AS5013
Low Power Integrated Hall IC for
Human Interface Applications
General Description
The AS5013 is a complete Hall Sensor IC for smart navigation
key applications to meet the low power requirements and host
SW integration challenges for products such as cell phones and
smart handheld devices.
Due to the on chip processing engine, system designers are not
tasked with integrating complex SW algorithms on their host
processor thus leading to rapid development cycles.
The AS5013 single-chip IC includes 5 integrated Hall sensing
elements for detecting up to ±2mm lateral displacement, high
resolution ADC, XY coordinate and motion detection engine
combined with a smart power management controller.
The X and Y positions coordinates and magnetic field
information for each Hall sensor element is transmitted over a
2-wire I²C compliant interface to the host processor.
The AS5013 is available in a small 16-pin 4mmx4mmx0.55mm
QFN package and specified over an operating temperature of
-20°C to 80°C
Ordering Information
and
Content Guide
appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5013, Low Power Integrated Hall
IC for Human Interface Applications are listed below:
Figure 1:
Added Value of Using AS5013
Benefits
•
Lateral magnet movement radius up to 2mm
•
Fast and simple interface integration
•
Automatic low-power-mode
•
Low operating voltage supply
•
Contactless push-button possible
•
Small package, lower cost
•
Push button and Motion detection
•
Insensitive to external magnetic stray fields
Features
•
8-bit resolution in X and Y direction
•
High-speed I²C interface
•
3μA current consumption in stand by
•
2.7V to 3.6V operating voltage - Down to 1.7V
peripheral supply voltage
•
12-bit raw hall output
•
QFN4x4 package
•
Various interrupt modes available
ams Datasheet
[v2-00] 2021-Apr-19
Page 1
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AS5013 −
Pin Assignments
Pin Assignments
Figure 3:
Pin Diagram (Top View)
MODE OTP
PDIO OTP
16
SDA
SCL
RESETn
INTn
1
2
3
4
5
TB0
PCLK
15
6
TB1
VSS
VDDp
13
14
12
VDD
11
VDDp
Epad
10
ADDR
9
7
TB2
8
TB3
TEST COIL
Figure 4:
Pin Descriptions
Pin
Number
1
2
3
Pin Name
SDA
SCL
Pin Type
Digital I/O /Open drain
ESD
2kV
2kV
Description
I²C data line, open drain
I²C clock line
General reset input
0: Reset
1: Normal mode
Interrupt line, open drain, active
low
Digital input
RESETn
2kV
4
5
6
7
8
9
10
INTn
TB0
TB1
Digital output open drain
2kV
2kV
2kV
Analog I/O
TB2
TB3
TEST COIL
ADDR
Special
Digital input with Schmitt
trigger functionality
2kV
2kV
2kV
2kV
Test pin, leave unconnected
Test pin, leave unconnected or
connect to VSS
I²C address selection input. Read
in at each reset
ams Datasheet
[v2-00] 2021-Apr-19
Page 3
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AS5013 −
Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed in
Figure 5
may cause permanent
damage to the device. These are stress ratings only, and
functional operation of the device at these or any other
conditions beyond those indicated in
Operating Conditions
is
not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
VDDp
DC supply voltage
Peripheral supply
voltage
Input pin voltage
-
I
scr
Input current (latchup
immunity)
±100
Electrostatic Discharge
ESD
Θ
JA
Electrostatic discharge
Package thermal
resistance
-
±2
32
kV
K/W
MIL 883 E method 3015,
direct pad contact
Velocity=0, Multi Layer PCB;
JEDEC Standard Testboard
3.6
V
mA
JEDEC 78
-0.3
-0.3
-0.3
Vin
5
5
VDD +0.3
VDDp +0.3
V
V
V
Temperature Ranges and Storage Conditions
T
strg
T
body
RH
NC
MSL
Storage temperature
Package body
temperature
Humidity
non-condensing
Moisture Sensitive Level
5
3
-55
125
260
85
°C
°C
%
Represents a maximum floor
life time of 168h
IPC/JEDEC J-STD-020
(1)
Note(s):
1. The reflow peak soldering temperature (body temperature) specified is in accordance with
IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”.The
lead finish for
Pb-free leaded packages is matte tin (100% Sn).
ams Datasheet
[v2-00] 2021-Apr-19
Page 5
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