电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 

BAV99

器件型号:BAV99
器件类别:分立半导体    开关二极管   
文件大小:142KB,共8页
厂商:台湾美丽微(FMS)
FMS公司为领先业界的全球制造商与供货商,拥有半导体上下游整合与自有核心技术的优势,主要从事TVS、肖特基二极管、快恢复二极管、桥堆二极管、MOS功率半导体等分离式器件的研发及生产。FMS搭配洞察市场趋势的观察力,不断推出符合市场需求的薄型化封装。同时为布局产品细分市场及公司营销战略规划,MOS产品推出安邦半导体品牌(Anbon Semi),该品牌同为深圳市美丽微半导体所有。
厂商官网:http://www.formosagr.com/
下载文档 在线购买

BAV99在线购买

供应商 器件名称 价格 最低购买 库存  
BAV99 - - 点击查看 点击购买

器件描述

反向恢复时间(trr):6ns 直流反向耐压(Vr):70V 平均整流电流(Io):200mA 正向压降(Vf):1.25V @ 150mA

参数
参数名称属性值
反向恢复时间(trr)6ns
直流反向耐压(Vr)70V
平均整流电流(Io)200mA
正向压降(Vf)1.25V @ 150mA

BAV99产品介绍

SMD Switching Diode
BAL99/BAV99/BAW56/BAV70
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Thermal Characteristics ................................................................... 3
Electrical Characteristics.................................................................. 3
Rating and characteristic curves........................................................ 4
Pinning information...........................................................................5
Marking........................................................................................... 5
Suggested solder pad layout............................................................. 5
Packing information.......................................................................... 6
Reel packing.................................................................................... 7
Suggested thermal profiles for soldering processes............................. 7
High reliability test capabilities...........................................................8
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/11/29
Revision
C
Page.
8
Page 1
DS-221906
SMD Switching Diode
BAL99/BAV99/BAW56/BAV70
225mW Surface Mount
Switching Diode- 70V
Features
Fast speed switching.
For general purpose switching application.
High conductance.
Silicon epitaxial planar chip.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen-free part, ex.BAL99-H.
Formosa MS
Package outline
SOT-23
0.045 (1.15)
0.034 (0.85)
0.020 (0.50)
(C)
0.120 (3.04)
0.110 (2.80)
.084(2.10)
.068(1.70)
(B)
(A)
Mechanical data
Epoxy:UL94-V0 rated flame retardant
Case : Molded plastic, SOT-23
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.063 (1.60)
0.047 (1.20)
0.108 (2.75)
0.083 (2.10)
0.027 (0.67)
0.013 (0.32)
0.007 (0.18)
0.012 (0.30)
0.003 (0.09)
0.051 (1.30)
0.035 (0.89)
Mounting Position : Any
Weight : Approximated 0.008 gram
Dimensions in inches and (millimeters)
Maximum ratings
(AT T =25 C unless otherwise noted)
o
A
PARAMETER
Reverse Voltage
Forward Current
Peak Forward Surge Current
Non-Repetitive Peak Forward Surge Current
@ t=1.0us
@ t=1.0s
SYMBOL
BAL99
BAV99
70
215
500
2.0
1.0
BAW56
BAV70
UNIT
V
V
R
I
F
I
FM
I
FSM
100
200
mA
mA
A
Thermal Characteristics
PARAMETER
Total Device Dissipation FR-5
Board* , T
A
= 25 C
Derate Above 25 C
Thermal Resistance Junction to Ambient
Total Device Dissipation Alumina
Substrate* , T
A
= 25 C
Derate Above 25 C
Thermal Resistance Junction to Ambient
Operating Junction Temperature Range
Storage Temperature Range
1. FR-5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
O
2
O
O
1
O
SYMBOL
MAX.
225
1.8
UNIT
mW
mW/
O
C
O
P
D
R
θJA
P
D
R
θJA
T
J
T
STG
556
300
2.4
417
-55 ~ +150
-55 ~ +150
C/W
mW
mW/
O
C
O
C/W
o
C
C
o
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/11/29
Revision
C
Page.
8
Page 2
DS-221906
SMD Switching Diode
BAL99/BAV99/BAW56/BAV70
Electrical Characteristics
(AT T =25 C unless otherwise noted)
o
A
Formosa MS
MIN.
70
2.5
30
60
50
100
MAX.
UNIT
V
PARAMETER
Reverse Breakdown Voltage(I
BR
=100uAdc)
Reverse Voltage Leakage Current
O
(at V
R
= 70V, T
J
=25
C)BAL99/BAV99/BAW56/BAV70
(at V
R
= 25V, T
J
=150
O
C)BAL99/BAV99/BAW56
O
(at V
R
= 25V, T
J
=150
C)BAV70
O
(at V
R
= 70V, T
J
=150 C)BAL99/BAV99/BAW56
(at V
R
= 70V, T
J
=150
O
C)BAV70
Diode Capacition(V
R
= 0V, f = 1.0MHz)
BAL99/BAV99/BAV70
BAW56
Reverse Recovery Time(I
F
= I
R
= 10mA,V
R
= 5.0Vdc,
I
R
(REC) = 1.0mAdc, R
L
= 100
OHM
)
Forward Voltage
(at I
F
= 1.0mAdc)
(at I
F
= 10mAdc)
(at I
F
= 50mAdc)
(at I
F
= 150mAdc)
SYMBOL
V
BR
I
R
µA
C
D
1.5
2.0
6.0
715
855
1000
1250
pF
t
rr
ns
V
F
mV
Recovery Time Equivalent Test Circuit
820 OHM
+10V
2K
100uH
0.1 uF
I
F
t
rr
t
I
F
t
r
t
p
10%
t
0.1 uF
50 OHM OUTPUT
PULSE
GENERATOR
DUT
50 OHM INPUT
SAMPLING
OSCILLOSCOPE
90%
V
R
I
R
IR(REC)=1 mA
OUTPUT PULSE
(IF=IR=10mA;measured
at IR(REC)=1mA)
Notes :
1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA.
Notes:
Notes:
2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
3. tp >> trr.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/11/29
Revision
C
Page.
8
Page 3
DS-221906
Rating and characteristic curves for each diode (BAL99/BAV99/BAW56/BAV70)
FIG.1-TYPICAL FORWARD
CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT,(mA)
FIG.2 - TYPICAL REVERSE
CHARACTERISTICS
T
J
=150°C
REVERSE CURRENT, (uA)
T
J
=125°C
T
J
=85°C
T
J
=85°C
T
J
=25°C
T
J
=55°C
T
J
=-40°C
T
J
=25°C
FORWARD VOLTAGE,(V)
REVERSE VOLTAGE,(V)
FIG.3a - TYPICAL DIODE CAPACITANCE
BAL99/BAV99/BAV70
FIG.3b - TYPICAL DIODE CAPACITANCE
BAW56
DIODE CAPACITANCE,(pF)
REVERSE VOLTAGE,(V)
DIODE CAPACITANCE,(pF)
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/11/29
Revision
C
Page.
8
Page 4
DS-221906
SMD Switching Diode
BAL99/BAV99/BAW56/BAV70
Pinning information
Type number
BAL99
Marking code
L4, A6,JF
(C)
(A)
(B)
Formosa MS
Symbol
A
B
Simplified outline
(A)
(B)
C
A
B
BAV99
JG, A7
(C)
(A)
(B)
C
A
B
BAW56
JC, A1
(C)
(A)
(B)
C
A
B
BAV70
JA, A4
(C)
C
Suggested solder pad layout
SOT-23
0.037(0.95)
0.037(0.95)
0.079(2.0)
0.035(0.90)
0.031(0.80)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/11/29
Revision
C
Page.
8
Page 5
DS-221906
阻抗匹配集
带有阻抗和导纳圈的史密斯圆图[attach]686290[/attach] 高速PCB设计为什么要控制阻抗匹配原理图——HDMI这些电阻是做阻抗匹配还是扛静电用的?天线阻抗匹配与极宽带天线的设计天线阻抗匹配与极宽带天线的设计微带传输线阻抗匹配工程实例阻抗匹配基本原理及设计方法阻抗匹配原理功率放大器的阻抗匹配阻抗匹配与史密斯(Smith...
btty038 RF/无线
海思Hi3516EV200/Hi3518EV300资料
Hi3516EV200 经济型HD IP Camera SoC主要特点处理器内核 ARM Cortex A7@ 900MHz,32KB I-Cache,32KB DCache/128KB L2 cache 支持 Neon 加速,集成FPU 处理单元视频编码 H.264 BP/MP/HP,支持I/P 帧 H.265 Main Profile,支持I/P...
littleshrimp 国产芯片交流
另类的PCB制作。
几年前,还是比较清闲的时候,经常自己做电路板,哦,突然想起来刚毕业的时候,从那时起就不断尝试各种方法。从做好的美纹纸焊盘、线条到热转印(更粗糙的办法就不用说了),满意的只有热转印,但热转印还是差了些,而且时常出点问题。至于雕刻方式,从来也没试验过,看到网上贴的一些图,感觉精度并不高,至少比不上热转印。那时候因为经常访问国外网站,也经常搜索相关的信息,偶尔看到...
huayuliang 创意市集
片子又烧了,请哪位大哥指点使用注意的地方啊!谢谢
片子又烧了,请哪位大哥指点使用注意的地方啊!哪些地方需要注意,望指点啊!谢谢...
wn1983 模拟与混合信号
辩论--房价会涨还是会降?说说你的看法
呵呵,房价这个话题是最近几年最火爆的话题了,这几年的房价是“蹭、蹭、蹭”的翻着跟头上涨,总有人再喊房价太高了,国家也是隔三差五就出台调控政策:遏制房价过快上涨!但是房价还是一个劲地“升升不息”!几年国家又出台了号称是有史以来最严厉的调控政策。于是又有人开始说房价要降了。但事实如何呢?据最新消息,房价其实没降,只是销量有所下降而已。何况国家从来也没有明确说“房...
tiankai001 聊聊、笑笑、闹闹
关于VC中的Slider控件,如何实现点击某处后,滑块便移到此处,而不是一格一格的跳?
如题最好用API实现,有MFC版的也可以参考谢谢!...
better 嵌入式系统
小广播

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2023 EEWORLD.com.cn, Inc. All rights reserved