SPC574S60E3, SPC574S64E3
32-bit Power Architecture microcontroller for automotive ASILD
applications
Datasheet
-
production data
– Cyclic redundancy check (CRC) unit
•
8 enhanced 12-bit SAR analog converters
– 2 sets of: 3 ADCs and one supervisor ADC
– 1.5 µs conversion time at 12 MHz
– Up to 32 physical channels
– Dual Programmable CTU
•
4 general purpose eTimer units (6 channels
each)
•
4 FlexPWM units
– 2 (4 channels each) used for motor control
with hardware synchronization between the
control systems
– 2 (2 channels each) used for SWG
emulation
•
Communication interfaces
– 4 LINFlexD modules
– 4 deserial serial peripheral interface (DSPI)
modules
– 2 MCAN interfaces with advanced shared
memory scheme (808 x 32-bit words for
MCAN0 and 520 x 32-bit words for
MCAN1) and CAN-FD support
– 1 FlexRay module with 2 channels, 128
message buffers
– 2 SENT interfaces (3 channels each)
•
Dual phase-locked loops with stable clock
domain for peripherals and FM modulation
domain for computational shell
•
Nexus Class 3 debug and trace interface
•
On-chip CAN/UART Bootstrap loader with
BAF. Physical Interface (PHY) can be UART
•
Advanced and flexible supply scheme
– On-chip voltage regulator for 1.2 V core
logic supply. Bypass mode supported for
external 1.2 V core logic supply
– 3.3 V or 5 V IO and ADC supply (2
independent power domains available)
•
Junction temperature range -40 °C to 150 °C
eTQFP100 (14 x 14 x 1.0 mm)
Features
•
AEC-Q100 qualified
•
High performance e200z4d dual core
– 32-bit Power Architecture technology CPU
– Core frequency as high as 140 MHz
– Dual issue 5-stage pipeline in-order
execution core
– Variable Length Encoding (VLE)
– Core MPU
– Floating Point, End-to-End Error Correction
– 8 KB instruction cache with error detection
code
– 32 KB local data RAM and 4 KB data cache
along with 8 KB instruction cache
•
1600 KB (1.5 MB code + 64 KB data) on-chip
flash memory: supports read during program
and erase operations, and multiple blocks
allowing EEPROM emulation
•
128 KB on-chip RAM (96 KB on chip
RAM + 32 KB local data RAM)
•
Multi-channel direct memory access controller
(eDMA) with 32 channels
•
Comprehensive new generation ASILD safety
concept
– ASILD SEooC approach (Safety Element
out of Context)
– FCCU for collection and reaction to failure
notifications
– Memory Error Management Unit (MEMU)
for collection and reporting of error events
in memories
– End-to-end Error Correction Code
(e2eECC) logic
February 2020
This is information on a product in full production.
DS10601 Rev 6
1/77
www.st.com
Contents
SPC574Sx
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1
1.2
1.3
1.4
Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Feature overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 13
2.1
2.2
2.3
Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package pads/pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Electromagnetic compatibility (EMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7.1
3.7.2
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8
3.9
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
I/O pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.9.1
3.9.2
3.9.3
I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.10
3.11
RESET electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.11.1
3.11.2
3.11.3
3.11.4
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Voltage regulator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . 39
Power Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Decoupling capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2/77
DS10601 Rev 6
SPC574Sx
3.11.5
Contents
Power management electrical characteristics . . . . . . . . . . . . . . . . . . . . 47
Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Power up/down sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.12
PMU monitor specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.12.1
3.12.2
3.13
3.14
3.15
3.16
3.17
3.18
Platform Flash controller configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Flash memory electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 50
PLL0/PLL1 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
External oscillator (XOSC) electrical characteristics . . . . . . . . . . . . . . . . 54
Internal RC oscillator (16 MHz) electrical characteristics . . . . . . . . . . . . . 57
ADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
3.18.1
3.18.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
ADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.19
3.20
3.21
3.22
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
JTAG interface timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Nexus interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
DSPI CMOS master mode timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.22.1
3.22.2
Classic timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Modified timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4.1
4.2
eTQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
eTQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
5
6
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
DS10601 Rev 6
3/77
3
Introduction
SPC574Sx
1
1.1
Introduction
Document overview
This document describes the features of the family and options available within the family
members, and highlights important electrical and physical characteristics of the device. To
ensure a complete understanding of the device functionality, refer also to the device
reference manual and errata sheet.
1.2
Description
The SPC574Sx is a family of next generation microcontrollers built on the Power
Architecture embedded category.
The SPC574Sx family of 32-bit microcontrollers is the latest achievement in integrated
automotive application controllers. It belongs to an expanding family of automotive-focused
products designed to address the next wave of Chassis and Safety electronics applications
within the vehicle. The advanced and cost-efficient host processor core of this automotive
controller family complies with the Power Architecture embedded category and only
implements the VLE (variable-length encoding) APU, providing improved code density. It
operates at speeds of up to 140 MHz and offers high performance processing optimized for
low power consumption. It capitalizes on the available development infrastructure of current
Power Architecture devices and is supported with software drivers, operating systems and
configuration code to assist with users implementations.
Table 1. SPC574Sx device feature summary (superset configuration)
Feature
Main Core
Checker core
Local data RAM
Description
e200z420n3
e200z419
32 KB Data
Yes
140 MHz
8 KB
4 KB
1
1
1 AUTOSAR
®
STM
1 PIT with eight 16-bit channels
1
32
Yes (8 regions)
96 KB
1.5 MB
Processor
VLE
Main processor frequency
Instruction cache
Data cache
Interrupt controller (including interrupt controller checker)
Software watchdog timer
System timers
DMA (including DMA checker)
DMA channels
SMPU
System SRAM (in addition to core local data RAM)
Code Flash memory
4/77
DS10601 Rev 6
SPC574Sx
Introduction
Table 1. SPC574Sx device feature summary (superset configuration) (continued)
Feature
Data Flash memory (EEPROM)
UTEST Flash memory
Boot assist Flash (BAF)
CRC
LINFlexD
DSPI
MCAN
FlexRay
SENT
FlexPWM
eTimer
ADC (SAR)
CTU (Cross Triggering Unit)
Temperature sensor
Self-test control unit (memory and logic BIST)
FCCU
MEMU
RCOSC
XOSC
PIT
STM
PLL
Nexus
Sequence processing unit (SPU)
External power supplies
Junction temperature
Package
Description
64 KB
16 KB
16 KB
1
4
4
2
1 (128 MB)
2 x 3 channels
2 x 4 channels (for motor control) +
2 x 2 channels (for SWG emulation via PWM)
4 x 6 channels
8
2
2
1
1
1
1
1
1 x 8 channels
1
Dual PLL with FM
3
(1)
1
Single supply mode: 3.3 V or 5 V
-40 °C to 150 °C
eTQFP100
1. Including trace for the crossbar masters (data & instruction trace on core and data trace on eDMA). 4 MDO pins Nexus
trace port.
Table 2. SPC574S60Ex, SPC574S64Ex device configuration differences
SPC574S60
(full option configuration)
Flash
RAM
1 MB
(1)
96 KB
(2)
SPC574S64
(full option configuration)
1.5 MB
128 KB
DS10601 Rev 6
5/77
76
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