SPECIFICATION
· Supplier : Samsung electro-mechanics
· Product : Multi-layer Ceramic Capacitor
· Samsung P/N :
· Description :
(Reference sheet)
CL10A225KQ8NNWC
CAP, 2.2㎌, 6.3V, ±10%, X5R, 0603
A. Samsung Part Number
CL
①
10
②
A
③
225
④
K
⑤
Q
⑥
8
⑦
N
⑧
N
⑨
W
⑩
C
⑪
①
Series
②
Size
③
Dielectric
④
Capacitance
⑤
Capacitance
tolerance
⑥
Rated Voltage
⑦
Thickness
Samsung Multi-layer Ceramic Capacitor
0603 (inch code)
L :
1.60±0.10㎜
X5R
2.2㎌
±10%
6.3V
0.80±0.10㎜
⑧
Inner electrode
Termination
Plating
Product
Special
Packaging
W:
0.80±0.10㎜
Ni
Cu
Ni/Sn 100%
(Pb Free)
⑨
⑩
⑪
Normal
Industrial (Network,Power,etc)
Cardboard Type, 7" Reel / Quantity : 4K
B. Structure & Dimension
2.2㎌
Dimension(㎜)
Samsung P/N
L
CL10A225KQ8NNWC
1.60±0.10
W
0.80±0.10
T
0.80±0.10
BW
0.30±0.20
C. Samsung Reliablility Test and Judgement Condition
Judgement
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Within specified tolerance
0.1 max.
10,000Mohm or 100Mohm×㎌
1㎑±10% / 1.0±0.2Vrms
*A capacitor prior to measuring the capacitance is heat
treated at 150℃+0/-10℃ for 1hour and maintained in
ambient air for 24±2 hours.
Rated Voltage 60~120 sec
Test condition
Whichever is smaller
No abnormal exterior appearance
Microscope (×10)
No dielectric breakdown or
250% of the rated voltage
mechanical breakdown
X5R
(From -55℃ to 85℃, Capacitance change should be within ±15%)
No peeling shall be occur on the
terminal electrode
Capacitance change : within ±10%
500g·f, for 10±1 sec.
Bending to the limit (1mm)
with 1.0mm/sec. (2mm bending outgoing test)
SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Solder pot : 270±5℃, 10±1sec.
Amplitude : 1.5mm
From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
With rated voltage
65±2℃,90±5%RH, 500hrs+12/-0hrs
Solderability
More than 75% of terminal surface
is to be soldered newly
Resistance to
Soldering Heat
Vibration Test
Capacitance change : within ±7.5%
Tan δ, IR : initial spec.
Capacitance change : within ±5%
Tan δ, IR : initial spec.
Moisture
Resistance
Capacitance change : within ±12.5%
Tan δ : 0.125 max.
IR : 500Mohm or 12.5Mohm×㎌
Whichever is smaller
Capacitance change : within ±12.5%
Tan δ : 0.125 max.
IR : 1,000Mohm or 25Mohm×㎌
Whichever is smaller
Capacitance change : within ±7.5%
Tan δ, IR : initial spec.
High Temperature
Resistance
With 150% of the rated voltage
Max. operating temperature
1,000+48/-0hrs
1 cycle condition
Min. operating temperature
→
Max. operating temperature
5 cycle test
Temperature
Cycling
→
→
25℃
25℃
※
The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260±5℃, 30sec. )
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
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