AT24CS01/AT24CS02
I²C-Compatible (Two-Wire) Serial EEPROM with a Unique,
Factory-Programmed 128-Bit Serial Number
1‑Kbit (128 x 8), 2‑Kbit (256 x 8)
Features
•
•
•
Low-Voltage Operation:
– V
CC
= 1.7V to 5.5V
Internally Organized as 128 x 8 (1K) or 256 x 8 (2K)
128-Bit Unique Factory-Programmed Serial Number
– Permanent read-only value
– Unique across entire CS Series of Serial EEPROMs
Industrial Temperature Range: -40°C to +85°C
I
2
C-Compatible (Two-Wire) Serial Interface:
– 100 kHz Standard mode, 1.7V to 5.5V
– 400 kHz Fast mode, 1.7V to 5.5V
– 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
Schmitt Triggers, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
Write-Protect Pin for Full Array Hardware Data Protection
Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum)
8-Byte Page Write Mode:
– Partial page writes allowed
Random and Sequential Read Modes
Self-Timed Write Cycle within 5 ms Maximum
ESD Protection > 4,000V
High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years
Green Package Options (Lead-free/Halide-free/RoHS compliant)
Die Sale Options: Wafer Form and Tape and Reel Available
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•
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•
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Packages
•
8-Lead SOIC, 8-Lead TSSOP, 8-Pad UDFN and 5-Lead SOT23
©
2020 Microchip Technology Inc.
Datasheet
DS20006330A-page 1
AT24CS01/AT24CS02
Table of Contents
Features......................................................................................................................................................... 1
Packages........................................................................................................................................................1
1.
2.
Package Types (not to scale)..................................................................................................................4
Pin Descriptions...................................................................................................................................... 5
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
3.
Device Address Inputs (A0, A1, A2).............................................................................................5
Ground......................................................................................................................................... 5
Serial Data (SDA).........................................................................................................................5
Serial Clock (SCL)........................................................................................................................5
Write-Protect (WP)....................................................................................................................... 5
Device Power Supply (V
CC
)......................................................................................................... 6
Description.............................................................................................................................................. 7
3.1.
3.2.
System Configuration Using Two-Wire Serial EEPROMs ........................................................... 7
Block Diagram.............................................................................................................................. 8
4.
Electrical Characteristics.........................................................................................................................9
4.1.
4.2.
4.3.
4.4.
4.5.
Absolute Maximum Ratings..........................................................................................................9
DC and AC Operating Range.......................................................................................................9
DC Characteristics....................................................................................................................... 9
AC Characteristics......................................................................................................................10
Electrical Specifications..............................................................................................................11
5.
Device Operation and Communication................................................................................................. 12
5.1.
5.2.
5.3.
5.4.
5.5.
Clock and Data Transition Requirements...................................................................................12
Start and Stop Conditions.......................................................................................................... 12
Acknowledge and No-Acknowledge...........................................................................................13
Standby Mode............................................................................................................................ 13
Software Reset...........................................................................................................................13
6.
Memory Organization............................................................................................................................15
6.1.
Device Addressing..................................................................................................................... 15
7.
Write Operations................................................................................................................................... 16
7.1.
7.2.
7.3.
7.4.
7.5.
Byte Write...................................................................................................................................16
Page Write..................................................................................................................................16
Acknowledge Polling.................................................................................................................. 17
Write Cycle Timing..................................................................................................................... 17
Write Protection..........................................................................................................................18
8.
Read Operations................................................................................................................................... 19
8.1.
8.2.
8.3.
8.4.
Current Address Read................................................................................................................19
Random Read............................................................................................................................ 19
Sequential Read.........................................................................................................................20
Serial Number Read...................................................................................................................20
©
2020 Microchip Technology Inc.
Datasheet
DS20006330A-page 2
AT24CS01/AT24CS02
9.
Device Default Condition from Microchip.............................................................................................. 22
10. Packaging Information.......................................................................................................................... 23
10.1. Package Marking Information.....................................................................................................23
11. Revision History.................................................................................................................................... 35
The Microchip Website.................................................................................................................................36
Product Change Notification Service............................................................................................................36
Customer Support........................................................................................................................................ 36
Product Identification System.......................................................................................................................37
Microchip Devices Code Protection Feature................................................................................................ 37
Legal Notice................................................................................................................................................. 38
Trademarks.................................................................................................................................................. 38
Quality Management System....................................................................................................................... 39
Worldwide Sales and Service.......................................................................................................................40
©
2020 Microchip Technology Inc.
Datasheet
DS20006330A-page 3
AT24CS01/AT24CS02
Package Types (not to scale)
1.
Package Types (not to scale)
8-lead SOIC/TSSOP
(Top View)
A0
A1
A2
GND
1
2
3
4
8
7
6
5
Vcc
WP
SCL
SDA
SCL
GND
SDA
5-lead SOT23
(1)
(Top View)
1
2
3
4
Vcc
5
WP
8-pad UDFN
(Top View)
A0
A1
A2
GND
1
2
3
4
8
7
6
5
Vcc
WP
SCL
SDA
Note:
1. Refer to
Device Addressing
for details about addressing the SOT23 version of the device.
©
2020 Microchip Technology Inc.
Datasheet
DS20006330A-page 4
AT24CS01/AT24CS02
Pin Descriptions
2.
Pin Descriptions
The descriptions of the pins are listed in
Table 2-1.
Table 2-1. Pin Function Table
Name
A0
(2)
A1
(2)
A2
(2)
GND
SDA
SCL
WP
(2)
V
CC
8-Lead SOIC
1
2
3
4
5
6
7
8
8-Lead TSSOP
1
2
3
4
5
6
7
8
5-Lead SOT23
－
－
－
2
3
1
5
4
8-Pad UDFN
(1)
1
2
3
4
5
6
7
8
Function
Device Address Input
Device Address Input
Device Address Input
Ground
Serial Data
Serial Clock
Write-Protect
Device Power Supply
Note:
1. The exposed pad on this package can be connected to GND or left floating.
2. If the A0, A1, A2 or WP pins are not driven, they are internally pulled down to GND. In order to operate in a
wide variety of application environments, the pull-down mechanism is intentionally designed to be somewhat
strong. Once these pins are biased above the CMOS input buffer’s trip point (~0.5 x V
CC
), the pull‑down
mechanism disengages. Microchip recommends connecting these pins to a known state whenever possible.
2.1
Device Address Inputs (A0, A1, A2)
The A0, A1 and A2 pins are device address inputs that are hard-wired (directly to GND or to V
CC
) for compatibility
with other two-wire Serial EEPROM devices. When the pins are hard-wired, as many as eight devices may be
addressed on a single bus system. A device is selected when a corresponding hardware and software match is true.
If these pins are left floating, the A0, A1 and A2 pins will be internally pulled down to GND. However, due to
capacitive coupling that may appear in customer applications, Microchip recommends always connecting the address
pins to a known state. When using a pull‑up resistor, Microchip recommends using 10 kΩ or less.
2.2
Ground
The ground reference for the power supply. GND should be connected to the system ground.
2.3
Serial Data (SDA)
The SDA pin is an open-drain bidirectional input/output pin used to serially transfer data to and from the device. The
SDA pin must be pulled high using an external pull-up resistor (not to exceed 10 kΩ in value) and may be wire-ORed
with any number of other open-drain or open-collector pins from other devices on the same bus.
2.4
Serial Clock (SCL)
The SCL pin is used to provide a clock to the device and to control the flow of data to and from the device. Command
and input data present on the SDA pin is always latched in on the rising edge of SCL, while output data on the SDA
pin is clocked out on the falling edge of SCL. The SCL pin must either be forced high when the serial bus is idle or
pulled high using an external pull-up resistor.
2.5
Write-Protect (WP)
The write-protect input, when connected to GND, allows normal write operations. When the WP pin is connected
directly to V
CC
, all write operations to the protected memory are inhibited.
©
2020 Microchip Technology Inc.
Datasheet
DS20006330A-page 5
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