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UM5055

器件型号:UM5055
器件类别:分立半导体    二极管   
厂商:英联半导体(Union Semiconductor)

上海英联电子科技有限公司成立于2001年,是一家无晶圆厂的集成电路设计公司。公司致力于高性能线性和混合信号集成电路的研发、设计与销售,产品被应用于各类电子设备。

上海英联电子科技有限公司的产品通过检测、测量、放大、转换电源以及提供电路保护,桥接起了模拟世界与数字世界。

厂商官网:http://www.union-ic.com/
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器件描述

Single Line ESD Protection Diode Array

参数
参数名称属性值
Reach Compliance Codeunknow
ECCN代码EAR99
Base Number Matches1

UM5055产品介绍

UM5055
Single Line ESD Protection Diode Array
UM5055 SOD523
General Description
The UM5055 ESD protection diode is designed to replace multilayer varistors (MLVs) in portable
applications such as cell phones, notebook computers, and PDA’s. It features large cross-sectional
area junctions for conducting high transient currents, offers desirable electrical characteristics for
board level protection, such as fast response time, lower operating voltage, lower clamping
voltage and no device degradation when compared to MLVs.
The UM5055 ESD protection diode protects sensitive semiconductor components from damage or
upset due to electrostatic discharge (ESD) and other voltage induced transient events. The
UM5055 is available in SOD523 package and with working voltages of 5 volt.
It gives designer the flexibility to protect one unidirectional line in applications where arrays are
not practical. Additionally, it may be “sprinkled” around the board in applications where board
space is at a premium. It may be used to meet the ESD immunity requirements of IEC 61000-4-2,
Level 4 (±15kV air, ±8kV contact discharge).
Applications
Cell Phone Handsets and Accessories
Microprocessor based equipment
Personal Digital Assistants(PDA’s)
Notebooks, Desktops, and Servers
Portable Instrumentation
Cordless Phones
Digital Cameras
Peripherals
MP3 Players
Features
Transient protection for data & power lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV
(contact)
Small package for use in portable electronics
Suitable replacement for MLV’s in ESD
protection applications
Protect one I/O or power line
Low clamping voltage
Stand off voltage: 5V
Low leakage current
Solid-state silicon-avalanche technology
Pin Configurations
Top View
ZF
UM5055
SOD523
________________________________________________________________________
http://www.union-ic.com Rev.03 Jul. 2013
1/5
UM5055
Ordering Information
Part
Number
UM5055
Working
Voltage
5.0V
Packaging
Type
SOD523
Channel
1
Marking
Code
ZF
Shipping
Qty
3000pcs/7 Inch
Tape & Reel
Absolute Maximum Ratings
Rating
Peak Pulse Power (tp = 8/20μs)
Maximum Peak Pulse Current (t=8/20μs)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
P
PK
I
PP
T
L
T
J
T
STG
Value
140
11
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
Amps
°C
°C
°C
Symbol Definition
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
pp
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
RWM
Breakdown Voltage @ I
t
Test Current
Forward Current
Forward Voltage @ I
F
Peak Power Dissipation
Max. Capacitance @ V
R
= 0V, f = 1MHz
Symbol
I
PP
V
C
V
RWM
I
R
V
BR
I
t
I
F
V
F
P
PK
C
________________________________________________________________________
http://www.union-ic.com Rev.03 Jul. 2013
2/5
UM5055
Electrical Characteristics
(T=25°C, Device for 5.0V Reverse Stand-off Voltage)
Parameter
Symbol
Conditions
Reverse Stand-Off
V
RWM
Voltage
Reverse Breakdown
V
BR
It = 1mA
Voltage
Reverse Leakage
I
R
V
RWM
= 5V, T=25°C
Current
I
PP
= 5A, t
p
= 8/20μS
Clamping Voltage
V
C
I
PP
=11A, t
p
= 8/20μS
Forward Voltage
Junction Capacitance
Junction Capacitance
V
F
C
J
C
J
I
F
= 10mA
V
R
= 0V, f = 1MHz
V
R
= 2.5V, f = 1MHz
Min
Typ
Max
5
Unit
V
V
μA
V
V
6
6.8
7.8
0.1
9.1
13
0.8
40
30
55
40
pF
pF
Applications Information
Device Connection Options
UM5055 ESD protection diode is designed to protect one data, I/O, or power supply line. The
device is unidirectional and may be used on lines where the signal polarity is above ground. The
cathode band should be placed towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground
vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Minimize all printed-circuit board conductive loops including power and ground loops.
10. Avoid using shared transient return paths to a common ground point.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte
tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads
is small compared to the solder paste volume that is placed on the land pattern of the PCB, the
reflow profile will be determined by the requirements of the solder paste. Therefore, these devices
are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other
lead-free compositions, matte tin does not have any added alloys that can cause degradation of the
solder joint.
________________________________________________________________________
http://www.union-ic.com Rev.03 Jul. 2013
3/5
UM5055
Package Information
UM5055 SOD523
Outline Drawing
Symbol
A
A1
b
c
D
E
E1
E2
L
θ
DIMENSIONS
MILLIMETERS
INCHES
Min
Max
Min
Max
0.510
0.770
0.020
0.031
0.500
0.700
0.020
0.028
0.250
0.350
0.010
0.014
0.080
0.150
0.003
0.006
0.750
0.850
0.030
0.033
1.100
1.300
0.043
0.051
1.500
1.700
0.059
0.067
0.200REF
0.008REF
0.010
0.070
0.001
0.003
7°REF
7°REF
Land Pattern
NOTES:
1. Compound dimension: 1.20×0.80;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise specified;
4. The layout is just for reference.
Tape and Reel Orientation
________________________________________________________________________
http://www.union-ic.com Rev.03 Jul. 2013
4/5
UM5055
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be
accurate. Nonetheless, this document is subject to change without notice. Union assumes
no responsibility for any inaccuracies that may be contained in this document, and makes
no commitment to update or to keep current the contained information, or to notify a
person or organization of any update. Union reserves the right to make changes, at any
time, in order to improve reliability, function or design and to attempt to supply the best
product possible.
Union Semiconductor, Inc
Add: 2F, No. 3, Lane 647 Songtao Road, Shanghai 201203
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
________________________________________________________________________
http://www.union-ic.com Rev.03 Jul. 2013
5/5
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