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HSD1609

器件型号:HSD1609
器件类别:分立半导体   
文件大小:45KB,共4页
厂商:台湾华昕(HSMC)
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器件描述

160V 0.1A NPN外延平面晶体管

产品简介

功能特点

产品名称:160V 0.1A NPN外延平面晶体管


产品型号:HSD1609


产品特征:


Low frequency high voltage amplifier


Complementary pair with HSB1109



参数:


Type: PNP


BVCEO: 160V


IC: 0.1A


PD: 1.25W


hFE: MIN 60


hFE: Max. 320


VCE(sat): Max. 2V


RoHS: PF(无铅)


Package: TO-126ML


HSD1609产品介绍

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6606
Issued Date : 1993.03.15
Revised Date : 2005.08.18
Page No. : 1/4
HSD1609
NPN EPITAXIAL PLANAR TRANSISTOR
Features
Low frequency high voltage amplifier
Complementary pair with HSB1109
TO-126ML
Absolute Maximum Ratings
(T
A
=25°C)
Maximum Temperatures
Storage Temperature ........................................................................................................................... -50 ~ +150
°C
Junction Temperature ................................................................................................................... +150
°C
Maximum
Maximum Power Dissipation
Total Power Dissipation (T
A
=25°C) ................................................................................................................. 1.25 W
Maximum Voltages and Currents
BV
CBO
Collector to Base Voltage....................................................................................................................... 160 V
BV
CEO
Collector to Emitter Voltage.................................................................................................................... 160 V
BV
EBO
Emitter to Base Voltage.............................................................................................................................. 5 V
I
C
Collector Current ........................................................................................................................................ 100 mA
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
*V
CE(sat)
V
BE(on)
*h
FE1
*h
FE2
f
T
Cob
Min.
160
160
5
-
-
-
60
30
145
-
Typ.
-
-
-
-
-
-
-
-
-
3.8
Max.
-
-
-
10
2
1.5
320
-
-
-
MHz
pF
Unit
V
V
V
uA
V
V
I
C
=10uA
I
C
=1mA
I
E
=10uA
V
CB
=140V
I
C
=30mA, I
B
=3mA
I
C
=10mA, V
CE
=5V
I
C
=10mA, V
CE
=5V
I
C
=1mA, V
CE
=5V
I
C
=10mA , V
CE
=5V
V
CB
=10V, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
Classification Of hFE1
Rank
Range
B
60-120
C
100-200
D
160-320
HSD1609
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
10000
1000
Spec. No. : HE6606
Issued Date : 1993.03.15
Revised Date : 2005.08.18
Page No. : 2/4
Saturation Voltage & Collector Current
125 C
75 C
o
hFE
25 C
100
o
Saturation Voltage (mV)
1000
o
100
125 C
o
75 C
o
10
hFE @ VCE=5V
1
0.1
1
10
100
1000
25 C
V
CE(sat)
@ I
C
=10I
B
o
10
0.1
1
10
100
1000
Collector Current I
C
(mA)
Collector Current I
C
(mA)
Saturation Voltage & Collector Current
10000
1000
ON Voltage & Collector Current
25 C
o
Saturation Voltage (mV)
ON Voltage (mV)
1000
125 C
o
75 C
o
100
125 C
75 C
25 C
V
CE(sat)
@ I
C
=20I
B
o
o
o
V
BE(ON)
@ I
C
=5V
10
0.1
1
10
100
1000
10000
100
0.1
1
10
100
1000
Collector Current I
C
(mA)
Collector Current I
C
(mA)
Cutoff Frequency & Collector Current
1000
10
Capacitance & Reverse-Biased Voltage
Cutoff Frequency (MHz)
.
.
100
V
CE
=5V
Capacitance (pF)
Cob
10
1
10
100
1000
1
0.1
1
10
100
1000
Collector Current (mA)
Reverse Biased Voltage (V)
HSD1609
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6606
Issued Date : 1993.03.15
Revised Date : 2005.08.18
Page No. : 3/4
Safe Operating Area
10000
1000
Collector Current (mA)
100
P
T
=1ms
10
P
T
=100ms
P
T
=1s
1
1
10
100
1000
Forward Voltage (V)
TO-126ML Dimension
A
C
D
E
H
SD
1609
Marking:
L
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
I
B
1
F
H
G
M
2
3
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
7.74
10.87
0.88
1.28
3.50
2.61
13
1.18
2.88
0.68
-
3.44
1.88
0.50
Max.
8.24
11.37
1.12
1.52
3.75
3.37
-
1.42
3.12
0.84
2.30
3.70
2.14
0.51
*: Typical, Unit: mm
K
J
N
3-Lead TO-126ML
Plastic Package
HSMC Package Code: D
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD1609
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
T
P
Ramp-up
T
L
Ts
max
Temperature
t
L
Spec. No. : HE6606
Issued Date : 1993.03.15
Revised Date : 2005.08.18
Page No. : 4/4
Critical Zone
T
L
to T
P
Ts
min
t
S
Preheat
Ramp-down
25
t 25
o
C to Peak
Time
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (min to max) (ts)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Sn-Pb Eutectic Assembly
<3
o
C/sec
100
o
C
150
o
C
60~120 sec
<3
o
C/sec
183
o
C
60~150 sec
240
o
C +0/-5
o
C
10~30 sec
<6
o
C/sec
<6 minutes
Pb-Free Assembly
<3
o
C/sec
150
o
C
200
o
C
60~180 sec
<3
o
C/sec
217
o
C
60~150 sec
260
o
C +0/-5
o
C
20~40 sec
<6
o
C/sec
<8 minutes
Peak temperature
245
o
C
±5
o
C
260
o
C +0/-5
o
C
Dipping time
5sec
±1sec
5sec
±1sec
HSD1609
HSMC Product Specification
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