIAL W Waffle Pack
<10pF A, B, C, D B Bulk
>10pF F, G, J, K, M
P Plastic Box
Termination Codes R Tube (Rail)
S Customer Specified
Code Termination System
T Ag Termination, Ni Barrier Layer, Heavy SnPb Plated Solder
U Ag Termination, Ni Barrier Layer, SnPb Plated Solder Leading
S Ag Termination, Ni Barrier Layer, Gold Flash* Code Lead Type
Z Ag Termination, Ni Barrier Layer, Sn Plated Solder*
E Ag Termination, Enhanced Ni Barrier, Sn Plated Solder* A Axial Ribbon
P** AgPd Termination* B Radial Ribbon
Q Polymer Termination, Ni Barrier Layer, Sn Plated Solder* C Center Ribbon
Y Polymer Termination, Ni Barrier Layer, SnPb Plated Solder D Specialty Customer
M** Polymer Termination, Cu Barrier Layer, Sn Plated Solder* Defined
W** Ag Termination, Cu Barrier Layer, Sn Plated Solder* E Axial Wire
H** Ag Termination, Enhanced Cu Barrier, Sn Plated Solder* F Radial Wire
V** Ag Termination, Cu Barrier Layer, SnPb Plated Solder N NONE
R** Ag Termination, Cu Barrier Layer, Heavy SnPb Plated Solder Note: Consult your local
Sales Office for RoHS compliant leaded
** Nonmagnetic *Indicates RoHS terminations devices.
Lead Termination Codes Leads are attached with high melting point solder (HMP) at 296°C.
Axial Ribbon - Code A Radial Ribbon - Code B Center Ribbon - Code C Axial Wire Lead - Code E Radial Wire Lead - Code F
www.knowlescapacitors.com 21
Chip ordering information - Novacap parts
XX 1206 N 472 J 101 N X050 H T M HB
Capacitance Capacitance Special High High
Prefix Case Size Dielectric Codes Tolerance Voltage Termination Thickness Reliability Packaging Marking Reliability
Testing Test Criteria
Marking
Prefix Definitions None Unmarked
None Standard chip Special Thickness M Marked
None Standard *Marking not
RF Improved ESR Capacitor p. 39 available on
thickness as per sizes < 0603
ST Stacked Capacitor Assembly p. 76 - 81 Novacap catalog Note: Refer to page 17.
SM Stacked Hi-Rel Capacitor Assembly p. 76 - 81 specifications
CR Cap Rack Arrays p. 82 X Denotes a special
thickness other Packaging
than standard.
Specify in inches None Bulk
if required. T Tape and Reel
Dielectric Codes (As shown above
X = 0.050”) W Waffle Pack
N C0G/NP0 Ultra Stable
K R3L Ultra Stable
B X7R Stable High Reliability High Reliability
W X5R Stable Testing Testing Criteria
X BX MIL None Standard product HB MIL-PRF-55681 Group A
BB X7R Stable BME {
BW X5R Stable BME H High Reliability Testing HV MIL-PRF-49467 Group A
M C0G/NP0 Non Magnetic H High Temp Screening HS MIL-PRF-123 Group A
C X7R Non Magnetic HK MIL-PRF-38534 Class K
F C0G/NP0 High Temp. (up to 160ºC)
D, RD C0G/NP0 High Temp. (up to 200ºC) Termination Codes
S X8R High Temp. (up to 150ºC) Voltage Code
E, RE Class II High Temp. (up to 200ºC) 1st two digits are significant, P Palladium Silver
G Class II High Temp. (up to 160ºC) third digit denotes number PR Palladium Silver*
RN C0G/NP0 Lead free of zeros. For example: K Solderable Palladium Silver*
RB X7R Lead free 160 16 Volts N Nickel Barrier* 100% tin
101 100 Volts Y Nickel Barrier 90% tin, 10% lead
501 500 Volts NG Nickel Barrier Gold Flash*
102 1,000 Volts C FlexiCap™/Nickel Barrier* 100% tin
502 5,000 Volts D FlexiCap™/Nickel Barrier 90% tin, 10% lead
Capacitance Codes 103 10,000 Volts B Copper Barrier* 100% tin
E Copper Barrier 90% tin, 10% lead
1st two digits 1R0 1.0pF S Silver*
are significant 120 12pF *Indicates RoHS terminations
figures of
capacitance, 471 470pF
3rd digit Capacitance Tolerance Codes
denotes 102 1,000pF
number of 273 0.027µF Code Tolerance C0G/NP0 R3L X7R BX X8R Class II X5R
zeros, R =
decimal point 474 0.47µF * Not RF series N M F/D, RD K B C, RE X S E/G W
Examples: B ±0.10pF • •
105 1.0µF C ±0.25pF Cap.
Value • • •
< 10pF
D ±0.50pF • • •
F ±1% • • •
G ±2% • • • •
J ±5% • • • • •* • •* • •
K ±10% • • • • • • • • • •
M ±20% • • • • • • • • •
22 www.knowlescapacitors.com
Chip ordering information - Syfer parts
1210 Y 100 0103 K X T ___
Chip Size Termination Voltage Capacitance Capacitance Dielectric Packaging Suffix code
in picofarads (pF) Tolerance
Case Code
0402 Capacitance Packaging
0603 Tolerance Codes Code
0805 Code Tolerance T 178mm (7”) reel
1206 R 330mm (13”) reel
1210 H ±0.05pF < 4.7pF
1808 H ±0.05pF B Bulk pack - tubs or
1812 B ±0.10pF trays
Cap. Value
1825 C ±0.25pF < 10pF
2220 D ±0.50pF
2225 F ±1%
3640 G ±2% Suffix Definitions
5550 Cap. Value Used for specific customer
8060 J ±5% > 10pF requirements
K ±10% PXX Palladium electrodes
M ±20% Chip marking
LS* *(consult sales office)
Termination Codes
A Nickel barrier 90/10% tin/lead Dielectric Codes
F Palladium Silver* Code Dielectric Features
H FlexiCap™/Nickel Barrier 90/10% tin/lead C C0G/NP0 (1B) Ultra Stable
J Nickel Barrier* 100% tin H X8G Ultra Stable/High Q
Y FlexiCap™/Nickel Barrier* 100% tin P X5R Stable
2 Copper Barrier* (Non Mag) 100% tin X X7R (2R1) Stable
3 FlexiCap™/Copper Barrier* (Non Mag) 100% tin J X7R (2R1)(BME) Stable
4 Copper Barrier (Non Mag) 90/10% tin/lead N X8R Stable
5 FlexiCap™/Copper Barrier (Non Mag) 90/10% tin/lead Q C0G/NP0 (1B) Ultra Stable/High Q
*Indicates RoHS terminations U C0G/NP0 (1B) Ultra Stable/Ultra-low ESR
A C0G/NP0 (1B) AEC -Q200 approved
S X7R (2R1)(BME) AEC -Q200 approved
E X7R (2R1) AEC -Q200 approved
T X8R AEC -Q200 approved
Voltage Code K C0G/NP0 (1B)(BME) AEC -Q200 approved
Code Value Code Value Code Value F C0G/NP0 (1B) IECQ-CECC release
010 10Vdc 1K0 1kVdc A25 250Vac D X7R (2R1) IECQ-CECC release
016 16Vdc 1K2 1.2kVdc R BZ (2C1) IECQ-CECC release
025 25Vdc 1K5 1.5kVdc B BX (2X1) IECQ-CECC release
050 50Vdc 2K0 2kVdc G C0G/NP0 (1B)(BME) Ultra Stable
063 63Vdc 2K5 2.5kVdc
100 100Vdc 3K0 3kVdc Capacitance Code
200 200Vdc 4K0 4kVdc Calculation Example Capacaitance value
250 250Vdc 5K0 5kVdc
500 500Vdc 6K0 6kVdc <1.0pF
630 630Vdc 8K0 8kVdc Insert a P for the decimal point P300 0.3pF (values in 0.1pF steps)
10K 10kVdc as the 1st character.
12K 12kVdc ≥1.0pF & <10pF
Insert a P for the decimal point 8P20 8.2pF (values are E24 series)
as the 2nd character.
≥10pF
1st digit is 0.
2nd and 3rd digits are significant 0101 100pF (values are E24 series)
figures of capacitance value.
4th digit is number of zeros.
www.knowlescapacitors.com 23
MLCC standard range - 10V to 12kVdc
10V 16V 25V 50/63V 100V 200/ 500V 630V 1kV
250V
C0G/ X5R C0G/ X7R X5R C0G/ X7R X5R C0G/ X7R X5R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R
NP0 NP0 NP0 NP0 NP0 NP0 NP0 NP0 NP0
0402 0.3p 120p 0.3p 120p 0.3p 120p 0.3p 120p 0.3p 120p
— — - - — - - — - - — - - - - — — — — — —
270p 5.6n 220p 4.7n 180p 4.7n 180p 4.7n 100p 2.2n
0603 0.47p 120n 0.47p 100p 0.47p 100p 0.47p 100p 56n 0.47p 100p 0.47p 100p 0.47p 100p
- - - - 120n - - — - - - - - - - - - — — — —
3.9n 150n 2.7n 100n 2.2n 100n 1.5n 100n 68n 470p 47n 220p 10n 150p* 1.5n*
0805 1.0p 390n 1.0p 100p 390n 1.0p 100p 270n 1.0p 100p 270n 1.0p 100p 1.0p 100p 1.0p 100p 1.0p 100p 1.0p 100p
- - - - - - - - - - - - - - - - - - - - -
15n 680n 12n 330n 470n 10n 220n 390n 5.6n 220n 330n 2.2n 100n 1.0n 56n 820p 15n 820p 12n 180p 10n
1206 1.0p 1.2µ 1.0p 100p 1.0p 100p 1.0p 100p 560n 1.0p 100p 1.0p 100p 1.0p 100p 1.0p 100p 1.0p 100p
- - - - 1.2µ - - 1.0µ - - - - - - - - - - - - -
47n 1.5µ 33n 1.0µ 27n 820n 22n 470n 680n 8.2n 330n 3.9n 150n 2.7n 68n 2.7n 47n 1.5n 27n
1210 3.9p 1.8µ 3.9p 100p 1.8µ 3.9p 100p 1.5µ 3.9p 100p 1.2µ 3.9p 100p 3.9p 100p 3.9p 100p 3.9p 100p 3.9p 100p
- - - - - - - - - - - - - - - - - - - - -
100n 3.3µ 68n 1.5µ 2.7µ 56n 1.2µ 2.2µ 33n 1.0µ 1.5µ 18n 680n 8.2n 330n 6.8n 150n 6.8n 100n 2.2n 47n
1808 4.7p 1.8µ 4.7p 100p 1.8µ 4.7p 100p 4.7p 100p 820n 4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p
- - - - - - - 1.5µ - - - - - - - - - - - - -
100n 2.7µ 68n 1.5µ 2.2µ 47n 1.2µ 33n 680n 1.0µ 18n 560n 8.2n 270n 6.8n 150n 6.8n 100n 2.2n 47n
1812 10p 3.9µ 10p 150p 3.9µ 10p 150p 2.7µ 10p 150p 2.7µ 10p 150p 10p 150p 10p 150p 10p 150p 10p 150p
T=2.5mm - - - - - - - - - - - - - - - - - - - - -
220n 10µ 180n 3.3µ 6.8µ 150n 2.2µ 4.7µ 100n 2.2µ 3.3µ 47n 1.5µ 22n 680n 15n 330n 10n 180n 6.8n 100n
1812 820n 18n 390n 12n 220n 120n
T=3.2mm — — — — — — — — — — — — — 27n - - - - - 8.2n -
1000n 22n 470n 22n 330n 180n
1825 10p 5.6µ 10p 220p 5.6µ 10p 220p 4.7µ 10p 220p 2.2µ 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p
T=2.5mm - - - - - - - - - - - - - - - - - - - - -
470n 15µ 330n 4.7µ 12µ 220n 3.9µ 10µ 150n 2.2µ 6.8µ 68n 1.5µ 33n 1.0µ 27n 560n 22n 200n 12n 200n
1825 39n
T=3.2mm — — — — — — — — — — — — — - — 33n — 27n — 15n —
47n
2220 10p 6.8µ 10p 220p 6.8µ 10p 220p 5.6µ 10p 220p 3.9µ 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p
T=2.5mm - - - - - - - - - - - - - - - - - - - - -
470n 18µ 330n 5.6µ 12µ 220n 4.7µ 10µ 150n 3.3µ 6.8µ 68n 2.2µ 33n 1.0µ 22n 560n 18n 330n 15n 120n
2220 39n 1.2µ 27n 680n 22n 390n 18n 150n
T=4.2mm — — — — — — — — — — — — — - - - - - - - -
56n 2.2u 39n 1µ 33n 1µ 22n 470n
2225 10p 8.2µ 10p 330p 8.2µ 10p 330p 6.8µ 10p 330p 3.9µ 10p 330p 10p 330p 10p 330p 10p 330p 10p 330p
T=2.5mm - - - - - - - - - - - - - - - - - - - - -
560n 22µ 470n 6.8µ 15µ 330n 5.6µ 12µ 220n 3.3µ 10µ 82n 2.7µ 47n 1.5µ 33n 820n 22n 390n 18n 150n
2225 56n 39n 27n 22n
T=4.0mm — — — — — — — — — — — — — - — - — - — - —
68n 47n 39n 27n
3640 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p
T=2.5mm — — — — — — — — - - — - - - - - - - - - -
330n 10µ 270n 5.6µ 120n 3.3µ 82n 1.0µ 68n 680n 47n 180n
3640 150n 3.9µ 100n 1.2µ 82n 820n 56n 220n
T=4.0mm — — — — — — — — — — — — — - - - - - - - -
180n 5.6µ 120n 2.7µ 100n 2.2µ 82n 1µ
5550 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n
T=2.5mm — — — — — — — — - - — - - - - - - - - - -
680n 15µ 470n 10µ 270n 5.6µ 180n 1.8µ 120n 1.2µ 82n 390n
5550 220n 150n 100n
T=4.0mm — — — — — — — — — — — — — 330n — - — - — - —
270n 180n 150n
8060 Note: 0505, 1111 and 2211 case sizes 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n
T=2.5mm — — are a—vailabl—e in our—specia—lty rang—es. — - - — - - - - - - - - - -
Please refer to the relevant sections of 1.0µ 22µ 680n 15µ 390n 10µ 270n 3.3µ 220n 2.2µ 150n 1.0µ
8060 this catalogue for more details. 470n 330n 270n 180n
T=4.0mm — — — — — — — — — — — — — - — - — - — - —
560n 470n 390n 270n
10V 16V 25V 50/63V 100V 200/ 500V 630V 1kV
250V
24 www.knowlescapacitors.com
Notes: 1) Capacitance in F - min value above max value. 2) *These parts may require conformal coating post soldering. 3) T = Maximum thickness.
4) †Higher capacitance values available from the NC range - see page 63. 5) StackiCap™ high capacitance versions are now available. Please refer to datasheet.
6) Parts in this range may be defined as dual-use under export control legislation as such may be subject to export licence restrictions. Please refer to p12 for
more information on the dual-use regulations and contact the Sales Office for further information on specific part numbers.
1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 8kV 10kV 12kV
C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R C0G/ X7R
NP0 NP0 NP0 NP0 NP0 NP0 NP0 NP0 NP0 NP0 NP0
— — — — — — — — — — — — — — — — — — — — — — 0402
— — — — — — — — — — — — — — — — — — — — — — 0603
1.0p 1.0p 1.0p 0805
- — - — - — — — — — — — — — — — — — — — — —
120p 82p 47p
1.0p 100p 1.0p 100p 1.0p 100p 1.0p 100p 1.0p 100p 1206
- - - - - - - - - - — — — — — — — — — — — —
680p 15n 330p 10n 220p 3.3n† 100p 2.7n† 68p 1.5n†
3.9p 100p 3.9p 100p 3.9p 100p 3.9p 100p 3.9p 100p 1210
- - - - - - - - - - — — — — — — — — — — — —
1.5n 18n 820p 12n 470p 5.6n† 220p 4.7n† 150p 3.3n†
4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p 4.7p 100p 1808
- - - - - - - - - - - - - - - - — — — — — —
1.5n 22n 1.0n 15n 470p 5.6n† 270p 4.7n† 220p 3.3n† 120p* 2.2n*† 68p* 680p*† 47p* 390p*†
10p 150p 10p 150p 10p 150p 10p 150p 10p 150p 10p 150p 10p 150p 10p 150p 1812
- - - - - - - - - - - - - - - - — — — — — — T=2.5mm
4.7n 33n 2.7n 22n 1.5n 10n† 820p 8.2n† 560p 4.7n† 270p* 3.3n*† 180p* 1.2n*† 120p* 1.0n*†
5.6n 39n 27n 12n 330p 220p 150p 1812
- - 3.3n - 1.8n - 1.0n — 680p — - — - — - — — — — — — — T=3.2mm
6.8n 100n 56n 33n 390p* 270p* 180p*
10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 1825
- - - - - - - - - - - - - - - - — — — — — — T=2.5mm
6.8n 68n 4.7n 47n 3.3n 10n 1.5n 6.8n 1.2n 3.9n 560p* 2.2n* 390p* 1.8n* 270p* 1.5n*
8.2n 5.6n 1.8n 1825
- — - — 3.9n — - — 1.5n — 680p* — 470p* — 330p* — — — — — — — T=3.2mm
10n 6.8n 2.2n
10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 10p 220p 2220
- - - - - - - - - - - - - - - - — — — — — — T=2.5mm
10n 82n 5.6n 47n 3.3n 33n 1.8n 22n† 1.5n 10n† 680p* 6.8n*† 470p* 4.7n*† 330p* 2.2n*†
12n 100n 6.8n 50n 3.9n 39n 2.2n 1.8n 820p 560p 390p 2220
- - - - - - - — - — - — - — - — — — — — — — T=4.2mm
15n 220n 10n 150n 5.6n 100n 3.3n 2.2n 1.2n* 820p* 560p*
10p 330p 10p 330p 10p 330p 10p 330p 10p 330p 10p 330p 10p 330p 10p 330p 2225
- - - - - - - - - - - - - - - - — — — — — — T=2.5mm
12n 100n 6.8n 68n 4.7n 33n 2.2n 12n 1.8n 8.2n 820p* 5.6n* 560p* 4.7n* 390p* 2.7n*
15n 8.2n 5.6n 2.7n 2.2n 1.0n 680p 470p 2225
- — - — - — - — - — - — - — - — — — — — — — T=4.0mm
22n 12n 6.8n 3.9n 2.7n 1.5n* 1.0n* 680p*
10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 10p 470p 3640
- - - - - - - - - - - - - - - - - - - - - - T=2.5mm
33n 150n 22n 100n 10n 47n 6.8n 33n 4.7n 22n 1.8n 6.8n 1.5n 5.6n 1.0n 4.7n 150p 1.5n* 100p 1.0n* 68p 820p*
39n 180n 27n 120n 12n 56n 8.2n 5.6n 2.2n 1.8n 1.2n 3640
- - - - - - - — - — - — - — - — — — — — — — T=4.0mm
56n 470n 39n 330n 18n 150n 12n 8.2n 3.3n 2.2n 1.5n
27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 27p 1.0n 5550
- - - - - - - - - - - - - - - - - - - - - - T=2.5mm
68n 220n 39n 150n 22n 82n 12n 68n 10n 47n 4.7n 15n 2.7n 10n 1.8n 8.2n 330p 4.7n* 180p 2.2n* 120p 1.2n*
82n 47n 27n 15n 12n 5.6n 3.3n 2.2n 5550
- — - — - — - — - — - — - — - — — — — — — — T=4.0mm
100n 68n 39n 22n 18n 6.8n 4.7n 3.3n
47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 47p 2.2n 8060
- - - - - - - - - - - - - - - - - - - - - - T=2.5mm
100n 470n 68n 330n 39n 150n 22n 100n 15n 82n 8.2n 33n 5.6n 22n 3.9n 15n 680p 6.8n* 470p 4.7n* 220p 2.2n*
120n 82n 47n 27n 18n 10n 6.8n 4.7n 8060
- — - — - — - — - — - — - — - — — — — — — — T=4.0mm
180n 120n 68n 39n 27n 15n 10n 6.8n
1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 8kV 10kV 12kV
www.knowlescapacitors.com 25
Industry Standard - MLC chip range - X7R
Capacitance Code 0402 0603 0805 1206 Capacitance Code
100pF 101 16V 25V 50/63V 100V 200/250V 500V 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 100pF 101
120 121 16V 25V 50/63V 100V 200/250V 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
X7R 680 681 680 681
820 821 820 821
1.0nF 102 1.5nF † 1.0nF 102
1.2 122 2.2nF 1.5nF 1.2 122
1.5 152 1.5 152
1.8 182 (200V) 2.7nF † 1.8 182
2.2 222 3.3nF † 2.2 222
2.7 272 4.7nF 2.7 272
3.3 332 3.3 332
3.9 392 4.7nF (50V) 4.7nF 3.9 392
4.7 472 5.6nF 4.7 472
5.6 562 5.6 562
6.8 682 10nF 6.8 682
8.2 822 10nF 10nF 8.2 822
10nF 103 15nF 10nF 103
12 123 15nF 12 123
15 153 12nF 15 153
18 183 27nF ** 18 183
22 223 22 223
27 273 27 273
33 333 47nF 47nF 33 333
39 393 39 393
47 473 68nF 47 473
56 563 56 563
68 683 100nF 100nF 56nF 68 683
82 823 100nF 100nF 82 823
100nF 104 150nF 100nF 104
120 124 t 120 124
150 154 220nF 150 154
180 184 220nF 180 184
220 224 220 224
270 274 330nF 330nF 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 470nF 560 564
680 684 820nF 680 684
820 824 1.0µF 820 824
1.0µF 105 1.0µF 105
1.2 125 1.2 125
1.5 155 1.5 155
1.8 185 X7R 1.8 185
2.2 225 2.2 225
2.7 275 2.7 275
3.3 335 3.3 335
3.9 395 3.9 395
4.7 475 4.7 475
5.6 565 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 10µF 106
12 126 12 126
15 156 15 156
18 186 18 186
22µF 226 22µF 226
* StackiCap™ high capacitance versions available from the
StackiCap™ range - see page 62 for details.
For 0504, 0907, 1005, 2020, † Higher capacitance values available from theNC capacitor range
2221, 4040, 5440 and 43100 - see page 63 for details.
range information please ** Max. capacitance of 27nF, has increased chip length of 3.5mm.
refer to your local Knowles Reduced max. cap value of 22nF, for standard dimension.
Sales Office. l = AEC-Q200 approved parts - maximum values.
t For 0603 50/63V values from 68nF to 100nF should be ordered
with FB6 suffix.
26 www.knowlescapacitors.com
10Vdc to 12kVdc
Capacitance Code 1210 1808 Capacitance Code
100pF 101 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 390pF 330 331
390 391 390 391
470 471 470 471
560 561 680pF 560 561
680 681 680 681 X7R
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 2.2nF 1.5 152
1.8 182 1.8 182
2.2 222 † 2.2 222
2.7 272 3.3nF † 3.3nF † 2.7 272
3.3 332 5.6nF † 4.7nF † 4.7nF † 3.3 332
3.9 392 5.6nF 3.9 392
4.7 472 4.7 472
5.6 562 † 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10nF 103 12nF 10nF 103
12 123 18nF 15nF 12 123
15 153 15 153
18 183 22nF 18 183
22 223 22 223
27 273 27 273
33 333 47nF 33 333
39 393 47nF 39 393
47 473 47 473
56 563 56 563
68 683 100nF 68 683
82 823 100nF 82 823
100nF 104 150nF 100nF 104
120 124 150nF 120 124
150 154 150 154
180 184 180 184
220 224 330nF 270nF 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 680nF 560nF 470 474
560 564 680nF 560 564
680 684 1.0µF 680 684
820 824 820 824
1.0µF 105 1.2µF 1.2µF 1.0µF 105
1.2 125 1.5µF 1.5µF 1.2 125
1.5 155 1.5 155
1.8 185 1.8 185
2.2 225 2.2 225
2.7 275 2.7 275
3.3 335 3.3 335
3.9 395 3.9 395
4.7 475 4.7 475
5.6 565 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 X7R 10µF 106
12 126 12 126
15 156 15 156
18 186 18 186
22µF 226 22µF 226
www.knowlescapacitors.com 27
Industry Standard - MLC chip range - X7R
Capacitance Code 1812 1825 Capacitance Code
100pF 101 100pF 101
120 121 120 121
150 151 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 150 151
180 181 180 181
220 221 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
X7R 680 681 680 681
820 821 1.0nF 820 821
1.0nF 102 1.2nF 1.0nF 102
1.2 122 1.5nF 1.2 122
1.5 152 1.8nF 1.5 152
1.8 182 2.2nF 1.8 182
2.2 222 3.3nF 2.2 222
2.7 272 2.7 272
3.3 332 † 3.9nF 3.3 332
3.9 392 4.7nF 3.9 392
4.7 472 † 4.7 472
5.6 562 8.2nF † 6.8nF 5.6 562
6.8 682 10nF † 10nF 6.8 682
8.2 822 8.2 822
10nF 103 10nF 103
12 123 12 123
15 153 22nF 15 153
18 183 18 183
22 223 33nF 22 223
27 273 27 273
33 333 * 47nF 33 333
39 393 39 393
47 473 68nF 47 473
56 563 * 56 563
68 683 68 683
82 823 100nF 82 823
100nF 104 180nF * 100nF 104
120 124 200nF 120 124
150 154 200nF 150 154
180 184 * 180 184
220 224 330nF 220 224
270 274 270 274
330 334 680nF * 330 334
390 394 560nF 390 394
470 474 * 470 474
560 564 560 564
680 684 1.0µF 680 684
820 824 820 824
1.0µF 105 * 1.5µF 1.0µF 105
1.2 125 1.5µF 2.2µF 1.2 125
1.5 155 2.2µF 1.5 155
1.8 185 2.2µ 1.8 185
2.2 225 F 2.2 225
2.7 275 3.3µF 2.7 275
3.3 335 3.9µF 3.3 335
3.9 395 4.7µF 3.9 395
4.7 475 4.7 475
5.6 565 X7R 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 10µF 106
12 126 12 126
15 156 15 156
18 186 18 186
22µF 226 22µF 226
* StackiCap™ high capacitance versions available from the
For 0504, 0907, 1005, 2020, StackiCap™ range - see page 62 for details.
2221, 4040, 5440 and 43100 † Higher capacitance values available from theNC capacitor range
range information please - see page 63 for details.
refer to your local Knowles l = AEC-Q200 approved parts - maximum values.
Sales Office.
28 www.knowlescapacitors.com
10Vdc to 12kVdc
Capacitance Code 2220 2225 Capacitance Code
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 220 221
270 271 270 271
330 331 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681 X7R
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 2.2nF 1.8 182
2.2 222 2.7nF 2.2 222
2.7 272 2.7 272
3.3 332 4.7nF † 3.3 332
3.9 392 4.7nF 3.9 392
4.7 472 6.8nF 5.6nF 4.7 472
5.6 562 5.6 562
6.8 682 † 8.2nF 6.8 682
8.2 822 10nF 8.2 822
10nF 103 † 12nF 10nF 103
12 123 12 123
15 153 15 153
18 183 33nF 22nF † 18 183
22 223 33nF 22 223
27 273 27 273
33 333 47nF 33 333
39 393 39 393
47 473 68nF 47 473
56 563 82nF 56 563
68 683 100nF 68 683
82 823 120nF 82 823
100nF 104 * 150nF 100nF 104
120 124 120 124
150 154 * 150 154
180 184 180 184
220 224 330nF * 220 224
270 274 390nF 270 274
330 334 330 334
390 394 560nF 390 394
470 474 * 820nF 470 474
560 564 560 564
680 684 1.0µF 680 684
820 824 820 824
1.0µF 105 * * 1.5µF 1.0µF 105
1.2 125 1.2 125
1.5 155 2.7µF 1.5 155
1.8 185 2.2µF 1.8 185
2.2 225 3.3µF * 3.3µF 2.2 225
2.7 275 2.7 275
3.3 335 3.3 335
3.9 395 4.7µF 3.9 395
4.7 475 5.6µF 5.6µF 4.7 475
5.6 565 6.8µF 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 10µF 106
12 126 X7R 12 126
15 156 15 156
18 186 18 186
22µF 226 22µF 226
www.knowlescapacitors.com 29
Industry Standard - MLC chip range - C0G/NP0
Capacitance Code 0402 0603 0805 1206 Capacitance Code
0.33pF p33 16V 25V 50/63V 100V 200/250V 0.33pF p33
0.47 p47 10V 16V 25V 50/63V 100V 200/250V 500V 0.47 p47
0.50 p50 0.50 p50
1.0 1p0 10V 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 10V 16V 25V 50/63V 100V 200/250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 1.0 1p0
C0G/NP0 1.2 1p2 1.2 1p2
1.5 1p5 1.5 1p5
1.8 1p8 1.8 1p8
2.2 2p2 2.2 2p2
2.7 2p7 2.7 2p7
3.3 3p3 3.3 3p3
3.9 3p9 3.9 3p9
4.7 4p7 4.7 4p7
5.6 5p6 5.6 5p6
6.8 6p8 6.8 6p8
8.2 8p2 8.2 8p2
10pF 100 10pF 100
12 120 12 120
15 150 15 150
18 180 18 180
22 220 22 220
27 270 27 270
33 330 33 330
39 390 39pF 39 390
47 470 47 470
56 560 100pF (200V) 68pF 56 560
68 680 82pF 68 680
82 820 100pF 82 820
100pF 101 180pF (50V) 120pF 100pF 101
120 121 150pF 120 121
150 151 180pF 180pF 150 151
180 181 220pF 220pF 220pF 180 181
220 221 270pF 220 221
270 271 330pF 270 271
330 331 330 331
390 391 470pF 390 391
470 471 470 471
560 561 680pF 560 561
680 681 820pF 820pF &nbs
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