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HCB4516KF-151T20

器件型号:HCB4516KF-151T20
器件类别:无源元件    磁珠   
厂商:台庆
西北台庆成立于1975年,总部设立于台湾桃园,专注于磁性材料及电感元件相关产品的开发、制造与销售。西北台庆于中国华东地区拥有两个制造基地,并在中国华东、华南、新加坡、韩国、欧洲、美国等地设立销售及服务网点或透过多元代理系统,为客户提供及时有效的配套服务。
厂商官网:https://www.tai-tech.com.tw/
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HCB4516KF-151T20产品介绍

Form No:
T00303-1-0000-TBM01-121000415
Specification for Approval
Date:
2012/10/12
Customer :
天河
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
HCB3216KF-Series
High Current Ferrite Chip Bead
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
■ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: twnwe@pub.dgnet.gd.cn
楊登½
Peter Yang
黃筱薇
Viola Huang
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
R&D Center
APPROVED
CHECKED
DRAWN
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: hui@tai-tech.com.tw
楊祥忠
Mike Yang
羅培君
Peijun Lo
張嘉玲
Alin Chang
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
TA734003
TAI-TECH
TBM01-121000415
P1.
High Current Ferrite Chip Bead(Lead Free)
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. Suitable for reflow soldering.
4. Shapes and dimensions follow E.I.A. spec.
5. Available in various sizes.
6. Excellent solder ability and heat resistance.
7. High reliability.
8.100% Lead(Pb) & Halogen-Free and RoHS compliant
.
9. Low DC resistance structure of electrode to prevent wasteful electric power consumption.
Halogen
Halogen-free
HCB3216KF-Series
Pb
Pb-free
2.Dimensions
Chip Size
A
B
C
D
Units: mm
3.20±0.20
1.60±0.20
1.10±0.20
0.50±0.30
3.Part Numbering
HCB
A
3216
B
KF
C
-
300
D
T
E
30
F
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
LxW
Lead Free Material
300=30Ω
T=Taping and Reel, B=Bulk(Bags)
30=3000mA
4.Specification
Tai-Tech
Part Number
HCB3216KF-300T30
HCB3216KF-500T30
HCB3216KF-800T30
HCB3216KF-121T20
HCB3216KF-151T20
HCB3216KF-301T10
HCB3216KF-471T10
HCB3216KF-501T30
HCB3216KF-601T20
Impedance (Ω)
30±25%
50±25%
80±25%
120±25%
150±25%
300±25%
470±25%
500±25%
600±25%
Test Frequency
(MHz)
100
100
100
100
100
100
100
100
100
DC Resistance
(Ω) max.
0.04
0.04
0.04
0.10
0.10
0.20
0.20
0.04
0.10
Rated Current
(mA) max.
3000
3000
3000
2000
2000
1000
1000
3000
2000
www.tai-tech.com.tw
TAI-TECH
TBM01-121000415
Performance
FCB
FCM
HCB
GHB
FCA
FCI
FHI
FCH
HCI
MGI
--
--
P2.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Test Condition
-40~+125℃
(Including self-temperature rise)
-40~+125℃
-40~+105℃
(Including self-temperature rise)
-40~+105℃
Transportation
Storage Temperature
Impedance (Z)
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
For long storage conditions, please see the
Application Notice
Agilent4291
Agilent E4991
Agilent4287
Refer to standard electrical characteristics list
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
Rated Current < 1A
∆T
20
Max
Temperature Rise Test
Rated Current
1A
∆T
40
Max
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preheat: 150℃,60sec.
Solder: Sn-Cu0.5
Solder tamperature: 260±5℃
Flux for lead free: ROL0
Dip time: 10±0.5sec.
Appearance: No significant abnormality.
Solder heat Resistance
Impedance change: Within
±
30%.
Inductance change::within±10%
No mechanical damage.
Remaining terminal electrode:75% min.
260°C
Preheating Dipping Natural cooling
150°C
60
second
10±0.5
second
More than 95% of the terminal
Solderability
Preheating Dipping Natural cooling
245° C
electrode should be covered
with solder.
150° C
60
second
4±1
second
Preheat: 150
,60sec.
Solder: Sn-Cu0.5
Solder tamperature: 245±5℃
Flux for lead free: ROL0
Dip time: 4±1sec.
For FCB FCM HCB GHB
FCI FHI FCH HCI MGI:
Size
Force (Kgf) Time(sec)
1005
0.2
1608
0.5
2012
0.6
3216
1.0
>30
3225
1.0
4516
1.0
4532
1.5
For FCA:
Size
3216
W
The terminal electrode and the dielectric must
Terminal strength
not be damaged by the forces applied on the
right conditions.
W
Force (Kgf)
0.5
Time(sec)
>30
20(.787)
The terminal electrode and the dielectric must
Flexture strength
Solder a chip on a test substrate, bend the
Bending
45(1.772)
45(1.772)
not be damaged by the forces applied on the
right conditions.
substrate by 2mm (0.079in)and return.
The duration of the applied forces shall be 60
40(1.575)
100(3.937)
(+ 5) Sec.
Size
mm(inches)
0.80(0.033)
1.40(0.055)
2.00(0.079)
2.00(0.079)
2.70(0.106)
P-Kgf
0.3
1.0
1.5
2.5
2.5
R 0.5(0.02)
Bending Strength
The ferrite should not be damaged by
Forces applied on the right condition.
1608
2012
FCA3216
3216
3225
4516
4532
Appearance: Cracking, chipping and any other defects harmful to the
characteristics should not be allowed.
Random Vibration Test
Impedance: within±30%
Inductance
change::
within±10%.
Frequency: 10-55-10Hz for 15 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 15 min..
This cycle shall be performed 12 times in each
of three mutually perpendicular directions
(Total 9hours).
www.tai-tech.com.tw
TAI-TECH
Item
Performance
TBM01-121000415
Test Condition
P3.
Life testing at High
Temperature
Appearance: no damage.
Impedance: within±30%of initial value.
Inductance: within±10%of initial value.
Q: within±30%of initial value. (FCI FHI FCH)
Q: within±20%of initial value. (HCI MGI )
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Humidity: 90~95%RH.
Temperature: 40±2℃.
Temperature: 60±2℃.(HCI MGI)
Duration: 504±8hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 2 to 3 hrs.
Temperature: -40±2℃.
Duration: 500±8hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Humidity
Appearance: no damage.
Thermal shock
Phase
1
2
Temperature(℃) Time(min.)
30±5
≦0.5
30±5
Low temperature storage
test
-40±2℃
Impedance: within±30%of initial value.
room temp.
Inductance: within±10%of initial value.
3
+105±2℃
Q: within±30%of initial value.
Measured: 500 times
(FCI FHI FCH)
Q: within±20%of initial value.
(HCI MGI)
No mechanical damage
Drop
Impedance change:
±30%
Inductance change::within±10%
Drop 10 times on a concrete floor from a
height of 75cm
Derating
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
FCB
FCM
HCB
GHB
FCI
FHI
FCH
HCI
MGI
3216
3225
4516
4532
85
125
Environment Temperature+
Temperature(°C)
Land Patterns For
Reflow Soldering
0.30±0.03 0.15±0.05
0.50±0.10 0.25±0.10
0.80±0.15 0.30±0.20
0.85±0.20 0.50±0.30
1.25±0.20 0.50±0.30
1.10±0.20 0.50±0.30
1.30±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.50±0.20 0.50±0.30
0.80
1.50
2.60
3.00
4.40
4.40
5.70
5.90
0.30
0.40
0.60
1.00
2.20
2.20
2.70
2.57
0.30
0.55
0.80
0.8
FCA3216
2.8
Land
Solder Resist
Type
0603
1005
1608
2012
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
0.6±0.03
1.0±0.10
1.6±0.15
2.0±0.20
2.0±0.20
3.2±0.20
3.2±0.20
4.5±0.20
4.5±0.20
0.30±0.03
0.50±0.10
0.80±0.15
1.25±0.20
1.25±0.20
1.60±0.20
2.50±0.20
1.60±0.20
3.20±0.20
1.00
1.40
3.40
1.40
4.22
2.2-2.6
0.8
Pitch
0.4
L
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
Products shall be positioned in the sideway direction against the mechanical
stress to prevent failure.
G
H
www.tai-tech.com.tw
TAI-TECH
TBM01-121000415
P4.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
•Preheat
circuit and products to 150℃
•350℃
tip temperature (max)
•Never
contact the ceramic with the iron tip
•1.0mm
tip diameter (max)
•Use
a 20 watt soldering iron with tip diameter of 1.0mm
•Limit
soldering time to 4~5sec.
Iron Soldering
SOLDERING
NATURAL
COOLING
Reflow Soldering
PRE-HEATING
PRE-HEATING
SOLDERING
20~40s
)
TP(260° C / 40s max.)
217
200
150
within 4~5s
TEMPERATURE(° C)
350
NATURAL
COOLING
(
60~150s
60~180s
480s max.
150
Over 60s
TIME( sec.)
Gradual cooling
TIME(sec.)
25
Reflow times: 3 times max
Fig.1
6-2.3 Solder Volume:
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product height
Iron Soldering times:1 times max
Fig.2
Upper limit
Recommendable
t
7.Packaging Information
7-1. Reel Dimension
A
Type
13
.5
±0
.
A(mm)
9.0±0.5
13.5±0.5
B(mm)
60±2
60±2
C(mm)
13.5±0.5
13.5±0.5
D(mm)
178±2
178±2
2±0.5
5
D
B
0 .5
R1
5
R0.
C
R1
.9
7”x8mm
7”x12mm
120°
7"x8mm
7"x12mm
7-2.1 Tape Dimension / 8mm
Material of taping is paper
P
0
:4±0.1
E:1.75±0.1
.0
-0
.1
+0
5
1.
D:
W:8.0±0.3
t
F:3.5±0.05
B0
Size
060303
Bo(mm) Ao(mm) Ko(mm)
0.68±0.05 0.38±0.05
0.50max
P(mm)
2.0±0.05
t(mm)
0.50max
D1(mm)
none
P
A0
Ko
P
2
:2±0.1
E:1.75±0.1
P
0
:4±0.1
05
0.
1-
0.
+
56
1.
D:
W:8.0±0.1
t
Size
100505
160808
201209
Bo(mm) Ao(mm) Ko(mm)
1.12±0.03 0.62±0.03 0.60±0.03
1.85±0.05 1.05±0.05 0.95±0.05
2.30±0.05 1.50±0.05 0.95±0.05
P(mm)
2.0±0.10
4.0±0.10
4.0±0.10
t(mm)
0.60±0.03
0.95±0.05
0.95±0.05
D1(mm)
none
none
none
F:3.5±0.1
P
A0
B0
Ko
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